• Journal of information and communication convergence engineering
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• 제4권3호
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• pp.105-107
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• 2006

Amorphous silicon is a kind of optical to electric conversion material with current or voltage type after generating a numerous free electron and hole when it is injected by light. It is very effective technology to make schottky diode by bonding thin film to use optical diode. In this paper, we have fabricated optical diode device by forming chrome silicide film through thermal processing with thin film($100{\AA}$) having optimal amorphous silicon. The optimal condition is that we make a thin film by using PECVD(Plasma Enhanced Chemical Vapor Deposition) to improve reliability and characteristics of optical diode. We have obtained high quality diode by using chrome silicide optical diode from dark current and optical current measurement compared to previous method. It makes a simple process and improves a good reliability.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.111-112
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• 2007

Silicon nitride (SiN) 박막을 플라즈마 응용화학기상법을 이용하여 증착하였다. SiN박막의 전하밀도는 일반화된 회귀 신경망과 유전자 알고리즘을 이용하여 모델링하였다. PECVD 공정은 Box Wilson 실험계획표를 이용하여 수행하였다. $SiH_4$ 유량변화에 따른 온도의 영향은 미미하였다. 그러나, 저 전력에서의 온도증가 (또는 저온에서의 전력의 증가)에 따라 전하밀도는 급격히 상승하였으며, 이는 [N-H]의 증가에 기인하는 것으로 해석되었다. $SiH_4$ 유량의 증가 (또는 고온에서의 전력의 증가)에 따라 전하밀도는 감소하고 있으며, 이는 [Si-H]의 증가에 기인하는 것으로 이해된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.328-331
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• 2004

Hot filament 플라즈마 화학기상 증착법(HFPECVD)를 사용하여 질산화철의 농도에 따른 탄소나노튜브의 성장 특성을 관찰하기 위해 실험을 진행하였다. 암모니아($NH_3$)를 희석가스로 사용하였고, 아세틸렌($C_2H_2$)를 탄소 원료가스로 각각 사용하였다. 암모니아 가스 플라즈마를 사용하여 전처리 된 질산화철 촉매층의 SEM(Scanning Electron Microscopy) 이미지를 관찰하여 본 결과, 나노 사이즈의 촉매 그레인(grain)을 발견할 수 있었다. 그리고 탄소 나노튜브의 직경과 성장 밀도 또한 전처리 된 촉매 층에 따라 다른 양상을 보였다. TEM(Transmission Electron Microscopy)를 사용하여 탄소나노튜브를 관찰한 결과 bamboo 구조를 한 다중벽 탄소 나노튜브(MWCNT)를 관찰할 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.363-363
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• 2010

The high capillarity of a plastic fiber network having superhydrophilic Si-DLC coating is studied. Although the superhydrophilic surface maximize wetting ability on the flat surface, there remains a requirement for the more wettable surface for various applications such as air-filters or liquid-filters. In this research, the PET non-woven fabric surface was realized by superhydrophilic coating. PTE non-woven fabric network was chosen due to its micro-pore structure, cheap price, and productivity. Superhydrophobic fiber network was prepared with a coating of oxgyen plasma treated Si-DLC films using plasma-enhanced chemical vapor deposition (PECVD). We first fabricated superhydrophilic fabric structure by using a polyethylene terephthalate (PET) non-woven fabric (NWF) coated with a nanostructured films of the Si-incorporated diamond-like carbon (Si-DLC) followed by the plasma dry etching with oxygen. The Si-DLC with oxygen plasma etching becomes a superhydrophilic and the Si-DLC coating have several advantages of easy coating procedure at room temperature, strong mechanical performance, and long-lasting property in superhydrophilicity. It was found that the superhydrophobic fiber network shows better wicking ability through micro-pores and enables water to have much faster spreading speed than merely superhydrophilic surface. Here, capillarity on superhydrophilic fabric structure is investigated from the spreading pattern of water flowing on the vertical surface in a gravitational field. As water flows on vertical flat solid surface always fall down in gravitational direction (i.e. gravity dominant flow), while water flows on vertical superhydrophilic fabric surface showed the capillary dominant spreading.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.51-55
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• 2011

The surface passivation is one of the important methods that can improve the efficiency of solar cells and can be classified into two methods: wet-chemical passivation and film passivation. In this paper, chemical HF treatment were employed for the passivation of n-type silicon wafers and their effects were studied. To investigate film passivation effects, the silicon nitride films were also deposited by PECVD (plasma-enhanced chemical vapor deposition) on n-type silicon wafers treated with chemical HF. The minority carrier lifetime measurements were used for evaluation of the passivation characteristics in the all experiments steps. We confirmed that the minority carrier lifetime was improved with chemical HF treatment due to passivation effects by H-termination.

• 한국진공학회지
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• 제19권5호
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• pp.331-340
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• 2010

초고주파 다중 중공 음극 방전을 이용한 플라즈마 화학 기상 증착 장치를 3차원 수치 모델링하였다. 기본적인 방전 특성을 파악하기 위하여 알곤 플라즈마를 40 MHz, 100 V, 133.3 Pa (1 Torr)의 조건에 대해서 계산하였다. 6 mm 직경의 홀을 20 mm 간격으로 배열하였고 전극 간격은 10 mm를 가정하였다. 피크 플라즈마 밀도는 홀의 하부 중앙에서 $5{\times}10^{11}#/cm^3$ 였으며 전자 온도는 접지 상태로 가정한 기판과 챔버 벽면 주위에서 가장 높았다. 준안정 상태에 의한 2단 이온화 속도는 전자 충돌에 의한 직접 이온화보다 10배 가량 높았다. 수소에 대한 계산에서는 이온화 이외의 다양한 에너지 소모 경로가 있어서 방전의 국재화가 잘 이루어지지 않았다.

• 한국표면공학회지
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• 제34권5호
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• pp.503-509
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• 2001

Thin films of hydrogenated amorphous silicon (a-Si : H) and hydrogenated amorphous silicon carbide (a-SiC:H) of different compositions were deposited on Si(100) wafer and glass by RF plasma-enhanced chemical vapor deposition (RF-PECVD). In the present work, we have investigated the effects of the RF power on the properties, such as optical band gap, transmittance and crystallinity. The Raman data show that the a-Si:H material consists of an amorphous and crystalline phase for the co-presence of two peaks centered at 480 and $520 cm^{-1}$ . The UV-VIS data suggested that the optical energy band gap ($E_{g}$ ) is not changed effectively with RF power and the obtained $E_{g}$(1.80eV) of the $\mu$c-Si:H thin film has almost the same value of a-Si:H thin film (1.75eV), indicating that the crystallity of hydrogenated amorphous silicon thin film can mainly not affected to their optical properties. However, the experimental results have shown that$ E_{g}$ of the a-SiC:H thin films changed little on the annealing temperature while $E_{g}$ increased with the RF power. The Raman spectrum of the a-SiC:H thin films annealed at high temperatures showed that graphitization of carbon clusters and microcrystalline silicon occurs.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.185-185
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• 2009

The aligned liquid crystals (LCs) display on SiNx thin films using ion-beam (IB) irradiation was studied with controllability ofpretilt angle depending on incident energies of the IB. Plasma-enhanced chemical vapor deposition (PECVD) was used to orient the LCs on SiNx alignment films. The LCs alignment property for the SiNx thin films were observed to verify the practical application potential (figure1). A good LCs alignment of vertical alignment LCs cells on SiNx thin film surfaces irradiated with incident IB energy of 1800eV was achieved. Also, a good LC alignment by the IB irradiation on the SiNx thin film surface was observed at an annealing temperature of $180^{\circ}C$. However, the alignment defects of the nematic liquid crystal was observed at an annealing temperature above $230^{\circ}C$. The atomic force microscopy (AFM) images of LCs on SiNx thin film surfaces irradiated with IB energy was used for the surface analysis.

• 한국재료학회지
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• 제28권4호
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• pp.247-253
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• 2018

We examined the characteristics of indium tin zinc oxide (ITZO) thin film transistors (TFTs) on polyimide (PI) substrates for next-generation flexible display application. In this study, the ITZO TFT was fabricated and analyzed with a SiOx/SiNx gate insulator deposited using plasma enhanced chemical vapor deposition (PECVD) below $350^{\circ}C$. X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS) results revealed that the oxygen vacancies and impurities such as H, OH and $H_2O$ increased at ITZO/gate insulator interface. Our study suggests that the hydrogen related impurities existing in the PI and gate insulator were diffused into the channel during the fabrication process. We demonstrate that these impurities and oxygen vacancies in the ITZO channel/gate insulator may cause degradation of the electrical characteristics and bias stability. Therefore, in order to realize high performance oxide TFTs for flexible displays, it is necessary to develop a buffer layer (e.g., $Al_2O_3$) that can sufficiently prevent the diffusion of impurities into the channel.

• Transactions on Electrical and Electronic Materials
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• 제6권4호
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• pp.177-185
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• 2005

Fatigue characteristics of lead zirconate titanate (PZT) films deposited by electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) were investigated. The fatigue characteristics were investigated with respect to PZT film thickness, domain structure, fatigue pulse height, temperature, electrode materials and electrode configurations. The used top and bottom electrode materials were Pt and $RuO_2$. In the fatigue characteristics with fatigue pulse height and PZT film thickness, the fatigue rates are independent of the applied fatigue pulse height at the electric field regions to saturate the P-E hysteresis and polarization $(P^*,\;P^A)$ characteristics. The unipolar and bipolar fatigue characteristics of PZT capacitors with four different electrode configurations $(Pt//Pt,\;Pt//RuO_2,\;RuO_2//Pt,\;and\;RuO_2//RuO_2)$ were also investigated. The polarization-shifts during the unipolar fatigue and the temperature dependence of fatigue rate suggest that the migration of charged defects should not be expected in our CVD-PZT films. It seems that the polarization degradations are attributed to the formation of charged defects only at the Pt/PZT interface during the domain switching. The charged defects pin the domain wall at the vicinity of Pt/PZT interface. When the top and bottom electrode configurations are of asymmetric $(Pt//RuO_2,\;RuO_2//Pt)$, the internal fields can be generated by the difference of charged defect densities between top and bottom interfaces.