• Title/Summary/Keyword: PECVD(Plasma enhanced vapor deposition)

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Growth of Carbon Nanotubes at Low temperature by HF-PECVD (Hot-filament 화학기상증착법을 이용한 탄소나노튜브의 저온 성장)

  • Chang, Yoon-Jung;Choi, Eun-Chang;Park, Yong-Seob;Choi, Won-Seok;Hong, Byung-You
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.151-152
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    • 2007
  • 탄소나노튜브(CNTs)는 우수한 물리적, 화학적, 기계적 특성으로 다양한 분야에서 연구가 진행 되고있다. 특히, field emission displays (FEDs)로의 응용을 위해서는 기본적으로 sodalime glass 위에 직접 CNTs를 성장시켜야 하며, 소자 응용을 위해 기판인 sodalime glass를 왜곡시키는 온도보다 낮은 온도에서 CNT의 수직 성장이 이루어져야 한다. 본 연구에서는 Hot-filament plasma enhanced chemical vapor deposition (HF-PECVD)를 이용하여 합성온도를 400, 450, 500, $550^{\circ}C$로 변화시켰으며 촉매 층인 Ni의 두께를 5~40 nm까지 조절하여 탄소나노튜브를 합성하였다. 저온에서 합성된 탄소나노튜브는 FE-SEM을 이용하여 성장 형태 및 표면 특성을 확인하였으며, 미세구조는 HR-TEM을 이용하여 확인하였다.

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Characteristics of Linear Microwave Plasma Using the Fluid Simulation and Langmuir Probe Diagnostics

  • Seo, Gwon-Sang;Han, Mun-Gi;Yun, Yong-Su;Kim, Dong-Hyeon;Lee, Hae-Jun;Lee, Ho-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.158.1-158.1
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    • 2013
  • Microwave는 일반적으로 300 [MHz]~30 [GHz] 사이의 주파수를 가지는 전파로 1 [m] 이하의 파장을 가진다. Microwave를 이용한 플라즈마의 경우 낮은 이온 에너지, 효율적인 전자 가열, 넓은 동작압력 범위, 높은 밀도 등의 장점을 가지고 있어 PECVD(Plasma Enhanced Chemical Vapor Deposition)에 적합한 플라즈마 소스라고 할 수 있다. 또한 Microwave는 파장의 길이가 증착이 이루어지는 진공 챔버의 길이보다 매우 작기 때문에 대면적 적용성이 용이하므로 현재 많은 연구가 이루어지고 있다. 본 연구에서는 Fluid Simulation을 통해 Maxwell's equation, continuity equation, electromagnetic wave equation 등을 이용하여 Microwave의 파워 및 압력에 따른 플라즈마 parameter를 계산하고, 자체 제작한 Linear microwave plasma 장치에서 정전 탐침(Langmuir Probe)을 이용하여 플라즈마 Parameter를 측정하였다. 또한 Simulation 결과와 실험결과를 비교 분석하였다.

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Status Change Monitoring of Semiconductor Plasma Process Equipment (주파수 도메인 반사파 측정법을 이용한 플라즈마 공정장비 상태변화 연구)

  • Yunsang Lee;Sang Jeen Hong
    • Journal of the Semiconductor & Display Technology
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    • v.23 no.1
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    • pp.52-55
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    • 2024
  • In this paper, a state change study was conducted through Frequency Domain Reflectometry (FDR) technology for the process chamber of plasma equipment for semiconductor manufacturing. In the experiment, by direct connecting the network analyzer to the RF matcher input of the 300 mm plasma enhanced chemical vapor deposition (PECVD) chamber, S11 was measured in a situation where plasma was not applied, and the frequency domain reacting to the chamber state change was searched. Response factors to changes in the status, such as temperature, spacing of the heating chuck, internal pressure difference, and process gas supply state were confirmed. Through this, the frequency domain in which a change in the reflection value was detected through repeated experiments. The reliability of the measured micro-displacement was verified through reproducibility experiments.

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Synthesis of YSZ Thin Films by PECVD (PECVD에 의한 YSZ(Yttria Stabilized Zirconia)박막 제조)

  • Kim, Gi-Dong;Sin, Dong-Geun;Jo, Yeong-A;Jeon, Jin-Seok;Choe, Dong-Su;Park, Jong-Jin
    • Korean Journal of Materials Research
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    • v.9 no.3
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    • pp.234-239
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    • 1999
  • A Abstract Yttria-stabilized zirconia(YSZ) thin films were synthesized by plasma enhanced chemical vapor deposition process. $Zr[TMHD]_4$ $Y[TMHD]_3$ precursors and oxygen were used with the deposition temperature of $425^{\circ}C$ and rf power ranging 0-100 watt. Effects of the deposition parameters were studied by X-ray diffraction and thickness anal­ysis. YSZ thin films have cubic crystal structure with (200) orientation. From the results of EDX analysis, the converte ed content of TEX>$Y_2O_3$ was determined to be 0-36%, and the film thickness was increased with bubbling temperature which is considered to be due to increasing TEX>$Y_2O_3$ flux. The depth profiles of Zr, Y and 0 appeared relatively $\infty$nstant through film thickness. Columnar grains of $1000~2000\AA$ grew vertical to the substrate surface for the case of Ar carri­er gas. In case of He carrier gas, the grain size was observed to be about $1000~2000\AA$. X-ray diffraction data showed the increase of lattice constant with TEX>$Y_2O_3$ content. It was that the presence of the cracks formed during film deposition, partially released the stress generated by the increase of lattice constant.

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SiON/SiO2 Multilayer Deposited by PECVD for Low-Loss Waveguides (저손실 광도파로 제작을 위해 PECVD 법에 의해 증착된 SiON/SiO2 다층박막)

  • 김용탁;김동신;윤대호
    • Journal of the Korean Ceramic Society
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    • v.41 no.3
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    • pp.197-201
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    • 2004
  • SiO$_2$ and SiON thick films were deposited by Plasma Enhanced Chemical Vapor Deposition (PECVD) technique on silicon wafer (100) using SiH$_4$ and $N_2$O as precursor gases. In this work, the influence of rf power, and rf bias power on the optical and physical properties of SiO$_2$ and SiON thick films is presented. The refractive index decreases with increasing rf power, and rf bias power. The refractive index of the films varied from 1.4493 to 1.4952 at wavelength at 1552 nm, with increasing rf power, the nitrogen content decreases while the oxygen content increases, in a manner that the O/N ratio increases approximately linearly.

Deposition of $\alpha$-Si:H thin films by PECVD method (플라즈마 화학증착법을 이용한 $\alpha$-Si:H박막의 제조)

  • 정병후;문대규;임호빈
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1991.10a
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    • pp.63-67
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    • 1991
  • Amorphous silicon films were deposited on glass, [100] single crystal silicon wafer with thermally grown silicon dioxide, and [100] silicon wafer substrates by Plasma Enhanced Chemical Vapor Deposition(with argon diluted silane source gas). Growth rate, UV optical band edge, and the hydrogen quantity in the amorphous silicon films have been investigated as a function of the preparation conditions by measuring film thickness, UV-absorbency, and FT-IR transmittance. The growth rate of the ${\alpha}$-Si:H films increases with increasing substrate temperture, flow rate and R.F. power density. The UV optical band edge shifts to blue with the increases in the deposition pressure. Increasing substrate temperature shifts the UV optical band edge of the films to red. Hydrogen quantity in the ${\alpha}$-Si:H films increases with an increases in the R.F. powr and decreases with an increase in the substrate temperature.

Characterization of structural and electrical properties of diamond-like carbon thin films (Diamond-like Carbon (DLC) 박막의 구조적, 전기적 물성분석)

  • Lee, Jae-Yup;Lee, Jin-Bok;Son, Min-Kyu;Kim, Soung-Young;Kim, Yong-Sang;Park, Jin-Seok
    • Proceedings of the KIEE Conference
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    • 1997.07d
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    • pp.1383-1386
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    • 1997
  • Dimond-like carbon(DLC) films have been deposited by using both rf plasma-enhanced chemical vapor deposition (PECVD) and filtered cathodic vacuum arc (FCVA) deposition systems. Effects of deposition conditions, such as dc self-bias, $CH_4$ gas pressure, substrate bias, and $N_2$ partial pressure, on the structural and electrical properties of DLC films are examined. The experimental results obtained have also been discussed by considering a theoretical model for film growth.

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ESR과 Raman을 이용한 a-C:H 박막의 구조 분석

  • 조영옥;노옥환;차옥환;서은경;이정근
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.56-56
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    • 1999
  • 수소화된 비정질 탄소(a-C:H0는 그 형성 조건에 따라서 여러 가지 다른 구조와 특성을 갖게 되며, 특히 DLC(diamond-like carbon)-FED(field emission display) 개발 면에서 중요하게 연구되고 있다. 본 연구에서는 a-C:H 박막을 PECVD(plasma-enhanced chemical vapor deposition) 방법으로 증착하고 주고 ESR 및 Raman 측정을 통하여 그 결과를 조사해 보았다. PECVD 증착가스는 CH4 가스를 사용하였다. 기판은 Corning 1737 glass를 사용하였고, 기판 온도는 32$0^{\circ}C$이었다. 증착 압력과 R>F. power는 각각 0.1-1 Torr 와 12-36 W 사이에서 변화되었다. ESR를 피하기 위하여, microwave power에 대한 ESR 신호 의존성을 측정하고 포화효과를 피하기 위한 Raman spectroscopy로 분석하였다. R.F.power가 증가할수록 증착속도는 0.06 nm/sec 정도까지 대체로 증가하였으나, pressure가 1 Torr 일때는 같은 R.F. power로써 증착이 일어나지 않는 경우도 발생하였다. 증착된 a-C:H 박막은 R.F.power가 증가할수록 스핀밀도의 증가가 두드러졌으며, 기타 증착가스 압력 등의 증착 조건에 따른 ESR 및 Raman 스펙트럼의 변화를 관찰하였다.

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Properties of SiOCH Thin Film Dielectric Constant by BTMSM/O2 Flow Rates (BTMSM/O2 유량변화에 따른 SiOCH 박막의 유전상수 특성)

  • Kim, Jong-Wook;Hwang, Chang-Su;Kim, Hong-Bae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.4
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    • pp.362-367
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    • 2008
  • We have Manufactured the low-k dielectric interlayer fabricated by plasma enhanced chemical vapor deposition (PECVD), The thin film of SiOCH is studied correlation between components and Dielectric constant. The precursor was evaporated and introduced with the flow rates from 16 sccm to 25 sccm by 1sccm step in the constant flow rate of 60 sccm $O_2$ in process chamber. The chemical characteristics of SiOCH were analyzed by measuring FT/IR absorption lines and obtained each dielectric constant measuring C-V. Then compare respectively. ILD of BTMSM/$O_2$ could have low dielectric constant about $k\sim2$, and react sensitively. Also dielectric constant could be decreased by the effects of decreasing $CH_3$ and growing Si-O-Si(C) after annealing process.

Growth of Carbon Nanotubes Depending on Etching Condition of Ni-catalytic Layer (Ni 박막 촉매 Etching 조건에 따른 탄소나노튜브 성장)

  • 정성희;장건익;류호진
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.9
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    • pp.751-756
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    • 2001
  • Carbon nanotubes(CNTs) was successfully grown on Ni coated silicon wafer substrate by PECVD technique(Plasma Enhanced Chemical Vapor Deposition). As a catalyst, Ni thin film of thickness ranging from 15∼30nm was prepared by electron beam evaporator system. In order to find the find the optimum growth condition, initially two different types of gas mixtures such as C$_2$H$_2$-NH$_3$ and C$_2$H$_2$-NH$_3$-Ar were systematically investigated by adjusting the gas mixing ratio in temperature of 600$^{\circ}C$ under 0.4 torr. The diameter of the grown CNTs was 40∼200nm. The diameter of the CNTs increases with increasing the Ni particles size. TEM images clearly demonstrated synthesized nanotubes to be multiwalled.

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