• Journal of the Korean Vacuum Society
• /
• v.21 no.1
• /
• pp.29-35
• /
• 2012

The Hydrogenated silicon nitride (SiNx:H) using plasma enhanced chemical vapor deposition is widely used in photovoltaic industry as an antireflection coating and passivation layer. In the high temperature firing process, the $SiN_x:H$ film should not change the properties for its use as high quality surface layer in crystalline silicon solar cells. Initially PECVD-$SiN_x:H$ film trends were investigated by varying the deposition parameters (temperature, electrode gap, RF power, gas flow rate etc.) to optimize the process parameter conditions. Then by varying gas ratios ($NH_3/SiH_4$), the hydrogenated silicon nitride films were analyzed for its optical, electrical, chemical and surface passivation properties. The $SiN_x:H$ films of refractive indices 1.90~2.20 were obtained. The film deposited with the gas ratio of 3.6 (Refractive index=1.98) showed the best properties in after firing process condition. The single crystalline silicon solar cells fabricated according to optimized gas ratio (R=3.6) condition on large area substrate of size $156{\times}156mm$ (Pseudo square) was found to have the conversion efficiency as high as 17.2%. Optimized hydrogenated silicon nitride surface layer and high efficiency crystalline silicon solar cells fabrication sequence has also been explained in this study.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.02a
• /
• pp.540-540
• /
• 2013

In this studying, we investigated the basic properties of N-doped plasma polymer. The N-doped ethylcyclohexane plasma polymer thin films were deposited by radio frequency (13.56 MHz) plasma-enhanced chemical vapor deposition method. Ethylcyclohexenewas used as organic precursor (carbon source) with hydrogen gas as the precursor bubbler gas. Additionally, ammonia gas [NH3] was used as nitrogen dopant. The as-grown polymerized thin films were analyzed using ellipsometry, Fourier-transform infrared [FT-IR] spectroscopy, Raman spectroscopy, FE-SEM, and water contact angle measurement. The ellipsometry results showed the refractive index change of the N-doped ethylcyclohexene plasma polymer film. The FT-IR spectrashowed that the N-doped ethylcyclohexene plasma polymer films were completely fragmented and polymerized from ethylcyclohexane.

• Electrical & Electronic Materials
• /
• v.9 no.1
• /
• pp.9-17
• /
• 1996

Plasma enhanced chemical vapor deposition (PECVD) allows low temperature processing and so it is widely used, but it causes instability of devices due to serious amount of impurities within the film. In this paper, electrical and chemical characteristics of the PECVD oxynitride film formed by different N$_{2}$O to N$_{2}$O+NH$_{3}$ gas ratio is studied. It has been found that hydrogen concentration of PECVD oxynitride film was decreased from 4.25*10$^{22}$ [cm$^{-2}$ ] to 1.18*10$^{21}$ [cm$^{-2}$ ] according to the increase of N$_{2}$O gas. It was also found that PECVD oxynitride films have low trap density in the oxide and interface in comparison with PECVD nitroxide films, and has higher refractive index and capacitance than oxide films. In particular, oxynitride film formed in gas ratio of N$_{2}$O/(N$_{2}$O+NH$_{3}$)= 0.88 shows increased capacitance and decreased leakage current due to small portion of hydrogen in oxide and the accumulation of nitrogen about 4[atm.%] at the interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.11
• /
• pp.831-836
• /
• 2010

In this paper, Plasma Enhanced Chemical Vapor Deposition (PECVD) $SiO_2$ film properties are modeled using statistical analysis and neural networks. For systemic analysis, Box-Behnken's 3 factor design of experiments (DOE) with response surface method are used. For characterization, deposited film thickness and film stress are considered as film properties and three process input factors including plasma RF power, flow rate of $N_2O$ gas, and flow rate of 5% $SiH_4$ gas contained at $N_2$ gas are considered for modeling. For film thickness characterization, regression based model showed only 0.71% of root mean squared (RMS) error. Also, for film stress model case, both regression model and neural prediction model showed acceptable RMS error. For sensitivity analysis, compare to conventional fixed mid point based analysis, proposed sensitivity analysis for entire range of interest support more process information to optimize process recipes to satisfy specific film characteristic requirements.

• 제어로봇시스템학회:학술대회논문집
• /
• 1998.10a
• /
• pp.195-200
• /
• 1998

Since the neural network was introduced, significant progress has been made on data handling and learning algorithms. Currently, the most popular learning algorithm in neural network training is feed forward error back-propagation (FFEBP) algorithm. Aside from the success of the FFEBP algorithm, polynomial neural networks (PNN) learning has been proposed as a new learning method. The PNN learning is a self-organizing process designed to determine an appropriate set of Ivakhnenko polynomials that allow the activation of many neurons to achieve a desired state of activation that mimics a given set of sampled patterns. These neurons are interconnected in such a way that the knowledge is stored in Ivakhnenko coefficients. In this paper, the PNN model has been developed using the plasma enhanced chemical vapor deposition (PECVD) experimental data. To characterize the PECVD process using PNN, SiO$_2$films deposited under varying conditions were analyzed using fractional factorial experimental design with three center points. Parameters varied in these experiments included substrate temperature, pressure, RF power, silane flow rate and nitrous oxide flow rate. Approximately five microns of SiO$_2$were deposited on (100) silicon wafers in a Plasma-Therm 700 series PECVD system at 13.56 MHz.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1999.07a
• /
• pp.123-123
• /
• 1999

Amorphous hydrogenated silicon carbide (a-SiC:H) films were deposited at the temperature of 40$0^{\circ}C$ using plasma enhanced chemical vapor deposition. The a-SiC:H films were characterized by x-ray photoelectron spectroscopy (XPS) and nanoindentation method. By increasing the plasma power from 20W to 160W, the oxygen content of the a-SiC:H films were observed to decrease from 12.1% to 4.4%. On the other hand, the plasma power did not affect the ratio of carbon to silicon in our experiment where the 1, 3-disilabutane was used as the precursor. Microhardness of the films was observed to increase as the plasma power increased, while the elastic modulus was observed to gave a maximum value at the plasma power of 80W. Microhardness of the film is thought to be strongly affected by the content of adventitious oxygen in the film and it is concluded that the hardness of the film can be improved by increasing the plasma power.

• 한국신재생에너지학회:학술대회논문집
• /
• 2010.11a
• /
• pp.58.2-58.2
• /
• 2010

본 연구에서는 n-type wafer에 비정질 실리콘을 증착한 이종접합 태양전지를 열처리 방법을 이용하여 열처리의 효과를 분석함으로써 이종접합 태양전지에 효율적인 열처리 효과에 대하여 연구하였다. P, N-layer는 PECVD(Plasma-enhanced chemical vapor deposition) I-layer는 HWCVD(Hot wire chemical vapor deposition), ITO는 RF 마그네트론 스퍼터링법으로 동일한 조건에서 제작하였고 rapid thermal process를 이용하여 진공 중에서 $150^{\circ}C$, $200^{\circ}C$, $220^{\circ}C$, $250^{\circ}C$까지 열처리를 하였다. 열처리 전과 후 QSSPC로 minority carrier life time, 자외 가시선 분광분석 장치로 투과 반사도를, Ellipsometer로 흡수 계수 등의 변화를 조사하였다. 열처리 후 Minority carrier life time, Voc 및 광변환 효율이 증가하였다.

• 한국신재생에너지학회:학술대회논문집
• /
• 2011.05a
• /
• pp.129.2-129.2
• /
• 2011

본 연구에서는 a-Si:H/c-si 구조의 이종접합 태양전지의 p a-Si:H 에미터 층의 박막 조건에 따라 태양전지 특성을 연구하였다. p, n-layer는 PECVD (Plasma-enhanced chemical vapor deposition) i-layer는 HWCVD(Hot wire chemical vapor deposition), ITO는 RF 마그네트론 스퍼터링법으로 제작하였다. p-layer의 도핑 농도, 기판 증착 온도, 증착 높낮이에 따라 특성을 비교 분석 하였다. QSSPC로 minority carrier life time, 자외 가시선 분광분석 장치로 투과 반사도를, Ellipsometer로 흡수 계수, 두께, FTIR로 막의 구성요소 등의 변화를 조사하여 개선된 p a-Si:H의 특성이 이종접합 태양전지에서 효율향상에 영향을 주는지 Photo IV와 EQE를 통하여 조사하였다.

• Journal of the Korean institute of surface engineering
• /
• v.29 no.3
• /
• pp.149-156
• /
• 1996

Conducting diamond-like carbon films are synthesized using Triode Magnetron Sputtering-Plasma Enhanced Chemical Vapor Deposition(TMS-PECVD), and are examined by four point probe, microhardeness tester, and scanning electron miscroscopy(SEM). As the target bias and Ar/CH$_4$, ratio increase, the electrical resitivity and microhardness of the films are found to decrease, and also, their surface morphologies tend to be rough. While the resistivities of the films are shown to increase in proportion to the increase of the substrate bias, the microhardness of the films is shown to be maximun value(1600kg/$\textrm{mm}^2$) at a certain substrate bias(-70V). We can obtain the conducting diamond-like carbon films with the microhardness of 1600(kg/$\textrm{mm}^2$) and electrical resitivity of 16($\Omega$cm) at the process condition such as target bias -400V, substrate bias -70V, and Ar/$CH_4$ ratio 20.

• Journal of the Korean Ceramic Society
• /
• v.39 no.6
• /
• pp.594-597
• /
• 2002

Silicon Oxynitride(SiON) thick films on p-type silicon(100) wafers have obtained by using plasma-enhanced chemical vapor deposition from SiH$_4$ , N$_2$O and N$_2$. Prism coupler measurements show that the refractive indices of SiON layers range from 1.4620 to 1.5312. A high deposition power of 180 W leads to deposition rates of up to 5.92${\mu}$m/h. The influence of the deposition condition on the chemical composition was investigated using X-ray photoelectron spectroscopy. After deposition of the SiON thick films, the films were annealed at 1050$^{\circ}C$ in a nitrogen atmosphere for 2 h to remove absorption band near 1.5${\mu}$m.