• 한국전기전자재료학회논문지
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• 제20권6호
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• pp.491-495
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• 2007

This paper has demonstrated the electrical properties of SiGe pMOSFETs fabricated on both bulk-Si and PD SOI substrates. Two principal merits, the mobility increase in strained-SiGe channel and the parasitic capacitance reduction of SOI isolation, resulted in improvements in device performance. It was observed that the SiGe PD SOI could alleviate the floating body effect, and consequently DIBL was as low as 10 mV/V. The cut-off frequency of device fabricated on PD SOI substrate was roughly doubled in comparison with SiGe bulk: from 6.7 GHz to 11.3 GHz. These experimental result suggests that the SiGe PD SOI pMOSFET is a promising option to drive CMOS to enhance performance with its increased operation frequency for high speed and low noise applications.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.719-722
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• 2003

This work investigates the device degradation p-channel PD SOI devices at various applied voltages as well as stress temperatures with respect to Body-Contact SOI (BC-SOI) and Floating-Body SOI (FB-SOI) MOSFETs. It is observed that the drain current degradation at the gate voltage of the maximum gate current is more significant in FB-SOI devices than in BC-SOI devices. For a stress at the gate voltage of the maximum gate current and elevated temperature, it is worth noting that the $V_{PT}$ Will be decreased by the amount of the HEIP plus the temperature effects. For a stress at $V_{GS}$ = $V_{DS}$ . the drain current decreases moderately with stress time at room temperature but it decreases significantly at the elevated temperature due to the negative bias temperature instability.

• 대한전자공학회논문지SD
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• 제44권12호
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• pp.31-36
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• 2007

본 논문은 100 nm BSIMSOI 3.2 기술을 사용한 부분 공핍형 SOI (Partially-Depleted SOI: PD-SOI) 회로들의 정확한 타이밍 분석을 위한 새로운 통계적 특징화 방법과 추정 방법을 제안한다. 제안된 타이밍 추정 방법은 Matlab, Hspice, 그리고 C 언어로 구현되고, ISCAS 85 벤치마크 회로들을 사용해서 검증된다. 실험 편과는 Monte Carlo 시뮬레이션과 비교해 5 % 내의 에러를 보여준다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.533-533
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• 2007

The stress effect of SiGe p-type metal oxide semiconductors field effect transistors(MOSFETs) has been investigated to compare device properties using Si bulk and partially depleted silicon on insulator(PD SOI). The electrical properties in SiGe PD SOI presented enhancements in subthreshold slope and drain induced barrier lowering in comparison to SiGe bulk. The reliability of gate oxides on bulk Si and PD SOI has been evaluated using constant voltage stressing to investigate their breakdown (~ 8.5 V) characteristics. Gate leakage was monitored as a function of voltage stressing time to understand the breakdown phenomena for both structures. Stress induced leakage currents are obtained from I-V measurements at specified stress intervals. The 1/f noise was observed to follow the typical $1/f^{\gamma}$ (${\gamma}\;=\;1$) in SiGe bulk devices, but the abnormal behavior ${\gamma}\;=\;2$ in SiGe PD SOI. The difference of noise frequency exponent is mainly attributed to traps at silicon oxide interfaces. We will discuss stress induced instability in conjunction with the 1/f noise characteristics in detail.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.21-22
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• 2005

Partially-depleted Silicon on insulator metal-oxide-semiconductor field- effect transistors (PD-SOI MOSFETs) with Silicon-germanium (SiGe) layer is investigated. This structure uses SiGe layer to reduce the kink effect in the floating body region near the bottom channel/buried oxide interface. Among many design parameters influencing the performance of the device, Ge composition is presented most predominant effects, simulation results show that kink effect is reduced with increase the Ge composition. Because the bandgap of SiGe layer is reduced at higher Ge composition, the hole current between body and SiGe layer is enhanced.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1998년도 추계종합학술대회 논문집
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• pp.553-556
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• 1998

The 1-D numerical model and its extraction methodology are suggested and these simulation results for the S-swing as a function of back-gate voltage are well matched with the measured. S-swing characteristics are analyzed using PD-SOI devices with enough deeper regions up to substrates. The PD-SOI device doesn't have to be short channel to see the anomalous subthreshold phenomena based on the back gate bias. This results recommend to operate better SOI device performances by controlling the back gate voltages. So SOI performances will be much optimistic with proper control of the back-gate voltage for the already- proven- high- performance (APHP) SOI VLSIs.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권4호
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• pp.262-271
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• 2011

In this work, we present a unified analytical surface potential model, valid for both PD and FD SOI MOSFETs. Our model is based on a simplified one dimensional and purely analytical approach, and builds upon an existing model, proposed by Yu et al. [4], which is one of the most recent compact analytical surface potential models for SOI MOSFETs available in the literature, to improve its accuracy and remove its inconsistencies, thereby adding to its robustness. The model given by Yu et al. [4] fails entirely in modeling the variation of the front surface potential with respect to the changes in the substrate voltage, which has been corrected in our modified model. Also, [4] produces self-inconsistent results due to misinterpretation of the operating mode of an SOI device. The source of this error has been traced in our work and a criterion has been postulated so as to avoid any such error in future. Additionally, a completely new expression relating the front and back surface potentials of an FD SOI film has been proposed in our model, which unlike other models in the literature, takes into account for the first time in analytical one dimensional modeling of SOI MOSFETs, the contribution of the increasing inversion charge concentration in the silicon film, with increasing gate voltage, in the strong inversion region. With this refinement, the maximum percent error of our model in the prediction of the back surface potential of the SOI film amounts to only 3.8% as compared to an error of about 10% produced by the model of Yu et al. [4], both with respect to MEDICI simulation results.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.482-485
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• 2004

We fabricated a hybrid bulk/fully depleted silicon on insulator (FDSOI) complementary metal oxide semiconductor (CMOS) active pixel image sensor. The active pixel is comprised of reset and source follower transistors on the SOI seed wafer, while the pinned photodiode and readout gate and floating diffusion are fabricated on the SOI handle wafer after the removal of the buried oxide. The source of dark current is eliminated by hybrid bulk/FDSOI pixel structure between localized oxidation of silicon (LOCOS) and photodiode(PD). By using the low noise hybrid pixel structure, dark currents qm be suppressed significantly. The pinned photodiode can also be optimized for quantum efficiency and reduce the noise of dark current. The spectral response of the pinned photodiode on the SOI handle wafer is very flat between 400 nm and 700 nm and the dark current that is higher than desired is about 10 nA/cm2 at a $V_{DD}$ of 2 V.

• 대한전자공학회논문지SD
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• 제41권2호
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• pp.9-15
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• 2004

본 논문에서는 부분공핍(partially-depleted : PD) 영역과 완전공핍(fully-depleted : FD) 영역을 나누는 임계 전면 게이트 전압 V/sub c/의 해석적 표현을 이용해서 PD 영역과 FD 영역의 천이를 정확히 설명하는 해석적 표면전위 모델(analytical surface potential model)을 소개한다. 이 모델은 모든 동작영역(subthreshold에서 strong inversion까지)에서 유효하고 반복 계산 절차 (iteration procedure)인 수치 해석적 방법보다 훨씬 짧은 계산시간이 걸린다. 이 모델에 기초한 charge sheet 모델이 모는 동작영역에 유효한 드레인 전류의 단일 공식을 유도하는데 사용된다. 대부분의 secondary 효과들이 charge sheet 모델에 쉽게 포함되고 그 모델의 결과들은 수치해석 결과와 실험 결과를 비교적 정확히 일치한다. 세 가지의 smoothing 함수가 사용될지 라도 표면전위 미분 값은 연속이다 더욱 중요한 점은 smoothing 함수에 사용된 파라미터들은 공정 파라미터들에 크게 의존하지 않는다.