• Journal of Institute of Convergence Technology
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• v.1 no.1
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• pp.34-40
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• 2011

In this paper, a hybrid design tool combining one-dimensional(1D) lumped model and three-dimensional computational fluid dynamics(CFD) approach has been developed in order to evaluate the performance of inkjet print head and droplet control process are studied to reduce the deviations between nozzles which affect the size of the printed line for the industrial application of direct writing on printed circuit boards(PCB). 1D lumped model analysis shows that it is useful tool for evaluating performance of an inkjet head by varying the design parameters. The differences in ejected volume and droplet velocity between analytical and experimental result are within 12%. Time sequence of droplet generation is verified by the comparison between 3D analysis result and photographic images acquired by stroboscopic technique. In addition, by applying DPN process, velocity and volume uniformity between nozzles is dramatically improved that the tolerance achieved by the piezoelectric inkjet printhead across the 64 nozzles is 5 to 8%. A printed line pattern is successfully obtained using the fabricated inkjet print head and droplet calibration system.

• Journal of Radiation Industry
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• v.8 no.3
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• pp.147-153
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• 2014

This paper describes a large area CMOS image sensor module Implementation using the precision align inspection program. This work is needed because wafer cutting system does not always have high precision. The program check more than 8 point of sensor edges and align sensors with moving table. The size of a $2{\times}1$ butted CMOS image sensor module which except for the size of PCB is $170mm{\times}170mm$. And the pixel size is $55{\mu}m{\times}55{\mu}m$ and the number of pixels is $3,072{\times}3,072$. The gap between the two CMOS image sensor module was arranged in less than one pixel size.

• Journal of the Korean Society of Industry Convergence
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• v.27 no.5
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• pp.1137-1144
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• 2024

This paper is about an electric water pump used in an electric vehicle cooling system. An electric water pump is operated by a BLDC motor compared to a mechanical one, so it operates only as much as necessary, improving fuel efficiency. The use of an electric water pump reduces exhaust gas and has the advantage of being free to install, so it can be applied to automobiles, ships, and aircraft. In order to optimize the production of a BLDC motor used as an electric water pump, FEM and electromagnetic field analysis were performed. The dimensions and materials of the stator and rotor were selected by applying the values obtained through the analysis. In addition, the output characteristics of the motor were analyzed through parameter analysis and shape change through self-equivalent circuit analysis to reduce the outer diameter and increase the torque. The electromagnetic hazard of the PCB board was verified, and power integrity analysis was performed to reduce resonance and noise.

• Journal of Korean Society of Environmental Engineers
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• v.39 no.9
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• pp.527-533
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• 2017

Environmental concern about smart phone is growing because it has short product life span while having intensive production technology and cost. In this study environmental impact of the smart phone is quantified using the LCA methodology based on the ISO 14040 series standards. The assessment considers potential environmental impacts across the whole life cycle of the smart phone including; pre-manufacturing; manufacturing; distribution; product use; and end-of-life stages. The pre-manufacturing stage is the most dominant life cycle stage causing the highest environmental impacts among all 10 impact categories assessed. The global warming impacts of the smart phone in the pre-manufacturing, distribution, use, manufacturing, and end-of-life stages were 52.6% 23.9%, 15.7%, 7.0%, and 0.8%, respectively. Sensitivity of the life cycle impact assessment results to the system boundary definition and assumptions made were quite high. Three components of the smart phone, PCB, battery, and display module were identified as the key components causing majority of the potential environmental impact in the pre-manufacturing stage. As such the slim and light-weight design and the use of environmental friendly materials are important design factors for reducing the environmental impact of the smart phone.

• Journal of the Korean Magnetics Society
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• v.23 no.2
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• pp.49-53
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• 2013

A current sensor is one of important component which is used for the electrical current measurement during charge and discharge of the battery, and monitoring system of the motor controller in the electric and hybrid vehicle. In this study, we have developed an open loop type current sensor using GaAs Hall sensor and magnetic core has an air gap. The Hall sensor detect magnetic field produced by the current to be measured. The 3 mm air gap core was made by HGO electrical steel sheets after slitting, winding, annealing, molding, and cutting. Developed current sensor shows 0.03 % linearity within DC current range from -400 A to +400 A. Operating temperature range was extended to the range of $-40{\sim}105^{\circ}C$ using temperature compensating electronic circuit. To Improve frequency bandwidth limit due to the air flux of PCB (Printed Circuit Board) and Hall sensor, We employed an air flux compensating loop near Hall sensor or on PCB. Frequency bandwidth of the sensor was 100 kHz when we applied sine wave current of $40A{\cdot}turn$ in the frequency range from 100 Hz to 100 kHz. For the dynamic response time measurement, 5 kHz square wave current of $40A{\cdot}turn$ was applied to the sensor. Response time was calculated time reach to 90 % of saturation value and smaller than $2{\mu}s$.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.550-557
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• 2021

With the advent of the fourth industrial revolution, the interest in the internet of things (IoT) in manufacturing is growing, even at foundries. There are several types of process data that can be automatically collected at a foundry, but considerable amounts of process data are still managed based on handwriting for reasons such as the limited functions of outdated production facilities and process design based on operator know-how. In particular, despite recognizing the importance of converting process data into big data, many companies have difficulty adopting these steps willingly due to the burden of system construction costs. In this study, the field applicability of IoT-based devices was examined by manufacturing devices and applying them directly to the site of a centrifugal foundry. For the centrifugal casting process, the temperature and humidity of the working site, the molten metal temperature, and mold rotation speed were selected as process parameters to be collected. The sensors were selected in consideration of the detailed product specifications and cost required for each process parameter, and the circuit was configured using a NodeMCU board capable of wireless communication for IoT-based devices. After designing the circuit, PCB boards were prepared for each parameter, and each device was installed on site considering the working environment. After the on-site installation process, it was confirmed that the level of satisfaction with the safety of the workers and the efficiency of process management increased. Also, it is expected that it will be possible to link process data and quality data in the future, if process parameters are continuously collected. The IoT-based device designed in this study has adequate reliability at a low cast, meaning that the application of this technique can be considered as a cornerstone of data collecting at foundries.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.210-215
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• 2017

We have developed the neuromorphic system that can work with the four-terminal Si-based synaptic devices and verified the operation of the system using simulation tool and printed-circuit-board (PCB). The symmetrical current mirrors connected to the n-channel and p-channel synaptic devices constitute the synaptic integration part to express the excitation and the inhibition mechanism of neurons, respectively. The number and the weight of the synaptic devices affect the amount of the current reproduced from the current mirror. The double-stage inverters controlling delay time and the NMOS with large threshold voltage ($V_T$) constitute the action-potential generation part. The generated action-potential is transmitted to next neuron and simultaneously returned to the back gate of the synaptic device for changing its weight based on spike-timing-dependent-plasticity (STDP).

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.4
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• pp.871-876
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• 2005

Theme park automation system is developed by using the RFID sensor reader, IIS web server, ASP.NET and MSSQL database in this paper. Its operation is that park entrance people checked automatically when he who possessed the ta8 passed the reader acquisition bound and its tag information is sent to the host computer through the RS-232 data acquisition system. Tag information and time data will be stored in the RFID database tables and reused to extract and distribute the entrance people for the purpose of each arrangement of each entertainment devices. First of all, we developed interface program between host and reader and then, programmed the related web site and database connection function using ASP.NET with $C\#$ and MSSQ. We also design and make an production of external Ant. to extend the acquisition range up to $30\~40$ cm using copper PCB plate. We confirmed the performance through the RFID test bed site.

• Korean Journal of Optics and Photonics
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• v.20 no.4
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• pp.223-229
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• 2009

This paper describes the development of a simulator which can numerically calculate an image to be acquired in a machine vision system for automated optical inspection. The simulator is based on a ray tracing technique and composed of three modules which are an illuminating system, a specimen and an imaging system. Kinds of model parameters for modules and their values are carefully chosen from the direct measurement and the observation of related phenomena. Finally, the validity of the simulator is evaluated by logical analysis and by comparison with measured images.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.6
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• pp.152-158
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• 2013

The purpose of this study is to investigate cooling performance of high power LEDs from 100 to 200 W class by using a jet impingement cooling module. The numerical analysis of forced convection cooling inside cooling module is carried out using a multi-purpose CFD software, FLUENT 6.3. In the experiments, the LED cooling system consists of jet impingement module, heat exchanger, water reservoir, and pump. In the present study, the cooling performance of jet impingement cooling module is investigated to determine the effect of the heat sink types on the impinging surface, the space and length of fins. Numerical and experimental studies show the reasonable agreement of LED metal PCB temperature between those results and give the optimized design parameters such as the space of fin and the length of fin. Also, the pin fin type of heat sink is found to be more efficient than the plate type heat sink in jet impingement cooling.