• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.113-118
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• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.5
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• pp.2567-2572
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• 2014

In the present study, we aimed to obtain multi jig that PCB sheet with several PCB component can cut in a short time as to the Separation of PCB component. PCB supporter designed safely at the base frame and each model can be separable. it completed the neodium magnet for the fixing of the upper part laser transmission hole of the both. One of the development, the cutting working with one base frame which PCB component of various standard, fixing of module and bridge connected to PCB component could be possible. and it reduced the inconvenience which has to replace the base frame and PCB sheet fixed member. It compared to other press up about 70% of accuracy and a reduction in investment cost was about 400%.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4736-4741
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• 2014

This study examined PCB component cleaning on a PCB component surface, which has defects of precipitation type washing (existing rinse method), sealant and foreign material formed in the adhesive process that could not be removed easily. The spin jig was developed for PCB component cleaning, in which the PCB component settled down, to solve the conventional problem of the removal of foreign material with the centrifugal force by high speed rotation. The results are as follows. With decreasing fraction defect in PCB component washing, the development and substrate damage decreased by more than 80% according to the abstergent in the rotary type using the centrifugal force in the existing precipitation type. When the base plate showed a large difference with the time to include the process after washing the design using the existing method, easy attachment and separation of the PCB component could be possible. The washing time was enhanced 90% compared to the existing time. The reliability of the security and washing collaboration of the design and stability of the cleaning process could be secured so that there was no phenomenon of secession, the PCB component fixed for a cleansing rotation jig could maintain a fixed force by the centrifugal force. The stability and reliability of the washing process and the defective rate could be improved to less than 1%.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.644-647
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• 2004

RF 시스템에서 발룬(Balun)은 회로기판과 집적회로 사이의 임피던스 매칭에 사용되는 소자로서, 전력의 균등한 분배와 함께 180도 위상차를 만드는 역할을 하는 주요 회로부품이다. 시스템의 요구사양에 따라 balanced 임피던스가 $50\Omega$인 소자뿐만 아니라, 25 또는 100, $200\Omega$인 소자들도 많이 사용되는데, 대부분의 계측기가 $50\Omega$을 I/O 임피던스로 설정하고 있어, balanced 임피던스가 $50\Omega$이 아닌 경우 특성을 측정하기 위해서는 별도의 지그설계가 필요하다. 본 연구에서는 중심주파수가 900MHz이고, balanced 임피던스가 $100\Omega$이며, LTCC 모듈 내에 내장되는 임베디드 발룬의 최적 평가를 위한 PCB 측정지그의 구조에 대하여 설계 및 시뮬레이션을 실시하고, 이에 따라 제작된 지그를 시뮬레이션 결과와 비교하였다. 지그를 구성하는 마이크로스트림의 임피던스를 조절함으로써 유효한 측정주파수범위를 넓힐 수 있었으며, 제작된 지그는 설계치에 거의 근접한 전송특성을 나타내었다.

• Journal of the Korean Society of Safety
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• v.21 no.1 s.73
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• pp.59-64
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• 2006

In this study, adsorption characteristics of PCBs on granular activated carbon were experimentally investigated in a batch reactor and in a fixed bed reactor. Granular activated carbon removed above 98.4% of initial concentration, 1000mg/L, of PCBs. It was estabilished that the adsorption equilibrium of PCBs on granular activated carbon was more successfully fitted by Freundlich isotherm equation in the concentration range from 1 to 1000mg/L. Because Freundlich parameter, ${\beta}$ is 0.346, removall treatment of PCBs by activated carbon accounts for the fact that toxicity reduction can be achieved through this process. Appearance time of breakthrough curve is faster with the increase flow rate and inflow concentration of liquid. The utility of granular activated carbon is enhanced with the increase of bed height and with the decrease of inflow rate.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.923-926
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• 2009

We fabricated large-area OLED lighting device using screen printing. In order to operate full area of large-area OLED uniformly, each cell in OLED panel was designed to work separately. We connected OLED panel with a PCB electrically using jig pins so that each cell could be operated individually. In this presentation, we report a few important issues on the fabrication of large-area OLED for lighting applications.

• Journal of Korea Multimedia Society
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• v.21 no.6
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• pp.649-658
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• 2018

In this paper, we propose a mechanical contact inner tap inspection system that can inspect the defect of the inner tap immediately after inner tap is processed within the machining center. The inspection module has the collet chuck structure, so it can mounted on the main spindle of the machining center during inspection. It was developed with a focus on inspection for tap having 20 mm depth which is primarily fabricated in automotive parts and has a double sided PCB-type control system including sensing function based on Zigbee module, micom and IR sensor for wireless transmission of measured data with low power operation, and also a battery for supplying electric power. The current consumption is 46.8mA in the inspection operation mode and 0.0268mA in the power saving mode for 3.7V of the applied power source, so that 30,000 times or more inspection can be performed with assumed 5 seconds inspection time for one tap. Experiments in test jig system and actual machining center confirm that the proposed inner tap inspection system can be applied to the batch process of simultaneous inspection after tapping in the machining center.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.3
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• pp.163-168
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• 2015

In this paper, 433/865MHz dual band antenna is proposed by using IFA structure of a PCB antenna, the performance was improved by changing of the space between the feed point and short strip, varying the gap between the radiator and the ground plane and adding the branch line in the proposed antenna. To confirm the characteristics of the antenna parameters, HFSS from ANSYS Inc. was used for the analysis. RFID frequency band of ISO-18000-7 is 433MHz and EU-RFID frequency band of ISO-18000-6 is from 865.5 to 867.5MHz. Each of the 433/865MHz bandwidth of the proposed antenna is 5.2MHz and 18.2MHz. The maximum 433MHz antenna gain is -5.74dBi, the maximum 865MHz antenna gain is -3.36dBi. The Jig size of the proposed antenna is $60{\times}44{\times}1mm$ and the size of the antenna area $44{\times}21mm$. The results proved the possibility of the practical use on 433/865MHz by using the IFA structure that came from comparing and analyzing the measured and simulated data of the antenna.