• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.10
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• pp.2052-2058
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• 2009

As the operating frequency of digital system increases and voltage swing decreases, an accurate and high speed analysis of PCB board becomes very important. Transmission matrix method, which use the multiple products of unit column matrix, is the highest speedy method in PCB board analysis. In this paper a new method to reduce the calculation time of PCB board impedances is proposed. First, in this method the eigenvalue and eigenvectors of the transmission matrix for unit column of PCB are calculated and the transmission matrix for the unit column is transformed using similarity transform to reduce the number of multiplication on the matrix elements. This method using the similarity transform can reduce the calculation time greatly comparing the previous method. The proposed method is applied to the 1.3 inch by 1.9 inch board and shows about 10 times reduction of calculation time. This method can be applied to the PCB design which needs a lots of repetitive calculation of board impedances.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.40-50
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• 2023

Recently, the number of components of smartphones increases rapidly, while the PCB size continuously decreases. Therefore, 3D technology with a stacked PCB has been developed to improve component density in smartphone. For the s tacked PCB, it i s very important to obtain solder bonding quality between PCBs. We investigated the effects of the properties, thickness, and number of layers of interposer PCB and sub PCB on warpage of PCB through experimental and numerical analysis to improve the reliability of the stacked PCB. The warpage of the interposer PCB decreased as the thermal expansion coefficient (CTE) of the prepreg decreased, and decreased as the glass transition temperature (Tg) increased. However, if temperature is 240℃ or higher, the reduction of warpage is not large. As FR-5 was applied, the warpage decreased more compared to FR-4, and the higher the number and thickness of the prepreg, the lower the warpage. For sub PCB, the CTE was more important for warpage than Tg of the prepreg, and increase in prepreg thickness was more effective in reducing the warpage. The shear tests indicated that the dummy pad design increased bonding strength. The tumble tests indicated that crack occurrence rate was greatly reduced with the dummy pad.

• Proceedings of the Acoustical Society of Korea Conference
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• autumn
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• pp.235-238
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• 2004

대부분의 보청기 이용자들은 자신이 장애를 겪고 있다는 사실이 알려지는 것을 꺼린다. 따라서 보청기 사용자들은 귀 바깥쪽으로 들어 나지 않는 귓속형(ITE type) 보청기를 선호한다. 하지만, 이러한 귓속형 보청기를 제작하는 것은 쉬운 일이 아니다. 보청기의 각각 부품들만을 볼 때는 그 크기가 소형이지만, 부품 모두를 귀속에 넣는다고 한다면, 공간의 확보는 꼭 필요한 사항이다. 또한 보청기는 하나의 칩(chip)에 부품이 전선(wire)을 통해 납땜이 되는 구조이다. 이는 전선의 단락을 유발할 뿐만 아니라 칩과 전선이 쉽게 떨어지며, 잦은 납Eoa 작업으로 인해 열적으로 칩의 파손까지도 일으킨다. 이를 보안하고자 여기에서는 보청기 소형화 방법으로 PCB(Printed Circuit Board)를 제시하였다. PCB 를 사용함으로써 전선의 사용을 최소화하고, 부품과 PCB 와의 직접적인 결합으로 인해 보다 견고한 보청기 제작을 목표로 하였다. 아울러 PCB 를 통한 부품의 실장으로 기존의 수작업이던 보청기 제작을 자동화와 제작 시간의 단축이라는 이점을 얻을 수 있다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.7
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• pp.1336-1341
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• 2009

In this paper, an EMI reduction effects using an EMC chamber is described and reduction methods is proposed. In the case of general electronic components a working frequency is low. But in this paper the vehicle cluster works 75MHz in the main clock frequency, becoming weak by noise because of being attached in TFT LCD. As the outer case installed in the vehicle is made up of plastic materials, the noise is radiated if not protecting noise in the PCB itself. Therefore, This paper will explain the theoretical basis and propriety with respect to the discussion and need about the guide for PCB design considering EMC, through the reduction of PCB noise.

• Proceedings of the Korea Contents Association Conference
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• 2004.11a
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• pp.412-416
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• 2004

In this paper, we designed data transformation interface for automation of PCB product. For this, information of PCB components designed to CAD is analyzed and human error detect algorithm is developed. Also we constructed information of IC components in database and designed the interface and algorithm for data transformation. Thersfore Did so that can shorten time of degree to be 1-2 days within several minutes by automating existent manual processing.

• Proceedings of the IEEK Conference
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• 2002.06d
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• pp.81-84
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• 2002

This paper presents the real-time PCB(Printed circuit board) inspection system that can detect thin open/short error using the line scan camera. After a overall introduction of our system, the outline of our inspection methods are described. The goal of our inspection system is the real time and detailed inspection using the line scan camera. To perform inspection processing in real-time, we utilize double buffering structure. In order to solve the problem of unexpectable pixels of PCB, we propose melting process which eliminates unexpectable pixels of PCB. The design and development of our prototype of PCB ins- pection system is discussed and test results are presented to show the effectiveness of the developed inspection algorithm.

• The Journal of the Korea institute of electronic communication sciences
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• v.10 no.1
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• pp.27-32
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• 2015

In this paper, a mushroom typed electromagnetic band gap (EBG) structure to be inserted in the printed circuit board (PCB) inner layer in order to stabilize the PCB power line is proposed for global-navigation satellite service (GNSS). In designing the proposed EBG structure, the target stop-bandwidth was designed from 1.55GHz to 1.81GHz including GNSS and mobile communication-related frequency bandwidth. In this bandwidth, the insertion loss(S21) was observed below about -40dB. From the simulation results, it is expected that the stabilization of power delivery network (PDN) structure in the PCB circuit design should be improved and the effective correspondence to EMI will be helpful.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.12
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• pp.46-55
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• 2014

PCB design technology for high-speed transmission line has been developed continuously. Adapting to the high capacity of the communication system, switch fabric interface used for backplane is being standardized to accommodate more than 10Gbps serial interface. In this paper, various computer simulations are performed to compare the performance of each transmission line per length according to PCB material, and also to analyze the effect from via stub length and crosstalk, for the purpose of applying 11.5Gbps serial interface as a switch fabric interface in tera-bit switching system. As a result of the simulation, important design issues, such as PCB material of each board supporting 8dB improvement in transmission loss using low loss PCB, maximum available stub length on transmission line via, whether or not to apply the backdrill process to the via, and the clearance of the differential pair between transmission lines, are determined. The most efficient system architecture which could be applied 11.5Gbps serial interface in all switch fabric interfaces is defined from the simulation results.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.5
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• pp.586-592
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• 2018

In this paper, HIC with various functions is proposed for the design 140W LED power control circuit. The proposed HIC integrates constant voltage/constant current circuit, short circuit protection circuit, internal constant voltage circuit, and dimmer circuit, thereby reducing the horizontal length of the PCB by 16% comparing with the conventional system. Through various experiments, we verified the performance of each block implemented inside of HIC with numerical results. (Constant voltage variation ratio: 2.9%, dimmer circuit duty variation within 5%, stable short protection at 720 mA) Since the PCB area can be significantly reduced by applying the proposed HIC. It is possible to reduce the PCB manufacturing time which takes up most of the manufacturing time, however, It is expected that the faulted power module can be replaced without replacing the whole PCB, so that maintenance / repair can be made easier.

• Journal of Electrical Engineering and Technology
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• v.7 no.5
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• pp.730-735
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• 2012

This paper presents a method to design the waveform of a back electromotive force (back EMF) of an axial flux permanent magnet (AFPM) motor using printed circuit board (PCB) windings. When the magnetization distribution of permanent magnet (PM) is given, the magnetic field in the air gap region is calculated by the quasi three dimensional (3D) space harmonic analysis (SHA) method. Once the flux density distribution in the winding region is determined, the required shape of the back EMF can be obtained by adjusting the winding distribution. This can be done by modifying the distance between patterns of PCB to control the harmonics in the winding distribution. The proposed method is verified by finite element analysis (FEA) results and it shows the usefulness of the method in eliminating a specific harmonic component in the back EMF waveform of a motor.