• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.31-35
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• 2022

Recently, with the 4th industrial revolution, the demand for high-density semiconductors for large-capacity data processing is increasing. Researchers are interested in researching the reliability of surface mount technology (SMT). In this study, the effect of PCB pad design on assembly and adhesion reliability of passive component was analyzed using design of experiment (DOE). The DOE method was established using the pad length, width, and distance between pads of the PCB as variables. The assembly defect rate of the passive element after the reflow process was derived according to the misplacement direction of the chip resistor. The shear force between the passive element and the PCB was measured using shear tests. In addition, the shape of the solder according to the pad design was analyzed through cross-sectional analysis.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2005.11a
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• pp.429-432
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• 2005

This paper investigates how the PCB power-bus structure's characteristics are influenced by the loading of decoupling capacitors that are placed close to vias, on purpose or not. It is worthwhile to see the correlated effects of the aforementioned lumped elements in that when they inevitably share one DC power-bus they will result in positive or negative changes in the PCB EMC design. The EM fields and impedance profiles are rigously calculated on the PCB power-bus cases loaded with the above components and their effects will be given to bring better PCB EMC countermeasures.

• Journal of the Korean Institute of Navigation
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• v.23 no.2
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• pp.61-66
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• 1999

It is being more and more difficult to suppress emissions from electronic products using PCB(Printed Circuit Board) to the limit. Therefore, the exact evaluation of the emission from PCB has been more important to reduce the required time and the cost at the design phase of the products, especially on board ship's equipments. This research has evaluated the emission radiated from PCB based on the theoretical approach of SDA(Spectral Domain Analysis), which is available to analyze microwave stripline, coplanar line, patch antenna, etc. According to the theoretical results, it has been clearly shown that the emission radiated from PCB is reduced as the thickness of PCB is thinner, the permittivity of PCB is higher, the length of stripline is shorter, and the frequency is lower.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4736-4741
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• 2014

This study examined PCB component cleaning on a PCB component surface, which has defects of precipitation type washing (existing rinse method), sealant and foreign material formed in the adhesive process that could not be removed easily. The spin jig was developed for PCB component cleaning, in which the PCB component settled down, to solve the conventional problem of the removal of foreign material with the centrifugal force by high speed rotation. The results are as follows. With decreasing fraction defect in PCB component washing, the development and substrate damage decreased by more than 80% according to the abstergent in the rotary type using the centrifugal force in the existing precipitation type. When the base plate showed a large difference with the time to include the process after washing the design using the existing method, easy attachment and separation of the PCB component could be possible. The washing time was enhanced 90% compared to the existing time. The reliability of the security and washing collaboration of the design and stability of the cleaning process could be secured so that there was no phenomenon of secession, the PCB component fixed for a cleansing rotation jig could maintain a fixed force by the centrifugal force. The stability and reliability of the washing process and the defective rate could be improved to less than 1%.

• Journal of Aerospace System Engineering
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• v.14 no.3
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• pp.51-59
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• 2020

In the case of cubesat, a PCB-based deployable solar panel advantageous in terms of weight reduction and electrical circuit design is widely used considering the limited weight and volume of satellites. However, because of the low thermal conductivity of PCB, there is a limit relative to heat dissipation. In this paper, the thermal gap pad is applied to the contact between the PCB-based solar panel and the aluminum stiffener mounted on the outside of the panel. Thus, the heat transfer from the solar cell to the rear side of the panel is facilitated. It maximizes the heat dissipation performance while maintaining the merits of PCB panel, and thus, it is possible to improve the power generation efficiency from reducing the temperature of the solar cell. The effectiveness of the thermal design of the 6U cubesat's deployable solar panel using the thermal gap pad has been verified through on-orbit thermal analysis based on the results, compared with the conventional PCB-based solar panel.

• Journal of the Korean Society of Safety
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• v.13 no.2
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.7
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• pp.310-316
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• 2019

In automotive application, customers are demanding high efficiency and various functions for convenience. The demand for these automotive applications is steadily increasing. In this study, it has been studied the analysis of heat flow to improve the PCB(printed circuit board) heating performance of WPC (wireless power charger) recently developed for convenience. The charging performance of the wireless charger has been reduced due to power dissipation and thermal resistance of PCB. Therefore, it has been proposed optimal PCB design, layout and position of electronic parts through the simulation of heat flow analysis and PCB design was analyzed and decided at each design stage. Then, the experimental test is performed to verify the consistency of the analysis results under actual environmental conditions. In this paper, The PCB modeling and heat flow simulation in transient response were performed using HyperLynx Thermal and FloTHERM. In addition, the measurement was performed using infrared thermal imaging camera and used to verify the analysis results. In the final comparison, the error between analysis and experiment was found to be less than 10 % and the heating performance of PCB was also improved.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.7 no.5
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• pp.430-439
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• 1996

In printed circuit board (PCB) design, it is necessary to predict the crosstalk effect among traces on the circuitary behavior. In this paper, crosstalk between parallel or crossing traces was treated by the finite difference time domain (FDTD) method. They are the typical models of PCB traces and the crosstalk is a major contributor in the creation of electromagnetic interference (EMI). The crosstalk effect was computed for the variation of distance spacing and length of parallel traces and crossing traces. The results in time and frequency domain are discussed and compared with those using MDS(microwave design system) and HFSS(high frequency structure simulator). The comparison shows that the FDTD method can be of wide application in analysis model and save the time required for calculation.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• Journal of the Institute of Convergence Signal Processing
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• v.9 no.2
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• pp.135-140
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• 2008

In this paper, the spiral antenna with the center frequencies of 315MHz, 433MHz, and 447MHz for RKE system of a vehicle is designed on PCB. The antenna is microstrip line-fed, and applied PIFA concept near the feeding part to easily tune center frequency and input impedance. The PIFA-type spiral antenna with the size of $30mm{\times}20mm$ is designed on printed PCB by considering the effect of circuits and components on PCB, ECU case and vehicle body. Also chip inductor inserted dual-band spiral antenna of 315MHz and 447MHz is designed. We found that the antenna designed on PCB satisfied the antenna specifications through measurement and field test.