• Journal of Applied Reliability
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• v.12 no.3
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• pp.153-163
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• 2012

Recently, as a electronic components are becoming more high-density, so that electronic circuits have smaller pitches between the leads and are more vulnerable to insulation failure. And the reliability of electric insulation has become an ever important issue as device contact pitches and print patterns shrink. Ion migration occurs in highly humid environment as voltage is applied to an installed print circuit. Under highly humid and voltage applied circumstances, electronic components respond to applied voltages by electrochemical ionization of metals, and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. In thesis, we study acceleration test of ion migration in FR-4 PCB plated with Sn. Voltage applied test of FR-4 PCB circuits plated with Sn was tested in the temperature and humidity environments. As a result of this test, equation of acceleration model was derived.

• Proceedings of the KIEE Conference
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• 2005.10b
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• pp.273-275
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• 2005

Active thermography is being used since several years for remote non-destructive testing. It provides thermal images for remote detection and imaging of damages. Also, it is based on propagation and reflection of thermal waves which are launched from the surface into the inspected component by absorption of modulated radiation. For energy deposition, it use external heat sources (e.g., halogen lamp or convective heating) or internal heat generation (e.g., microwaves, eddy current, or elastic wave). Among the external heat sources, the ultrasound is generally used for energy deposition because of defect selective heating up. The heat source generating a thermal wave is provided by the defect itself due to the attenuation of amplitude modulated ultrasound. A defect causes locally enhanced losses and consequently selective heating up. Therefore amplitude modulation of the injected ultrasonic wave turns a defect into a thermal wave transmitter whose signal is detected at the surface by thermal infrared camera. This way ultrasound thermography(UT) allows for selective defect detection which enhances the probability of defect detection in the presence of complicated intact structures. In this paper the applicability of UT for fast defect detection is described. Examples are presented showing the detection of defects in PCB material. Measurements were performed on various kinds of typical defects in PCB materials (both Cu metal and non-metal epoxy). The obtained thermal image reveals area of defect in row of thick epoxy material and PCB.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.6
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• pp.698-704
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• 1999

There are several types of defects of SMDs mounted on PCB, that is, missing components, misalignment, wrong parts and poor solder joints. This research study mainly focuses on measuring of deviation of SMD leads using the partial image of component, not using the full image. This processing based on the partial image has the advantage of the reduction in calculation time compared to the full image. Since position of lead is calculated with respect of the reduction in calculation time compared to the full image. Since position of lead is calculated with respect to pad, the accuracy of the system is not dependent on percise positioning stage. The grabbed image of gray scale is converted into binary format using a cutomatic threshold. After small fragments in the image is removed by a series of morphology operations such as opening and closing, the centroids of PCB pads and SMD leads is obtained together with labeling of blobs. Translational shift and rotationial angle of SMD are succedingly estimated using above information and chip data. The expression that can calculate the maximum deviation of leads with respect to PCB pads has been derived, and inferior mounting of SMD is judged by a given criterion. Some experiments have been executed to verify this measuring scheme.

• Journal of Korea Multimedia Society
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• v.24 no.3
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• pp.382-395
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• 2021

In this study, character recognition using deep learning is performed among the various defects in the PCB, the purpose of which is to check whether the printed characters are printed correctly on top of components, or the incorrect parts are attached. Generally, character recognition may be perceived as not a difficult problem when considering MNIST, but the printed letters on the PCB component data are difficult to collect, and have very high redundancy. So if a deep learning model is trained with original data without any preprocessing, it can lead to over fitting problems. Therefore, this study aims to reduce the redundancy to the smallest dataset that can represent large amounts of data collected in limited production sites, and to create datasets through data enhancement to train a flexible deep learning model can be used in various production sites. Moreover, ResNet model verifies to determine which combination of datasets is the most effective. This study discusses how to reduce and augment data that is constantly occurring in real PCB production lines, and discusses how to select coresets to learn and apply deep learning models in real sites.

• Industrial Engineering and Management Systems
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• v.12 no.4
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• pp.330-335
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• 2013

A surface mount device (SMD) assembles electronic components on printed circuit boards (PCB). Since a component assembly process is a bottleneck process in a PCB assembly line, making an efficient SMD plan is critical in increasing the PCB assembly line productivity. Feeder assignment is an important part of the SMD plan optimization. In this paper, we propose a feeder re-assign improvement algorithm for a specific type of SMD machine with a piano type multi-head gantry. Computational results on some real-world benchmark data sets show the effectiveness of our proposed algorithm.

• Journal of Electrical Engineering and Technology
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• v.7 no.5
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• pp.730-735
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• 2012

This paper presents a method to design the waveform of a back electromotive force (back EMF) of an axial flux permanent magnet (AFPM) motor using printed circuit board (PCB) windings. When the magnetization distribution of permanent magnet (PM) is given, the magnetic field in the air gap region is calculated by the quasi three dimensional (3D) space harmonic analysis (SHA) method. Once the flux density distribution in the winding region is determined, the required shape of the back EMF can be obtained by adjusting the winding distribution. This can be done by modifying the distance between patterns of PCB to control the harmonics in the winding distribution. The proposed method is verified by finite element analysis (FEA) results and it shows the usefulness of the method in eliminating a specific harmonic component in the back EMF waveform of a motor.

• Journal of Korean Society of Environmental Engineers
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• v.29 no.5
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• pp.521-527
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• 2007

To investigate the relationship between PCB sources and concentration level in soil, PCBs concentration of 8 soil samples around Shiwa industrial complex were measured. The concentration of PCBs in soil samples were ranged from 2.43 to 274 ng/g dry (0.116 to 60.5 pg WHO-TEQ/g dry) md off-gas were ranged from 48.6 to $2872ng/m^3(0.00150\sim15.2ng\;WHO-TEQ/m^3)$; these are similar levels with results of previous study in Korea. The homologue patterns in soil samples were varied from sample to sample, but isomer patterns were very similar with each other. The two principal components were extracted by Principal Component Analysis(PCA) of 8 soil samples and cumulative factor loading was 95.7%. As the result of PCA, it could be expected that PCBs in soil samples of this study were more affected by PCB products than combustion process and mostly affected by already-known sources.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.341-344
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• 2000

Several new via structures in printed circuit boards are proposed, fabricated and characterized in RF regime. The new structure with a larger inductance component in the bottom layer shows 3㏈ improvement over the conventional structure. The ADS simulation with model parameters extracted from 3D fie]d solver matches with the characterization of these vias

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• Journal of Korean Society of Environmental Engineers
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• v.27 no.2
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• pp.170-176
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• 2005

This study was conducted to investigate the level of PCBs and distribution of PCB congeners in the ambient air of Korea and Japan. The source of PCBs were also studied by a statistical method. The TEQ concentration of PCB in the ambient air of Korea and Japan were between 0.003 and $1.01\;pgTEQ/m^3$(mean value : $0.22\;pgTEQ/m^3$) and between 0.002 and $0.014\;pgTEQ/m^3$ (mean value: $0.007\;pgTEQ/m^3$), respectively. The ambient air of industrial area of Korea showed a fluctuation in PCB concentration than other sampling area. The isomer distribution patterns in the ambient air was more or less similar in all sampling places. In addition, highly chlorinated homologues ($7{\sim}10CB$) were detected in the only Korea industrial area. This observation suggests that there is a possibility of specific source of PCBs in the industrial area. The source identification of PCB in ambient air was performed using multivariate statistical analysis(principal component analysis). As a result, it is estimated that the Korean ambient air was more influenced by combustion process than the ambient air of Japan and also the effect of PCB commercial products was relatively a small.