• Resources Recycling
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• v.32 no.6
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• pp.3-9
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• 2023

Separation of LED packages from PCBs and analysis of the adhesive components was conducted to enhance the recycling potential of LED modules. LED package was separated from PCBs using heat treatment under optimal conditions: temperature of above 250 ℃ and time of 20 minutes. The separation equipment can be established using a hot air injector with controlling the rotational speed of the internal screw. The separation efficiency of each type of substrate (aluminum and glass fiber) was investigated with the thickness range of the adhesive materials (0.25-0.30 and 0.30-0.35 mm). Under the optimal conditions, the efficiency can reach to 97.5% for both types of substrates with adhesive materials of thickness 0.25~0.30mm. Characterization of the residual adhesive substances from the separated LED package and PCB using microwave digestion and ICP analysis showed that the residue contained of 95% of Sn, less than 5% of Cu and Ag.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.10 s.101
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• pp.973-981
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• 2005

A modified half wavelength loaded line antenna is designed and implemented for mobile terminal applications. The antenna is constructed with a radiating element of half wavelength loaded line structure, dielectric substrate, feeding post and two shorting posts on the experimental PCB. The shorting posts are located at each side of the radiating element and lumped inductance elements are on between each shorting post and ground of PCB. By controlling value of inductors, one can adjust resonant frequency and input impedance respectively. Within inductance value of 12 nH, the antenna can have wide operating range of $1,470\~2,660\;MHz$ and good impedance matching. The measured peak gains are between -0.45 dBi and 2.03 dBi for the operating band.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.9
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• pp.919-929
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• 2014

In recent, the requirements for the safety to the effects of high power electromagnetic wave have been increased along with the development of electricity and electronic equipments. The small sized electronic devices and the various components have been analyzed by using the full-EM simulation and solving a complete set of Maxwell equation. However, the deterministic approach has a drawback and much limitation in the electromagnetic analysis of an electrically large cavity with a high complexity of the structure. In this paper, statistical theory and topological modeling method are combined to analyze the large cavity with a complex structure. In particular, the PWB(Power Balance) method and BLT(Baum-Liu-Tesche) equation are combined and employed to solve the frequency response to the large-scaled cavity with remarkably reduced time-consumption. For instance, a PCB substrate inside box of box are considered as a large structure with a complexity.

• Journal of Advanced Navigation Technology
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• v.25 no.3
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• pp.223-228
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• 2021

In this paper, we proposed a slot-type antenna with microstrip feed embedded in a PCB for Zigbee communication (2.4 ~ 2.484 GHz). The proposed antenna is designed on a FR-4 substrate with dielectric constant 4.3, thickness of 1.6 mm, and size of 50×65 mm². Through simulations, trends of design parameters are analyzed and optimized, and the proposed antenna composed with three slots satisfy the frequency band. The measured impedance bandwidths (|S₁₁| ≤ -10 dB) of fabricated antenna are 900 MHz (2 ~ 2.9 GHz) in Zigbee frequency band. In addition, the radiation pattern showed omnidirectional characteristics for E and H-planes, and the gain of antenna in Zigbee frequency band was 1.782 dBi.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.61-67
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• 2020

In this paper, we calculated the warpage of bare substrates and chip attached substrates by using FEM (Finite Element Method), and compared and analyzed the effect of the chips' attachment on warpage. Also, the effects of layer thickness of substrates for reducing warpage were analyzed and the conditions of layer thickness were analyzed by signal-to-noise ratio of Taguchi method. According to the analysis results, the direction of warpage pattern in substrates can change when chips are attached. Also, the warpage decreases as the difference in the CTE (coefficient of thermal expansion) between the top and bottom of the package decreases and the stiffness of the package increases after chips are loaded. In addition, according to the impact analysis of design parameters on substrates where chips are not attached, in order to reduce warpage, the inner layers of the circuit layer Cu1 and Cu4 has be controlled first, and then concentrated on the thickness of the solder resist on the bottom side and the thickness of the prepreg layer between Cu1 and Cu2.

• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.308-310
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• 1997

In this paper, to anlayze electromagnetic distribution, measure the variation of relative permittivity of Glass-epoxy substrate for Computer-main-board and Tenon substrate for handphone or PCS in the frequency range $100[MHz]{\sim}1[GHz]$, in room temperature. To measure relative permittivity, suggested the Microstripline method. As the frequency increase, the variation of relative permittivity of Glass-epoxy is bigger than Tefoln's. And simulate the electromagnetic distribution on the PCBs in the infinite region applying the open boundary condition with these results by Finite Element Method.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.334-334
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• 2011

We applied N-ion bombardment and heat treatment to the Cu thin films deposited on aluminum oxide layer for the enhancement of adhesion. With e-beam evaporation method. $1,000{\AA}$ thick Cu pre-bombardment layer was deposited on the aluminum oxide surface and then N-ion beam was bombared in order to mix the atoms at the film/substrate interface. Additional $4,000{\AA}$-thick Cu film was the coated. Subsequently, the ion mixide Cu on aluminum oxide was annealed at $200^{\circ}C$ and $300^{\circ}C$ in vacuum.

• Journal of the Semiconductor & Display Technology
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• v.13 no.4
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• pp.33-36
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• 2014

In this paper, a carbon strain gauge for large strain was developed. The carbon strain gauge was fabricated by forming PCB and antenna pattern using Cu/Ni/Au film and carbon resistor pattern using screen printing process on plastic film substrate. It was possible to develop low-cost disposable strain gauge since the carbon paste was cheap and the fabrication process was simple. The wireless communication type carbon strain gauge was fabricated by integrating signal processing circuit, antenna and power all together on the same substrate as a strain gauge. The wireless communication type carbon strain gauge has a merit of being available immediately at the spot without any particular system.

• Journal of Welding and Joining
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• v.17 no.2
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• pp.61-65
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• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.