• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.79-94
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• 2002

Root cause -Thermal expansion coefficient mismatch -Tape warpage -Initial die crack (die roughness) Guideline for failure prevention -Optimized tape/Substrate design for minimizing the warpage -Fine surface of die backside Root cause -Thermal expansion coefficient mismatch - Repetitive bending of a signal trace during TC cycle - Solder mask damage Guideline for failure prevention - Increase of trace width - Don't make signal trace passing the die edge - Proper material selection with thick substrate core Root cause -Thermal expansion coefficient mismatch -Creep deformation of solder joint(shear/normal) -Material degradation Guideline for failure Prevention -Increase of solder ball size -Proper selection of the PCB/Substrate thickness -Optimal design of the ball array -Solder mask opening type : NSMD -In some case, LGA type is better

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.183-192
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• 2001

1- Buildup PCB technology is utilized to a bare chip attach substrate technology for packaging of semiconductor chip 2- Requirement for the substrate design rule is described in SIA International Technology Roadmap for Semiconductor. 3- There are seven fabrication methods of build-up technology. 4- Coating and lamination for resin and photo, and laser for micro via hope processes are available. Below $50\mu\textrm{m}$ in diameter is possible. 5- Fine pitch lines down to $30\mu\textrm{m}$ can be achieved by pattern plating with better electrical property. 6- Dielectric loss reduction is a key material improvement item for next generation build-up technology. 7- High band width up to 512 GB/s is possible with current wiring groundrule.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.149-154
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• 2018

This paper describes the fabrication and heat transfer property of 50 watts rated LED array module where multiple chips are mounted on chip-on-board type ceramic-metal hybrid substrate with high heat dissipation property for high power street and anti-explosive lighting system. The high heat transfer ceramic-metal hybrid substrate was fabricated by conformal coating of thick film glass-ceramic and silver pastes to form insulation and conductor layers, using thick film screen printing method on top of the high thermal conductivity aluminum alloy heat-spreading panel, then co-fired at $515^{\circ}C$. A comparative LED array module with the same configuration using epoxy resin based FR-4 PCB with thermalvia type was also fabricated, then the thermal properties were measured with multichannel temperature sensors and thermal resistance measuring system. As a result, the thermal resistance of the ceramic-metal hybrid substrate in the $4{\times}9$ type LEDs array module exhibited about one third to the value as that of FR-4 substrate, implying that at least triple performance of heat transfer property as that of FR-4 substrate was realized.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.4
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• pp.470-480
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• 2011

Analog ferrite phase shifters based on rectangular waveguides which are used as component of passive phased array system have high power handling capability, but it is heavy and has high cost to fabricate. In this paper, we propose an analog ferrite phase shifter using substrate integrated waveguide(SIW), which has low cost and is easy to fabricate because it uses printed circuit board(PCB) process. The proposed structure is fabricated by using centeral dielectric material removal for inserting a ferrite bar. The measured results show that the proposed structure has not only $5.1^{\circ}$/mm phase variation but also return loss variation under 12.9 dB. Therefore, it is expected that the proposed phase shifter can plays an role to reduce weight and to has low cost on the phased array system.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.27 no.2
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• pp.216-219
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• 2016

In this paper, the SIW(Substrate Integrated Waveguide)-based feeding antenna for the application of SDR(Software Defined Radar) is designed and manufactured. It is usually well-known that SIWs are easily integrated on PCB and have low transmission loss toward high powered input signal. Also, it is recommended that SIWs are strongly immunized to Electromagnetic Interferences(EMI). In particular, the manufactured antennas are loaded on the USRP(Universal Software Radio Peripheral) platform and employed to detect target RCS as an experiment in this paper. The operating frequency of the proposed antenna is in ISM(Industrial, Scientific and Medical) band(2.4~2.48 GHz) and the measured gain is over 8 dBi at 2.44 GHz.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1739_1740
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• 2009

인간의 몸의 값이 1000냥이라고 하면 그중의 눈의 값은 900냥이라는 말이 있다. 그만큼 눈이 차지하는 즉 시각이 차지하는 비중이 매우 크다고 할 수가 있겠다. 또한 하등동물보다 고등동물로 진화해갈수록 시각의 활용도가 높아지는 것과 같이 각종 기계에 있어서도 자동화가 진전될수록 머신비전(Machine Vision)기술의 의존도 또한 높아지게 되었다. 따라서 산업이 발전함에 따라 머신 비전의 기술은 여러 분야에 걸쳐 요구되고, 연구가 활발히 진행되고 있다. 하지만 기존의 패키지 형식의 머신 비전 시스템은 산업 현장에 적용하는데 가격이 비싸고, 인터페이스 문제, 환경이나 필요조건 및 요구에 의한 시스템의 대처능력이 떨어지는 문제 등을 가지고 있다. 이러한 문제를 해결하기 위한 PC 기반의 머신비젼 시스템에 관한 연구가 필수적일 수 있다. 이러한 점을 궁극적인 목표로 설정하고 본 연구는 산업현장에 적용할 수 있는 머신 비전 시스템의 최적화 설계 에 대한 기술을 연구하였다.

• Electrical & Electronic Materials
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• v.9 no.6
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• pp.626-631
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• 1996

현재 선진국에서는 전자기기에서 복사되는 전자파 및 이에 노출되었을 때의 내성에 대해서 동시에 규제하고 있다. 따라서 전자기기에서 사용하는 신호의 주파수가 점점 높아지고 회로가 집적화되므로 회로설계에 포함되지 않는 기생 소자의 영향도 연구되어져야 한다. 그러므로 이러한 조건을 모두 고려하여 초고주파 회로를 완전하게 설계제작할 수 있다면 이는 이상적인 기술이라 할 수 있을 것이다. 이것을 이루려면 많은 시간 동안의 연구와 분석을 통해 최종 생산물이 되기까지 대단한 노력이 요구된다. 본문에서는 초고주파 인쇄 회로 기판을 설계할 때 고려해야 할 점, 즉, 유전율 및 유전체의 두께, 소자 실장, 접지면 부착 및 회로의 패키지화에 관해서 소개하고자 한다.

• Journal of Electrical Engineering and Technology
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• v.10 no.3
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• pp.1154-1161
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• 2015

This paper presents a semi-lumped balun transformer using conventional PCB process and its design theory and geometry for the maximally flat response and wide bandwidth using magnetically coupled LC resonators. The proposed balun is comprised of two pairs of coupled resonators which share one among three LC resonators. It provides an identical magnitude and phase difference of 180° between two balanced ports with DC isolation and an impedance transformation characteristic. Theoretical design and analysis were performed to optimize the inductance and capacitance values of proposed balun device for obtaining the wide bandwidth and maximally flat response in its pass-band. Three balun transformers with a center frequency of 500 MHz were demonstrated for proving the concept of design proposed. They were fabricated by using lumped chip capacitors and planar inductors embedded into a conventional 4-layered PCB substrate. They exhibited a maximum magnitude difference of 0.8 dB and phase difference within 2.4 degrees.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.260-261
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• 2007

본 논문에서는 800MHz와 1.9GHz 대역의 시스템에 적용할 수 있는 20dB 방향성 결합기를 8층 PCB 기판에 내장하여 소형화 및 저가화 할 수 있도록 설계하였다. 방향성 결합기는 4층과 6층에 coupled line으로 적층함으로써, 다층 PCB기판을 최대한 활용하여 공간을 최소화하였다. 또한, 고유전율을 가진 필름을 이용하여, coupled line의 끝에 내장형 고용량 커패시터를 연결하여 설계하였다. 6 $\times$ 6 $\times$ 0.7 (height)$mm^3$ 크기로 설계된 방향성 800MHz 결합기의 경우 -20dB의 coupling 특성, -0.6dB의 transmission 특성, -25dB의 isolation 특성을 나타내었다. 패키징 기판에 내장된 방향성 결합기는 단말기 및 통신시스템의 소형화에 크게 기여할 수 있을 것이다.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.59-63
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• 2007

This paper presented a low-cost thick film gas sensor module, which was based on simple PCB (Printed Circuit Board) process. The proposed sensor module included a $NO_2/H_2$ gas sensor, a relative humidity sensor, and a heating element. The $NO_2/H_2$ gas and relative humidity sensors were realized by screen-printing $SnO_2,\;BaTiO_3$ nano-powders on IDTS (Interdigital Transducer) of a PCB substrate, respectively. At first 1% $H_2$ gas flowed into the sensor chamber. After 4 min, air filled the chamber while $H_2$ gas flow stopped. This experiment was performed repeatedly. The Identical procedure was used for the $NO_2$ detection. The result for sensing $H_2$ gas showed the increase of voltage from 0.8V to 3.5V due to the conductance increase and its reaction response time by hydrogen flow was 65 sec. $NO_2$ sensing results showed 2.7 V voltage drop due to the conductance decrease and its response time was 3 sec through a voltage monitoring.