• Korean Journal of Computational Design and Engineering
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• v.9 no.4
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• Environmental Analysis Health and Toxicology
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• v.4 no.1_2
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• pp.11-17
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• 1989

A quantitative analytical method of highly concentrated PCB is established in the research. With the quantitative analytical method PCB of insulating oil was examined. The following conclusions are derived from this research. 1. The recovery ratio was 95.7% with the quantitative analytical method, which indicates it can be used for the analysis of PCB. 2. PCB concentration of insulation oil in waste condenser was found to be 21.2% thru 13.85% , which was highly concentrated. 3. PCB insulation oil in waste condenser was same as PCB-42.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.59-66
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• 2018

In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.5
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• pp.412-417
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• 2005

The objective of study is design and structural analysis of multi-axis drill machine for PCB. This is able to reduce the unit cost of manufacture and to ensure safety, that is with the result of analysis by design the multi-axis drill machine for the use of PCB to enhancing suitability and exactitude in mass production the process of PCB.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.10
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• pp.2052-2058
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• 2009

As the operating frequency of digital system increases and voltage swing decreases, an accurate and high speed analysis of PCB board becomes very important. Transmission matrix method, which use the multiple products of unit column matrix, is the highest speedy method in PCB board analysis. In this paper a new method to reduce the calculation time of PCB board impedances is proposed. First, in this method the eigenvalue and eigenvectors of the transmission matrix for unit column of PCB are calculated and the transmission matrix for the unit column is transformed using similarity transform to reduce the number of multiplication on the matrix elements. This method using the similarity transform can reduce the calculation time greatly comparing the previous method. The proposed method is applied to the 1.3 inch by 1.9 inch board and shows about 10 times reduction of calculation time. This method can be applied to the PCB design which needs a lots of repetitive calculation of board impedances.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.

• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.113-118
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• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.4
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• pp.507-514
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• 2012

This paper proposed the analysis method of the cavity resonance characteristics for a metallic enclosure with a PCB trace source. In order to calculation the electromagnetic fields inside the cavity, coupled integral equations for a current distribution on the PCB trace and an aperture electric field distribution on the boundary of the PCB dielectric are derived and solved by applying Galerkin's method of moments. The result show that the resonant characteristics of the metallic enclosure are fairly good agreement with the simulation(HFSS) and the measured results. The resonant frequencies of the metallic enclosure with the PCB trace are changed by the PCB trace location inside of the cavity. In order to check the validity of the theoretical analysis, the calculated return losses are compared with the measured results.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.8
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• pp.1219-1226
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• 2013

This study is the analysis and verification process of the L-band satellite communications repeater thought PCB & circuit EM analysis. System performance can be vulnerable to various spurious inside the L-band satellite transponder, power conversion board, digital signal board, TM/TC board, such as control panels and blocks that are linked signal components when the winch is increased due to the noise component. So the whole system can cause performance degradation. PCB resonance analysis and EM simulation can be easily analyzed for a variety of optimal. Also, by setting the ports on the PCB, H/W designer wants to can easily analyze system.

• The Journal of Information Technology
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• v.3 no.4
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• pp.13-21
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• 2000

The thesis is for the analysis of the current trend adapted for the method of the test information exchange in the environment of the internal circuit in case of PCB design, The design process is most powerful for improving test characteristics among the entire process of PCB. The PCB is more and more difficult to test as the processes proceed because the nodes become more and more complicated. The data exchange for improving PCB test performance should be easy in order to provide more reliable products in the shorter period. The design technology oriented for the test makes the PCB and its components tested reliably and quickly so that it can effectively improve the quality of the PCB and largely reduce the time and cost of the test development, In addition it can make the substantial standardization In improve the speed of the repeated test and treatment so that the Period of development can be shorter. Also, it helps to effectively detect the potential defects of the products, so that highly reliable PCB can be produced.