• Journal of Powder Materials
• /
• v.15 no.2
• /
• pp.81-86
• /
• 2008

최근프린팅기술은 전자부품소재 산업의 대형화 및 저가격화의 해법으로 기대되고 있다. 특히 전자부품소재 프린팅 기술 중 잉크젯공정은 최신 디스플레이용 전극소재, PCB, FPCB 및 기타 소재공정에 이용하려는 움직임이 활발히 진행되고 있다. 그러나 잉크젯 기술은 재료의존도 비중이 높은 기술로서 소재(금속잉크)의 개발이 최우선시 되어야한다. 전자부품소재용 금속잉크에 사용되는 금속 나노입자는 우수한 전기전도성과 산업적응용이 가능해야 한다. 따라서 최근 연구되고 있는 금속 나노입자의 연구결과 중 전자잉크에 적용 가능한 연구결과와 응용분야에 대하여 서술하였다.

• IE interfaces
• /
• v.13 no.2
• /
• pp.195-203
• /
• 2000

This paper considers the problem of sequencing printed circuit boards(PCBs) on an automatic surface mount device(SMD) placement machine in order to minimize total setup time. Since the total set of component feeders needed by all boards cannot be loaded simultaneously on the magazine, the setup must be made between two successive boards in the sequence. It is assumed that the setup time depends on the number of component feeders to be replaced in the magazine. An important characteristic is that each feeder occupies a different number of slots in the magazine. This problem is equivalent to travelling salesman problem(TSP) except that the distances between two cities, that is, the setup times between two boards, are not known in advance. So, TSP-based heuristics with new distance functions are presented and their performances are compared through various test problems. Computational results indicate that our heuristics outperform existing methods.

• IE interfaces
• /
• v.23 no.1
• /
• pp.58-67
• /
• 2010

The purpose of this paper is to present the development processes of the assembly line tester of power transmission for lift truck. Because power transmission is most important part of lift truck, all assembled powertrain parts must be inspected for operational defects, pressures and RPM. Developed assembly line tester is designed to take about 25 minutes for inspecting each assembled power transmission and located it at the end of assembled line. The assembly line no-load tester consists of three parts: (1) the driving hardware part; for installing and operating the transmission. (2) control PCB part; send data from sensors to a computer and control driving part, (3) operation software of no-load tester; for an automatic inspection or manual inspection, for database management and printing transcripts.

• Journal of the Korean Society of Industry Convergence
• /
• v.12 no.4
• /
• pp.215-219
• /
• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• Journal of the Korean Society of Industry Convergence
• /
• v.20 no.2
• /
• pp.187-194
• /
• 2017

This study examined the validity and reliability of the thermal safety design, in order to maintain the heat generated from integrated circuit (IC) chips in the converter, condenser, resistor, and transistor (which are considered as heat sources for thermoelectric devices with a printed circuit board) below target levels during the process of developing a control board and a main power board. The study analyzed the heat generation and dissipation characteristics of the entire printed circuit board (PCB) model to examine its thermal safety.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2012.05a
• /
• pp.64.2-64.2
• /
• 2012

전자산업에서 소자를 제작하는 핵심공정으로써, 패턴을 형성하는 방식은 식각 마스크를 통해 이루어진다. 공정 순서는 원하는 물질을 증착한 후 사진공정 (photolithograpy)을 통하여 원하는 패턴의 감광제 식각마스크 (etch mask)를 형성하게 된다. 이후, 습식식각이나 건식식각을 통하여 물질의 불필요한 부분을 제거한 후 최종적으로 감광제 식각마스크를 제거하여 원하는 물질의 패턴을 얻게 된다. 최근에 소개된 잉크젯 프린팅 기술 (inkjet printing technology)은 나노 잉크를 이용하여 사진공정과 식각공정을 이용하지 않고, 직접 나노잉크를 분사하여 패턴을 형성하는 방법으로, 패터닝 공정을 단순화 시킬 수 있을 뿐만 아니라 각종 전자 산업의 환경오염물을 획기적으로 줄일 수 있는 친환경기술이다. 특히, OLED, O-TFT, RF-ID, PCB 분야 등 다양한 전자산업분야의 제조기술로서 응용하고자, 전도성 폴리머나 실버 (silver) 나노파티클 잉크를 이용한 전도성 라인 패터닝 (line patterning)에 관한 연구가 활발히 진행되고 있다. 본 강연에서는 친환경 생산공정기술 측면에서의 잉크젯기술을 분석하고, 기술의 구성요소, 응용분야, 기술 동향에 관해서 소개하고, 또한 현재 한국생산기술연구원에 진행하고 있는 잉크젯 프린팅 기술 기반의 인쇄전자 분야에 관한 내용을 소개한다.

• Proceedings of the Korea Society for Industrial Systems Conference
• /
• 2008.10b
• /
• pp.617-622
• /
• 2008

최근 멀티미디어 산업의 급속한 발달로 다양한 목적의 멀티미디어 제품 군들이 있다. 이러한 멀티미디어 제품은 대부분 휴대용으로 리튬폴리머 배터리를 내장하여 언제 어디서나 듣고, 청취하기 위해 대부분이 소형화된 기기들이다. 본 논문은 모바일 휴대폰에 소형의 FN 송신무선 핸즈프리 기반을 접목하여 사운드 확장과 성능향상에 대하여 연구하였다 FM 주파수대역은 할당 받지 않은 개인이 사용하기에는 출력 제약을 받기 때문에 무선 성능이 좋지 않다. 이를 향상하기 위해 PCB 패턴 안테나를 설계와 함께 안테나 급전부 연결방법 연구 결과로 통화 잡음을 제거하여 좋은 출력특성결과를 가져왔다. 이후 이를 모바일 존에 적용하여 거리에 따른 통화 감도를 높이기 위한 마이 이득 조절기능과 무선 FM 송신으로 수신 측 스피커를 이용하여 청취하므로 사운드확장 장점이 있으며, 통화 잡음을 제거하기 위한 검증시험 및 통합시험을 수행하였다.

• Journal of the Korean Society of Industry Convergence
• /
• v.22 no.3
• /
• pp.373-379
• /
• 2019

Nowadays, the IoT portable electronic devices have become more useful and diverse, so they require various supply voltage levels to operate. This paper presents a DC-DC buck converter with pulse width modulation (PWM) for portable electronic devices. The proposed step-down DC-DC converter consists of passive elements such as capacitors, inductors, and resistors and an integrated chip (IC) for signal control to reduce power consumption and improves ripple voltage with the resolution. The proposed DC-DC converter is simulated and analyzed in PSPICE circuit design platform, and implemented on the prototype PCB board with a Texas Instruments LM5165 IC. The proposed buck converter is showed 92.6% of peak efficiency including a load current range of 4-10 mA, 3.29 mV of the voltage ripple at 5 V output voltage for the supply voltage 12 V. Measured and Simulated power efficiency are made good agreement with each other.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.29 no.3
• /
• pp.310-321
• /
• 2019

Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

• Fire Science and Engineering
• /
• v.14 no.2
• /
• pp.33-38
• /
• 2000

Flux, essentially used in soldering process of PCB (Printed Circuit Board) in electronics industry, contains IPA (Isopropyl alcohol) and methanol, which are highly inflammable and explosive. Hazard Chemical Controlling Law classified methanol as toxic material and Environmental Law classified methanol as VOC (Volatile Organic Compound). So there have been pressing needs of developing substitutes for the existing Flux. New solvent which is non-flammable and main component is DCP having same specific character of the existing Flux. It's been combirated with proper composition ratio adding stabilizer. As a result, it relieved working Environment Allowance thickness 200 ppm to 470 ppm, chance of not been soldered 0.083% to 0%, spread 85% to 87%, power saving resistance 1.0$\times$$10^{12}$$\Omega$ to 6.9$\times$$10^{12}$$\Omega$, which means a lot better than the existing Flux. Therefore, Flux confirmed the chance of improving productivity, safety, environment safety and quality. Also, Flux got a satisfied result after product quality test and product reliability test.