• Proceedings of the KSR Conference
• /
• 2011.05a
• /
• pp.1445-1456
• /
• 2011

This paper presents the research of Low Pass Filter(hereinafter called "LPF") which is the part of Chopper Gate Control Unit on the electric rolling stock. Chopper Gate Control Unit controling the propulsive equipments of electric rolling stock consists of several electronic parts, PCB, Power Supply, Gate Circuit Amp, Freon Cooling Device, and has been used the parts made by japan manufacturer Mitsubish. But these parts recently have been more broken down and slow down performance because of long-term use, deterioration. Most of the malfunctions are low performance of LPF. Furthermore, it is physically impossible to repair LPF. Because it is molding type part and no longer manufactured. Also it needs high cost for custom-building. Therefore, it is now making up for through self-developed LPF and operating on Busan metro 1st after on-board testing. This research performed the PS Pice simulation testing, analysis of self-developed LPF performance and the wave form characteristic by multi-function synthesizer, spectrum analyzer, oscilloscope.

• Proceedings of the KAIS Fall Conference
• /
• 2010.11b
• /
• pp.941-943
• /
• 2010

근래 LED 조명기기 연구는 출력이 낮은 조명기기에서 고출력 전원을 이용한 고휘도 제품 개발로 바뀌는 추세이다. 고출력을 이용할 경우 단순히 히트싱크 형상, PCB 배치 및 물성 변경을 통한 방열문제 해결 방법으로는 LED 조명기기의 수명감소 문제를 해결하는데 한계가 있다. 따라서 방열능력을 더욱 향상시킬 수 있는 히트파이프(heat pipe)의 필요성이 대두되었다. 본 연구에서는 히트파이프를 이용해 고출력 LED 조명기기 개발을 위한 연구를 수행하였다.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.38 no.8
• /
• pp.869-874
• /
• 2014

It is possible to fabricate a three-dimensional (3D) shape using the solid freeform fabrication (SFF) technology. However, there are several problems in applying conventional SFF technologies to the direct manufacturing of a product. Hence, multimaterial SFF is gaining attention. Moreover, a 3D circuit device that is different from a conventional two-dimensional PCB can also be fabricated using multimaterial SFF. In this study, a hybrid system using fused deposition modeling and direct writing was designed for 3D circuit device fabrication.

• Journal of the Microelectronics and Packaging Society
• /
• v.16 no.2
• /
• pp.43-50
• /
• 2009

Although thin PCBs(Printed Circuit Boards) have recently been required for high density interconnection, high electrical performance, and low manufacturing cost, the utilization of thin PCBs is severely limited by warpage and reliability issues. Warpage of the thin PCB leads to failure in solder-joints and chip. The $B^2it$(Buried Bump Interconnection Technology) for PCB has been developed to achieve a competitive manufacturing price. In this study, chip temperature, package warpage, chip stress and solder-joints stress characteristics of the PCB prepared with $B^2it$ process have been calculated using thermo-mechanical coupled analysis by the FEM(Finite Element Method). FEM computation was carried out with the variations in bump shapes and kinds of materials under 1.5W power of chip and constant convection heat transfer. The results show that chip temperature distribution reached more quickly steady-state status with PCB prepared with $B^2it$ process than PCB prepared with conventional via interconnection structure. Although $B^2it$ structures are effective on low package warpage and chip stress, with high strength bump materials arc disadvantage for low stress of solder-joints. Therefore, it is recommended that optimized bump shapes and materials in PCB design should be considered in terms of reliability characteristics in the packaging level.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.30-30
• /
• 2007

현재 다양한 종류의 RF 통신 제품이 시장에 등장하면서 제품의 경쟁력 확보에 있어 소형화 정도가 중요한 이슈가 되고 있다. Passive Device는 RF Circuit을 제작할 때 많은 면적을 차지하고 있으며 이를 감소시키기 위해 여러 연구가 진행되고 있다. 가장 효과적인 방법으로 반도체 집적기술로 크기를 줄이는 방법이 있으나, 공정이 비싸고 제작 시간이 오래 걸려 제품개발 시간과 개발비용이 상승하게 된다. 반면에 SoP-L 공정은 PCB 제작에 이용되는 일반적인 재료와 공정을 사용하므로 개발 비용과 시간을 줄일 수 있다. SoP-L의 또 하나 장점은 다종 재료를 다층으로 구성할 수 있다는 점이다. 최근 chip-type의 Device를 PCB 기판 안에 내장하는 방법의 RF Circuit 소형화 연구가 많이 진행되고 있다. 본 연구에서는 SoP-L 공정으로 chip-type 수동소자를 PCB 기판 내에 함몰하여 수동소자회로를 구현, 분석하여 보았다. 수동소자회로는 880 MHz~960 MHz(GSM) 영역과 1.71 GHz~1.88 GHz(DCS) 영역을 나누는 Diplexer를 구성하였다. 1005 size의 chip 6개로 구현한 Diplexer를 표면실장과 함몰공정으로 제작하고 Network Analyzer로 측정하여 비교하였다. chip 표면실장으로 구현된 Diplexer는 GSM에서 최대 0.86 dB의 loss, DCS에서 최대 0.68 dB의 loss가 나타났다. 표면실장과 비교하였을 때 함몰공정의 Diplexer는 GSM 대역에서 약 0.5 dB의 추가 loss가 나타났으며 목표대역에서 0.6 GHz정도 내려갔다. 이 결과를 바탕으로 두 공정 간 차이점을 확인하고, 함몰공정으로 chip-type 수동소자를 사용하였을 때 고려해야 할 점을 분석하였다. 이를 바탕으로 SoP-L 함몰공정의 안정성을 높여서 이것을 이용한 회로의 소형화에 적용이 가능할 것으로 기대한다. 특히 능동소자의 DC Power Control에서 고용량의 수동소자를 이용할 때 집적도를 높일 수 있을 것이다.

• Clean Technology
• /
• v.17 no.4
• /
• pp.306-313
• /
• 2011

Flux or solder is used in soldering process for manufacturing electronic parts such as printed circuit boards (PCB). After soldering process, residual flux and solder paste on the parts should be removed since their residuals could cause performance degradation or failure of parts due to their corrosion and electric leakage. Ozone depletion substances such as 1,1,1- trichloroethane (TCE) and HCFC-141b have widely been using for removal of residual flux and solder paste after soldering process In manufacturing of electronic parts until now. In this study, non-aqueous cleaning agents without flash point were developed and applied to industrial field for replacement of cleaning agents with ozone depletion. In order to develop non-aqueous cleaning agents without ethers, esters, fluoride- type solvents. And their physical properties and cleaning abilities were evaluated, and they were applied to industrial fields for cleaning of flux and solder on the PCB. And vacuum distillation apparatus were operated to determine their operating conditions and recycling yields for recycling of used cleaning agents formulated in this study. As a result of physical properties measurement of our formulated cleaning agents, they were expected to have good wetting and penetrating power since their surface tensions were relatively low as 18.0~20.4 dyne/$cm^2$ and their wetting indices are relatively large. And some cleaning agents holding fluoride-type solvents as their components did not have any flash point and they seemed to be safe in their handling and storage. The cleaning experimental results showed that some cleaning agents were better in their cleaning of flux and solder paste than 1,1,1-TCE and HCFC-141b. And industrial application results of the formulated cleaning agents for cleaning PCB indicated that they can be applicable to industry due to their good cleaning capability in comparison with HCFC-141b. The recycling experiments of the used formulated cleaning agents through a vacuum distillation apparatus also showed that their 91.9~97.5% could be recycled with its proper operating conditions.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.204.1-204.1
• /
• 2014

스마트폰과 같은 통신기기 및 각종 전자제품에 있어 크기의 축소와 간소화 추세에 따라 인쇄회로기판(PCB)의 초미세회로설계 기술이 요구됨에 따라, 인쇄회로기판과 첨단 전자부품 사이의 접합 신뢰성을 향상시키기 위해 무전해 니켈 도금이 널리 사용되고 있다. 일반적으로, 무전해 Ni도금은 강산, 강염기성 용액을 이용하여 수행되고 있다. 따라서, 공정과정 중에 기판의 손상을 초래하기도 할뿐만 아니라, 환경적으로도 문제시 되고 있다. 본 연구에서는 친환경적 도금공정의 개발을 위해 중성에서 N-(B)무전해 도금을 시행하였다. 중성의 무전해 도금공정은 어떠한 기판을 사용하여도 기판의 손상없이 도금이 가능하다는 장점을 가지고 있고, Boron(B)은 Ni을 비정질화 시키는 물질로 알려져 있다. B가 첨가된 무전해 Ni도금 박막에 있어 B의 영향을 알아보기 위하여 중성조건에서 B를 포함한 DMAB의 첨가량을 조절하였다. Ni-(B) 무전해 도금 시 도금조의 온도는 $40^{\circ}C$로 하였고, 무전해 도금액의 pH는 7(중성)로 유지하였다. Cu Foil기판을 사용하여 DMAB의 양에 따라 성장된 Ni-B무전해 도금 박막의 특성을 분석하기 위해 X-ray Diffraction (XRD), Field Emission Scanning Electron Microscope (FE-SEM), Optical microscope (OM), X-ray Photoelectron Spectroscopy (XPS), X-ray Absorption Spectroscopy (XAS)을 이용하였다.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.25 no.3
• /
• pp.79-87
• /
• 2019

The degree of cosmetic's oxidation depends on the storage conditions and external conditions when using the product. The microbial contamination and oxygen exposure often results in the quality deterioration of cosmetics. In addition, the problem is that consumers often use cream-type cosmetics, which have short expiration period (6-12 months), even after the product is expired. When using the deteriorated cosmetics, it can be fatal to consumers' safety including some symptoms such as folliculitis, rashes, edema, and dermatitis. Therefore, it is necessary to develop sealed smart packaging for cosmetics to prevent the deterioration of cosmetics and improve consumer safety. In this study, we have developed smart packaging design for cosmetics that can measure the surrounding environment and expiration date for the cosmetics in the real time. In addition, the smart packaging includes sensor, which are linked to the mobile application. Users can find out the measurement results through the application. Also, the packaging design and functions were set up based on the survey results by the user and feasible model can be produced based on user choice. The measurement in the three environment has been done after manufactured the sensor, PCB, and mobile application. As a result, it works normally within a certain range under all three environmental conditions. It is believed that the information on expiration dates and storage environment can be efficiently delivered to the consumers through developed cosmetics smart packaging and applications. The development of UI/UX design for consumer is further studied. The UX/UI design of the application plays an essential role in achieving this goal through the commercialization the cosmetic products in the wide range.