• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• Journal of Information Processing Systems
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• v.16 no.6
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• pp.1271-1280
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• 2020

The yield and quality of a micromanufacturing process are important management factors. In real-world situations, it is difficult to achieve a high yield from a manufacturing process because the products are produced through multiple nanoscale manufacturing processes. Therefore, it is necessary to identify the processes and equipment that lead to low yields. This paper proposes an analytical method to identify the processes and equipment that cause a defect in the plastic ball grid array (PBGA) during the manufacturing process using logistic regression and stepwise variable selection. The proposed method was tested with the lot trace records of a real work site. The records included the sequence of equipment that the lot had passed through and the number of faults of each type in the lot. We demonstrated that the test results reflect the real situation in a PBGA manufacturing process, and the major equipment parameters were then controlled to confirm the improvement in yield; the yield improved by approximately 20%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.805-811
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• 2000

Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.59-62
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• 2013

Experimental analyses on the solder joint reliability of plastic ball grid array under harsh random vibration were presented. The chips were assembled on the daisy chained circuit boards for the test samples preparation, half of which were processed for underfill to investigate the underfill effects on the solder failures. Acceptance and qualification levels were applied for the solder failure tests, and the overall controlled RMS of the power spectrum densities of the steps were 22.7 Grms and 32.1 Grms, respectively. It was found that the samples survived without any solder failure during the tests, demonstrating the robustness of the packaging structure for potential avionics and space applications.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.7
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• pp.1302-1308
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• 2002

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) package are characterized by high sensitive moire interferometry. Moire fringe patterns are recorded and analyzed for several bending loads and temperatures. At the temperature higher than $100^{\circ}C$, the inelastic deformation in solder balls become more dominant, so that the bending of the molding compound decreases while temperature increases. The deformation caused by thermally induced bending is compared with that caused by mechanical bending. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder.

• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1027-1032
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• 2003

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $Moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for a single-sided package assembly and a double-sided package assembly are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one. The largest of effective strain occurred in the solder ball located at the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one.

• Journal of Mechanical Science and Technology
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• v.18 no.9
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• pp.1572-1581
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• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.90-95
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• 2001

Thermo-mechanical and flexural behavior of a wire-bond plastic ball grid array (WB-PBGA) are characterized by high sensitive $moir{\acute{e}}$ interferometry. $Moir{\acute{e}}$ fringe patterns are recorded and analyzed at several various bending loads and temperature steps. At the temperature higher that $100^{\circ}C$, the inelastic deformation in solder balls became more dominant. As a result the bending of the molding compound decreased while temperature increased. The strain results show that the solder ball located at the edge of the chip has largest shear strain by the thermal load while the maximum average shear strain by the bending moment occurs in the end solder. The results also show that $moir{\acute{e}}$ interferometry is a powerful and effective tool in experimental studies of electronic packaging.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)