• 한국세라믹학회지
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• 제26권3호
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• pp.371-380
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• 1989

The purpose of this experiment is to elucidate the reaction mechanism concerning to the formation of crystalline BaTiO3 synthesized by adding the pH control agent(KOH soln) in TiCl4 and BaCl2 solution (Wet direct synthetic method). In this expeirment, it is identified that the amorphous barium-titanate having Ba-O-Ti bonding is formed above pH5 due to the -OH- ion and Ti-gel is formed below pH5 due to the polymerization of metatitanic acid. The bonding of the amorphous Ba-O-Ti is identified by FT-IR spectrum and crystallization temperature is about 82$0^{\circ}C$. If the pH of the above system according to the -OH- ion concentration is above 13.8, the polymerized metatitanic acid will be depolymerized and produce [TiO3]2+ion and crystalline BaTiO3 is formed by reacting the produced [TiO3]-- ion with the active Ba++ ion.

• 한국세라믹학회지
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• 제50권4호
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• pp.294-300
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• 2013

The effect of chemical treatments of porous silicon in organic solvents on its nanostructural and optical features was investigated. When the porous Si was dipped in the organic solvent with various PH values, the morphological, chemical, and structural properties of the porous silicon was sensitively affected by the chemical conditions of the solvents. The size of silicon nanocrystallites in the porous silicon decreased from 5.4 to 3.1 nm with increasing pH values from 1 to 14. After the samples were dipped in the organic solvents, the Si-O-H bonding intensity was increased while that of Si-H bonding decreased. Photoluminescence peaks shifted to a shorter wavelength region in the range of 583 to 735 nm as the pH value increased. PL intensity was affected by the size as well as the volume fraction of the nanocrystalline silicon in the porous silicon.

• Restorative Dentistry and Endodontics
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• 제24권1호
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• pp.156-165
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• 1999

The purpose of this study was to evaluate the effect of surface treatments on the shear bond strength between new and old composites. Circular cavities prepared on the center of acrylic resin mold and the prepared cavities were filled with composite resin. They randomly assigned into control group and 8 groups according to the difference in surface treatments of old composites; Control group: no surface treatment, Group 1: surface treated with #120 SiC paper & bonding agent, Group 2: surface treated with #400 SiC paper & bonding agent, Group 3: surface treated with #120 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 4: surface treated with #400 SiC paper, 32% $H_3PO_4$ & bonding agent, Group 5: surface treated with #120 SiC paper, primer & bonding agent, Group 6: surface treated with #400 SiC paper, primer & bonding agent, Group 7: surface treated with #120 SiC paper, 32% $H_3PO_4$, primer & bonding agent, Group 8: surface treated with #400 SiC paper, 32% $H_3PO_4$, primer & bonding agent. New composites were applicated on the old composites of experimental groups. The shear bond strengths for the experimental specimen were measured and the results were analyzed by using one way ANOVA. The observations of surface morphology after SiC paper roughening and debonded surface morphology after shear bond strength test were done by SEM. The results were as follows; 1. Shear bond strengths for specimens roughened with #120 SiC paper matching with the particle size of coarse diamond bur were significantly higher than those for the specimens with #400 SiC paper(P<0.05). By SEM, the surface of the specimens roughened with #120 SiC paper was more irregular than the specimens with #400 SiC paper. 2. Shear bond strengths for specimens treated with 32% $H_3PO_4$ etchant, primer, bonding resin were significantly higher than those for specimens treated with 32% $H_3PO_4$ and bonding resin(P<0.05). 3. Shear bond strengths for the specimens treated with 32% $H_3PO_4$ etchant and bonding resin were significantly higher than those for specimens treated with only bonding resin(P<0.05). There was no remarkable change of surface morphology after 32% $H_3PO_4$ etching. 4. It was possible to observe mixed fracture patterns (the cohesive fracture of old composite and the adhesive fracture between old and new composite) in the specimens roughened with #120 SiC paper, but almost adhesive fracture in the specimens roughened with #400 SiC paper.

• Restorative Dentistry and Endodontics
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• 제20권2호
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• pp.856-868
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• 1995

The effect of collagen dissolution in acid conditioned dentin layer on resin - dentin adhesion was investigated. 160 freshly extracted human molars were divided into 4 groups randomly and dentin surfaces were exposed. 40 exposed dentin surfaces were not acid conditioned and each 10 of them were applied with bonding agents within dentin bonding systems of All Bond 2, Scotchbond Multipurpose, Clearfil Photobond and Superbond D - Liner respectively. Each 10 of another 40 exposed dentin surfaces were acid conditioned by the acid within the above four bonding systems respectively and applied with corresponding bonding systems. After acid conditioning of the other 40 exposed dentin surfaces as above, they were treated with 5% NaOCl for 2 minutes, and each 10 of them were applied with the above four dentin bonding systems respectively. The remaining 40 dentin surfaces were acid conditioned and treated with 10% NaOCl for 2 minutes, and each 10 of them were applied with corresponding bonding agents as the above. After the procedures were finished, composite resin (Z -100, 3M Dent. Prod., USA) were applied on the dentin surfaces and light cured. Shear bond strength values were measured. Surface changes of fractured dentin specimens were observed using SEM (Hitachi S-2350, Japan). The following results were obtained. 1. In all of dentin bonding systems, shear bond strengths of non - conditioned specimens were significantly lower than those of acid conditioned specimens (P<0.05). 2. A statistically significant difference of bond strengths did not exist between acid conditioned specimens and 5% NaGCI retreated specimens applied with All Bond 2, Scotchbond Multipurpose and Clearfil Photobond (P>0.05). However, strength values of 5% NaOCl retreated specimens applied with Superbond D - Liner were lower than those of acid conditioned specimens (P<0.05). 3. In all the applied dentin bonding systems except Clearfil Photobond, bond strengths of 10% NaOCl retreated specimens were lower than those of acid conditioned and 5% NaOCl retreated specimens (P<0.05). 4. The resin - dentin hybrid layer of 4 - $5{\mu}m$ thickness was formed in the acid conditioned specimens applied with All Bond 2, Scotchbond Multipurpose and Superbond D-Liner. 5. The resin - dentin hybrid layer of 3 - $4{\mu}m$ thickness was still formed in the 5% NaOCl retreated specimens applied with All Bond 2 and Scotchbond Multipurpose. In addition, this layer was not completely removed after the retreatment with 10% NaOCl. Above results indicate that the dissolution of collagen in acid conditioned dentin layer by NaOCl solution can not be achieved completely and the collagens contribute to the resin - dentin adhesion considerably.

• Restorative Dentistry and Endodontics
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• 제31권2호
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• pp.103-112
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• 2006

본 실험에서는 자가부식형 접착제와 콤포짓트 레진 사이의 산도의 차이를 완화시킬 수 있는 접착레진을 자가부식형 접착제 위에 추가적으로 도포할 경우, 상아질에 대한 접착력을 개선할 수 있는지를 연구하였다. 자가부식형 접착제로는 실험실에서 직접 제작한 실험용 자가부식형 접착제 (pH: 1.96)와 Adper Prompt (3M ESPE, VSA, pH: 1.0)를 사용하였으며, 중성의 접착레진으로 All-Bond 2의 D/E bonding resin (Bisco Inc., USA, pH: 6.9)을 사용하였다. 두 대조군에서는 두 가지 자가부식형 접착제를 각각 두번씩 도포하였으며, 두 실험군에서는 각 자가부식형 접착제를 한번 도포한 후 그 위에 D/E bonding resin을 추가 도포하였다. Z-250 하이브리드 복합레진을 쌓아올려 모레시계 형태의 시편을 제작하여 미세인장강도를 측정하고 t-test를 이용하여 비교하였다. 파절 양상은 입체현미경과 주사전자현미경을 이용하여 관찰하였다. D/E bonding resin을 추가 도포한 미세 인장접착강도는 유의하게 증가되었고, 접착층과 복합레진 또는 접착층과 상아질 사이의 파절을 보인 시편의 수는 감소하고, 접착층 내의 파절을 보인 시편의 수는 증가되었다. 따라서 자가부식형 접착제와 복합레진의 산도의 차이를 완화할 수 있는 중성의 접착레진을 추가 도포할 경우 미세인장접착강도를 증가시킬 수 있음을 확인하였다.

• Journal of Oral Medicine and Pain
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• 제31권3호
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• pp.211-221
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• 2006

목적 전통적 고속 회전식 절삭기구 또는 Er:YAG 레이저로 삭제된 상아질에, 두가지 다른 접착 시스템을 적용한 후, 축조한 컴포지트 레진의 미세인장결합강도를 비교하고, 다양한 Er:YAG 레이저 에너지가 미세인장결합강도에 미치는 영향을 평가한다. 재료 및 방법 40개의 제3대구치를 사용하여, 평평한 상아질면을 만든 후 8개의 군으로 나누어, 4가지 절삭방법 (고속 회전식 절삭기구, 2 W, 3 W, 4 W 출력의 Er:YAG 레이저) 중 한 가지로 삭제하고, 2가지 접착 시스템 (Scotchbond Multipurpose Plus, Clearfil SE bond) 중 한 가지로 처리하여 컴포지트 레진을 축조하였다. 24시간의 저장 후, 각 시편을 결합면에 수직으로 자르고, 미세인장결합강도를 측정하였다. 각 군의 미세인장결합강도는 평균$\pm$표준 편차로 표현하였고, 통계분석을 위해 two-way ANOVA, one-way ANOVA, student-Newman-Keuls' multiple comparison test, 그리고 t-test가 사용되었다. 결과 및 결론 1. 접착시스템과 관계없이, 절삭방법에 따른 미세인장결합강도의 유의한 차이가 있었고, 높은 순서대로 나열하면 다음과 같다: 3 W, 2 W, Bur, 4 W (p<0.001). 2. 절삭방법과 관계없이, Scotchbond Multipurpose Plus로 처리한 군이 Clearfil SE bond로 처리한 군보다 유의하게 높은 미세인장결합강도를 나타냈다 (p<0.001). 3. Scotchbond Multipurpose Plus로 처리한 군 중에서, 3 W 레이저 절삭군이 가장 높은 미세인장결합강도를 나타냈고, 다음이 Bur, 2 W, 4 W 절삭군 순이었다 (p<0.001). 4. Clearfil SE bond로 처리한 군 중에서 3 W 레이저 절삭군이 가장 높은 미세인장결합강도를 나타냈고, 다음이 2 W, 4 W, Bur 절삭군 순이었다 (p<0.001). 5. 두 가지 접착 시스템 모두에서, 레이저로 절삭한 군의 미세인장결합강도의 차이가 있었고, 높은 순서대로 나열하면 3 W, 2 W, 4 W 순이었다 (p<0.001). :상아질에 접착된 컴포지트 레진의 미세인장결합강도는 절삭방법과 접착시스템의 상호작용에 의해 유의한 영향을 받았다. 임상에서 레진 수복시, 2 W-3 W 범위내로 Er:YAG laser를 사용한다면 전통적 핸드피스 못지않게 수복물의 우수한 결합강도를 얻을 수 있다. 특히 시술시간의 단축, 과도한 산부식에 따른 부작용의 예방을 위해 Clearfil SE bond를 포함한 self etching system을 사용하고자 한다면 bur보다 Er:YAG laser를 이용한 삭제방법이 더 유용한 결합력을 제공할 것이다.

• 대한화학회지
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• 제18권2호
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• pp.126-131
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• 1974

비수용성 긴고리 지방족 아민인$(n-C_8H_{17})_3N$과 $(n-C_8H_{17})_3NCH_3Cl$을 사용하여 산도가 틀린 텅그스텐산수용액(pH=2, 4, 6)으로 부터 용매추출법에 의하여 유기용매에 녹는 다중텅그스텐산아민염을 제조하는데 성공하였다. 제조된 텅그스텐산 아민염의 분자량을 벤젠용매에서 더미스트를 이용한 감도 1/$4000^{\circ}C$의 훼트스톤 브리지를 사용하여 측정할 수 있었다. 분자량 측정결과와 화학분석 및 적외선 스펙트럼으로 부터 pH=2, 4에서 생긴 아민염은 메타텅그스텐산염, pH=6에서 생긴 아민염은 파라텅그스텐산염이 아니고 미지의 새로운 다중텅고스텐산염임을 알 수 있었다.

• Restorative Dentistry and Endodontics
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• 제47권2호
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• pp.21.1-21.11
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• 2022

Objectives: This study aimed to investigate the bonding effects of cleaning protocols on dentin impregnated with endodontic sealer residues using ethanol (E) or xylol (X). The effects of dentin acid etching immediately (I) or 7 days (P) after cleaning were also evaluated. For bonding to dentin, universal adhesive (Scotchbond Universal; 3M ESPE) was used. The persistence of sealer residues, hybrid layer formation and microshear bond strength were the performed analysis. Materials and Methods: One hundred and twenty bovine dentin specimens were allocated into 4 groups (n = 10): G1 (E+I); G2 (X+I); G3 (E+P); and G4 (X+P). The persistence of sealer residues was evaluated by SEM. Confocal laser scanning microscopy images were taken to measure the formed hybrid layer using the Image J program. For microshear bond strength, 4 resin composite cylinders were placed over the dentin after the cleaning protocols. ANOVA followed by Tukey test and Kruskal-Wallis followed by Dunn test were used for parametric and non-parametric data, respectively (α = 5%). Results: G2 and G4 groups showed a lower persistence of residues (p < 0.05) and thicker hybrid layer than the other groups (p < 0.05). No bond strength differences among all groups were observed (p > 0.05). Conclusions: Dentin cleaning using xylol, regardless of the time-point of acid etching, provided lower persistence of residues over the surface and thicker hybrid layer. However, the bond strength of the universal adhesive system in etch-and-rinse strategy was not influenced by the cleaning protocols or time-point of acid etching.

• 마이크로전자및패키징학회지
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• 제20권3호
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• pp.63-69
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• 2013

Package on Package(PoP)용 하부 패키지에 대해 플립칩 본딩으로 칩을 기판에 실장한 패키지와 die attach film(DAF)을 사용하여 칩을 기판에 접착한 패키지의 warpage 특성을 비교하였다. 플립칩 본딩으로 칩을 기판에 실장한 패키지와 DAF를 사용하여 칩을 기판에 실장한 패키지는 솔더 리플로우 온도인 $260^{\circ}C$에서 각기 $57{\mu}m$와 $-102{\mu}m$의 warpage를 나타내었다. 상온에서 $260^{\circ}C$ 사이의 온도 범위에서 플립칩 실장한 패키지는 $-27{\sim}60{\mu}m$ 범위의 warpage를 나타내는 반면에, DAF 실장한 패키지는 $-50{\sim}-153{\mu}m$ 범위의 warpage를 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.