• Journal of Technologic Dentistry
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• v.29 no.2
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• pp.141-150
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• 2007

The purpose of this study was to ascertain the bonding durability of self-etching dentin bonding agents to dentin by means of shear bonding strength. Several acid-etching dentin bonding system (ESPE Z100) and self-etching dentin bonding systems (DEN-FIL, GRADIA DIRET) were used. The occlusion surface of human molars were ground flat to expose dentin and treated with the etch bonding system according to manufactures instruction and followed by composite resin application. After 24hours of storage at 37$^{\circ}C$, the shear bonding strength of the specimens was measured in a universal testing machine with a 1mm/min crosshead speed. An one-way analysis of variance and the scheffe test were performed to identify significant differences (p<0.05). The bonded interfacial surfaces and treated dentin surfaces were examined using a SEM. Through the analysis of shear bond strength data and micro-structures of dentin-resin interfaces, following results are obtained. In dentin group, the shear bond strength of DEN-FIL showed statistical superiority in comparison to the other groups and followed by ESPE Z100 and GRADIA DIRECT (p<0.05).

• Journal of Korean Dental Science
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• v.17 no.1
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• pp.36-44
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• 2024

Purpose: This study investigated the effect of dentin bonding agent acidity on surface microhardness of MTA. Materials and Methods: Forty cylindrical molds (3 mm×5 mm) were prepared, and three dentin bonding agents with different acidities: Adper Single Bond 2 (ASB), Single Bond Universal (SBU), and Clearfil SE bond 2 (CSE) were applied to the inner surface of the molds (n=10). No bonding agent was applied in the control group. MTA was mixed and inserted into the molds and sealed with a wet cotton pellet for 4 days. After setting, the Vickers microhardness (HV) test was done at 200, 400, 600 ㎛ from the inner surface of the mold. One-way ANOVA was conducted for all samples. A P-value of less than .05 was considered significant. Tukey HSD test was performed for post-hoc analysis. Results: The mean HV values and standard deviations were 67.02±11.38 (Con), 48.76±11.33 (ASB), 43.78±11.19 (CSE), 37.84±9.36 (SBU), respectively. The difference between the control group and the experimental groups was statistically significant (P<0.001). The difference between ASB and SBU was statistically significant (P<0.001), while the difference between SBU and CSE was not. There were no statistically significant differences between the various points from the inner surface of the mold within each group (P>0.05). Conclusion: Results of the current study indicate that use of dentin bonding agents with MTA can reduce the surface microhardness of MTA. Moreover, there is a direct relationship between the acidity of dentin bonding agents and the surface microhardness of MTA.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.4
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• pp.250-254
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• 2016

In this paper, solar-cell modules were fabricated by low-temperature bonding method of construction using CF. CF adhesive strength of cells at 180 degree using 3bus bar structure was measured average 2.4N. As the bonding temperature got higher, Voc and Iscwas increased. And at $185^{\circ}C$, Rseries was measured 0.013[${\Omega}$] which is the highest point. At $185^{\circ}C$, 2N and 6sec in bonding time, $P_{max}$ was measured 3.954[W], fillfactor was measured 67.36[%] and efficiency was measured13.178[%] the highest point.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.202-214
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• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.

• Restorative Dentistry and Endodontics
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• v.23 no.1
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• pp.413-423
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• 1998

Dental ceramics exhibit excellent esthetic property, compressive strength, chemical durability, biocompatibility and translucency. This study evaluated the shear bond strength of composite resin to the new heat-pressed ceramic material (IPS-Empress System) depending on the surface treatments and bonding agents. The surface treatments were etching with 4.0% hydrofluoric acid, application of silane, and the combination of the two methods. Composite resin was bonded to ceramic with four kinds of dentin bonding agents(All-Bond 2, Heliobond, Scotch bond Multi-purpose and Tenure bonding agents). The ceramic specimen bonded with composite resin was mounted in the testing jig, and the universal testing machine(Zwick 020, Germany) was used to measure the shear bond strength with the cross head speed of 0.5 mm/min. The results obtained were as follows 1. The mean shear bond strength of the specimens of which the ceramic surface was treated with the combination of hydrofluoric acid and silane before bonding composite resin was significantly higher than those of the other surface treatment groups(p<0.05). 2. In the case of All-Bond 2 and Scotchbond Multi-purpose bonding agent group, the surface treatment methods did not influenced significantly on the shear bond(p>0.05). 3. Of the four bonding agents tested, the shear bond strength of Heliobond was significantly lower than those of other bonding agents regardless of the surface treatment methods(p<0.05). 4. The highest shear bond strength($12.55{\pm}1.92$ MPa) was obtained with Scotchbond Multipurpose preceded by the ceramic surface treatment with the combination of 4% hydrofluoric acid and silane.

• Bulletin of the Korean Chemical Society
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• v.29 no.2
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• pp.393-397
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• 2008

Inductively coupled plasma atomic emission spectrometry (ICP-AES) was used to determine the presence of germanium and phosphorus in a pure gold bonding wire. The samples were dissolved with hydrobromic acid and nitric acid at room temperature. The quantitation limits were 0.012 mg L-1 at 265.118 nm for Ge and 0.009 mg L-1 at 177.495 nm for P. Using the mixed acid digestion formula of DIW+HBr+HNO3, the recoveries were in the range of 98-100% and the relative standard deviation was within 1.1-2.3%. On the other hand, the amount of Ge decreased by about 16.2% using DIW+HCl+HNO3, due to the formation of a volatile compound. The Ge contents determined using the external method and the standard addition method were 9.45 mg kg-1 and 9.24 mg kg-1, respectively, and the P contents, using the same methods, were 22.49 mg kg-1 and 23.09 mg kg-1, respectively. Both methods were successfully used to determine the trace amounts of P and Ge in the pure gold bonding wire samples.

• ETRI Journal
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• v.37 no.3
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• pp.523-532
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• 2015

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

• Electrical & Electronic Materials
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• v.10 no.6
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• pp.533-540
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• 1997

The microwave dielectric properties of ((P $b_{1-x}$ C $a_{x}$)Zr $O_3$ and (P $b_{0.63}$,C $a_{0.37-x}$ $M_{x}$)Zr $O_3$(M=Mg,Sr) ceramics were investigated. In (P $b_{1-x}$ C $a_{x}$)Zr $O_3$ (X=0.33~0.40) ceramics, high quality factor and small temperature coefficient of resonant frequency were obtain in (P $b_{0.63}$C $a_{0.37}$)Zr $O_3$with perovskite structure. In the case of (P $b_{0.63}$C $a_{0.37-x}$M $g_{x}$)Zr $O_3$ dielectric constant temperature coefficient of resonant frequency increased and quality factor decreased due to increase of polarization of A-O bonding. When replacing Ca ion with Sr ion with large ion radius, polarization decreased with increased of bonding length and thus dielectric constant and temperature coefficient of resonant frequency decreased.decreased.creased.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.613-618
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• 2009

We designed new compositions for lead free and low temperature sealing glass frit of $ZnO-V_2O_5-P_2O_5$ system, which can be used for PDP (Plasma Display Panel) or other electronic devices. The $ZnO-V_2O_5-P_2O_5$ system can be used as a sealing material at temperatures even lower than 430$^{\circ}C$. This system, however, showed lower bonding strength with glass substrate compared to commercialized Pb based sealing materials. So, we added $TiO_2$ as a promoter for bonding strength. We examined the effect of $TiO_2$ addition on sealing behaviors of $ZnO-V_2O_5-P_2O_5$ glasses with the data for flow button, wetting angle, temporary & permanent residual stress of glass substrate, EPMA analysis of interface between sealing materials and glass substrate, and bonding strength. As a result, sealing characteristics of $ZnO-V_2O_5-P_2O_5$ system glasses were improved with $TiO_2$ addition, but showed a maximum value at 5 mol% $TiO_2$ addition. The reason for improved bonding characteristics was considered to be the chemical interaction between glass substrate and sealing glass, and structural densification of sealing glass itself.

• The korean journal of orthodontics
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• v.32 no.2 s.91
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• pp.143-153
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• 2002

The bonded orthodontic retainer constructed from composite and multistrand orthodontic wire provides an esthetic and efficient system for maintained retention. This study was designed to measure shear bond strength of bonded retainers and to suggest a optimal combination of a multistrand wire and bonding method used when bonded retainer was fabricated. 160 sound maxillary and mandibular premolars were used for 80 test samples. After Uniformizing bonding area, length of wire, and thickness of composite, multistrand wire was bonded to fabricated a bonded retainer by direct or indirect bonding method. Shear bond strength and extension length of each sample were measured by a universal testing machine. The results of this study were as follows : 1. In vitro shear bond testing found 6-stranded, 0.0155 inch wires to have the largest shear bond strength and 3-stranded, 0.0195 inch wires to have the least shear bond strength. But, These difference was not statistically significant(p<0.05). 2. In vitro extension testing found 3-stranded, 0.0155 inch wires to have the largest extension length and 3-stranded, 0.0195 inch wires to have the least extension length(p<0.05). The larger diameter wire was used, the larger extension length was shown. But, the strand of wire is not related to the extension length of wire. 3. In comparison with direct bonding method, larger shear bond strength and extension length was shown in indirect bonding method(p<0.05).