• Bulletin of the Korean Chemical Society
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• 제24권8호
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• pp.1215-1218
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• 2003

An analysis of the bonding situation in CaM₂P₂ (M=Fe, Ni) with ThCr₂Si₂ structure is made in terms of DOS and COOP plots. The main contributions to covalent bonding are due to M-P and P-P interactions in both compounds. Particularly, the interlayer P-P bonding by variation in the transition metal is examined in more detail. It turns out that the shorter P-P bonds in CaNi₂P₂ form as a result of the decreasing electron delocalization into ${{\sigma}_p}^*$ of P₂ due to the weaker bonding interaction between the metal d and ${{\sigma}_p}^*$ as the metal d band is falling from Fe to Ni.

• 한국재료학회지
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• 제8권10호
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• pp.890-897
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• 1998

n-InP(001)기판과 PECVD법으로 ${Si}_3N_4$(200nm)막이 성장된 InP 기판사이의 direct wafer bonding을 분석하였다. 두 기판을 접촉시켰을 때 이들 사이의 결합력에 크게 영향을 주는 표면 상태를 접촉각 측정과 AFM을 통해서 분석하였다. InP 기판은 $50{\%}$ 불산용액으로 에칭하였을 때 접촉각이 $5^{\circ}$, RMS roughness는 $1.54{\AA}$이었다. ${Si}_3N_4$는 암모니아수 용액으로 에칭하였을 때 RMS roughness가 $3.11{\AA}$이었다. Inp 기판과 ${Si}_3N_4$/InP를 각각 $50{\%}$ 불산 용액과 암모니아수 용액에 에칭한 후 접촉시켰을 때 상당한 크기의 초기 겹합력을 관찰할 수 있었다. 기계적으로 결합된 시편을 $580^{\circ}C$-$680^{\circ}C$, 1시간동안 수소 분위기와 질소분우기에서 열처리하였다. SAT(Scanning Acoustic Tomography)측정으로 두 기판 사이의 결합여부를 확인하였다. shear force로 측정한 InP 기판과 ${Si}_3N_4$/InP사이의 결합력은 ${Si}_3N_4$/InP 계면의 결합력만큼 증가되었다. TEM과 AES를 이용해서 di-rect water bonding 계면과 PECVD계면을 분석하였다.

• 대한치과보철학회지
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• 제35권2호
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• pp.385-399
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• 1997

The purpose of this experiment was to determine the effects of etching with a Nd : YAG Laser on dentin, or porcelain surface on the bond strength with composite resin. The dentin specimens were devided into the following 4 groups. D1 : No treatment D2 : Etched with 10% phosphoric acid D3 : Laser etchded with 1W, 20PPs D4 : Laser etched with 2W, 20PPS The procelain specimens were devided into the following 4 groups. P1 : diamond roughened P2 : etched with HF acid P3 : Laser etched with 2W, 20PPS P4 : Laser etched with 3W, 20PPS All specimens were veneered with resin. One half of the specimens were stored in $37^{\circ}C$ water for one day and the other half were thermocycled 1000 times at temperature of $5^{\circ}C\;to\;55^{\circ}C$ at 20 seconds intervals. After that, the bonding strength of composite resin to the dentin and porcelain was measured. The surface treated state and fractured state were observed with SEM. The following results were obtained. 1. In the dentin specimens, the bond strength of group D2 was highter than that of groups D1 and D3 in the case of the specimens stored in $37^{\circ}C$ water for one day, there was a statistically significant difference between group D2 and D1, D3 (P<0.05). The bonding strength of the specimens that were thermocycled decreased in the following order : group D2,D4,D3 and then D1. 2. In the porcelain specimens, the bonding strength of groups P1,P2 were higher than that of group P3 in the case of the specimens stored in $37^{\circ}C$ water for one day (P<0.05). The bonding strength of the specimens of being thermocycled decreased in the following order : group P2,P1,P4 and then P3. 3. The groups of high bond strength had a rougher surface and a high level of microporosity with SEM findings.

• Restorative Dentistry and Endodontics
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• 제40권1호
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• pp.68-74
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• 2015

Objectives: This study examined the effects of additional acid etching on the dentin bond strength of one-step self-etch adhesives with different compositions and pH. The effect of ethanol wetting on etched dentin bond strength of self-etch adhesives was also evaluated. Materials and Methods: Forty-two human permanent molars were classified into 21 groups according to the adhesive types (Clearfil SE Bond [SE, control]; G-aenial Bond [GB]; Xeno V [XV]; Beauti Bond [BB]; Adper Easy Bond [AE]; Single Bond Universal [SU]; All Bond Universal [AU]), and the dentin conditioning methods. Composite resins were placed on the dentin surfaces, and the teeth were sectioned. The microtensile bond strength was measured, and the failure mode of the fractured specimens was examined. The data were analyzed statistically using two-way ANOVA and Duncan's post hoc test. Results: In GB, XV and SE ($pH{\leq}2$), the bond strength was decreased significantly when the dentin was etched (p < 0.05). In BB, AE and SU (pH 2.4 - 2.7), additional etching did not affect the bond strength (p > 0.05). In AU (pH = 3.2), additional etching increased the bond strength significantly (p < 0.05). When adhesives were applied to the acid etched dentin with ethanol-wet bonding, the bond strength was significantly higher than that of the no ethanol-wet bonding groups, and the incidence of cohesive failure was increased. Conclusions: The effect of additional acid etching on the dentin bond strength was influenced by the pH of one-step self-etch adhesives. Ethanol wetting on etched dentin could create a stronger bonding performance of one-step self-etch adhesives for acid etched dentin.

• 대한소아치과학회지
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• 제30권2호
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• pp.263-271
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• 2003

본 연구는 All-In-One system의 적용 시간과 도포횟수에 따라 유치 상아질과 복합레진의 접착 강도와 혼성층에 어떤 영향을 미치는지를 규명하고자 Single bonding agent(Scotchbond Multi-Purpose Plus, 3M, USA)와 All-In-One system(Prompt-L pop, 3M ESPE, USA)를 사용하였고 수복용 레진으로 복합레진(Z-250, 3M, USA)를 사용한 결과 다음과 같은 결과를 얻을 수 있었다. 1. 전단 결합 강도는 Single bonding agent를 적용한 경우 All-In-One system을 적용한 군보다 유의하게 높게 나타났다(P<0.05). 2. Prompt L-pop을 2회, 3회 적용한 경우에 전단 결합 강도는 1회 적용한 군보다 유의하게 높게 나타났으며(P<0.05), 혼성층의 두께는 1회 적용군보다 2회, 3회 적용한 군에서 증가하였다. 3. Prompt L-pop을 15초 적용한 경우에 전단 결합 강도는 7초 적용한 군보다 유의하게 높게 나타났으며(P<0.05), 30초 적용군과는 차이가 없었다. 혼성층의 두께는 7초 적용군이 가장 얇고, 15초군과 30초군에서는 차이가 없었다. 4. Single bonding agent를 이용한 경우 두터운 $2-4{\mu}m$의 혼성층이 관찰된 반면, All-In-One bonding system(Prompt L-pop, 3M ESPE, USA)에서는 비교적 얇은 혼성층($1-2{\mu}m$)이 형성되었다.

• 한국전기전자재료학회논문지
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• 제30권10호
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• pp.615-624
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• 2017

This study investigated the various physical and electrical effects of silicon direct bonding. Direct bonding means the joining of two wafers together without an intermediate layer. If the surfaces are flat, and made clean and smooth using HF treatment to remove the native oxide layer, they can stick together when brought into contact and form a weak bond depending on the physical forces at room temperature. An IR camera and acoustic systems were used to analyze the voids and bonding conditions in an interface layer during bonding experiments. The I-V and C-V characteristics are also reported herein. The capacitance values for a range of frequencies were measured using a LCR meter. Direct wafer bonding of silicon is a simple method to fuse two wafers together; however, it is difficult to achieve perfect bonding of the two wafers. The direct bonding technology can be used for MEMS and other applications in three-dimensional integrated circuits and special devices.

• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.133-140
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• 2019

열 사이클 조건이 전해 Cr/Ni-P 이중도금 시편의 접합강도 및 균열성장거동에 미치는 영향을 분석하였다. 전해 Ni-P 도금층을 열처리를 통해 결정화 시킨 후 전해 Cr 도금 후 한번 더 열처리한 결과, Cr/Ni-P 계면에서 상호확산으로 인해 Cr-Ni 고용체 band layer가 관찰되었다. 열 사이클 전 접합강도는 25.6 MPa이였으나, 1,000사이클 후 Cr 도금층의 균열 밀도 및 표면 거칠기 증가로 인해 도금층과 접착제 사이의 기계적 고착효과가 향상되어 접착제와 Cr 도금층 사이에서 박리되었고, 접합강도는 47.6 MPa로 점차적으로 증가하였다.

• The Journal of Advanced Prosthodontics
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• 제16권2호
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• pp.105-114
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• 2024

PURPOSE. This study aimed to evaluate the effect of pretreatment of three different universal adhesives (Single Bond Universal [SBU], All-Bond Universal [ABU], and Prime&Bond universal [PBU]) on the bonding durability of an adhesive (Panavia F 2.0, PF) and a conventional (Duo-Link, DL) resin cements to air-abraded zirconia. MATERIALS AND METHODS. Rectangular-shaped zirconia specimens were prepared. The chemical composition and surface energy parameters of the materials were studied by Fourier transform infrared spectroscopy and contact angle measurement, respectively. To evaluate resin bonding to the zirconia, all the bonding specimens were immersed in water for 24 h and the specimens to be aged were additionally thermocycled 10000 times before the shear bond strength (SBS) test. RESULTS. The materials showed different surface energy parameters, including the degree of hydrophilicity/hydrophobicity. While the DL/CON (no pretreatment) showed the lowest SBS and a significant decrease in the value after thermocycling (P < .001), the PF/CON obtained a higher SBS value than the DL/CON (P < .001) and no decrease even after thermocycling (P = .839). When the universal adhesives were used with DL, their SBS values were higher than the CON (P < .05), but the trend was adhesive-specific. In conjunction with PF, the PF/SBU produced the highest SBS followed by the PF/ABU (P = .002), showing no significant decrease after thermocycling (P > .05). The initial SBS of the PF/PBU was similar to the PF/CON (P = .999), but the value decreased after thermocycling (P < .001). CONCLUSION. The universal adhesive pretreatment did not necessarily show a synergistic effect on the bonding performance of an adhesive resin cement, whereas the pretreatment was beneficial to bond strength and durability of a conventional resin cement.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.159-159
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• 2010

We conducted bum-in test by current stress to evaluate acceleration reliability characteristics about p-resistivity influence of GaN-based light-emitting diodes. The LEDs used in this study are the polarization field-induced LED(PF-LED) having low p-resistivity and the highly resistive LED(HR-LED) having high p-resistivity. The result of high stress experiment shows that current crowding phenomenon is occurred from the center of between p-bonding pad and n-bonding pad to either electrodes. In addition, series resistance and optical power decrease dramatically. These results means that the resistance of between p-bonding pad and p-GaN affect reliability. That's why we need to consider the ohmic contact of p-bonding pad when design the high efficiency and high reliability LEDs.

• Journal of the Korean Wood Science and Technology
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• 제38권6호
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• pp.541-546
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• 2010

본 연구의 목적은 3시간 오존산화 처리식용유와 pMDI를 혼합하여 고온과 중온에서의 접착제를 제조하였고, 이를 상태 인장전단 접착강도 시험을 통하여 식용유의 목재 접착제 응용 가능성을 확인하였다. 고온조건에서 3시간 오존산화 식용유의 상태 접착강도 시험 결과, 오존산화 식용유 : pMDI 비율이 1 : 0.5일 때 4.74 kgf/$cm^2$, 1 : 0.75일 때 7.14 kgf/$cm^2$, 1 : 1일 때 9.29 kgf/$cm^2$, 1 : 2일 때 16.53 kgf/$cm^2$, 1 : 3일 때 17.42 kgf/$cm^2$, 1 : 4일 때 16.75 kgf/$cm^2$를 나타냈다. 따라서 3시간 오존산화 식용유 : pMDI 비율이 1 : 2∼1 : 3일 때 가장 높은 접착력을 보임을 알 수 있어, 두 물질의 적정 당량비가 이 비율에서 형성됨을 알 수 있었다. 중온조건에서 3시간 처리한 식용유의 상태 접착강도 시험 결과, 식용유 : pMDI 비율이 1 : 0.5일 때 3.16 kgf/$cm^2$, 1 : 0.75일 때 6.13 kgf/$cm^2$, 1 : 1일 때 8.18 kgf/$cm^2$ 1 : 2일 때 11.82 kgf/$cm^2$이 나타났다. 즉, 고온, 중온에서의 오존산화 처리한 식용유:pMDI 혼합비율이 1 : 2~1 : 3 부근에서 높은 접착력을 보였고, 목재접착제로서 고온에서 접착 할 경우 합판에서의 이용 가능성이 높을 것으로 판단된다.