• Particle and aerosol research
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• v.4 no.2
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• pp.69-75
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• 2008

Nanosize ZnO particles were prepared by oxidation of zinc vapor and the particle growth was modeled by a coagulation model by assuming that the characteristic time for reaction was much shorter than coagulation time and residence time (${\tau}_{reaction}{\ll}{\tau}_{coagulation}{\ll}{\tau}_{residence}$). Experimental measurement of zinc oxide particles diameter was consistent with the predicted result from the coagulation model. For practical purpose of predicting zinc oxide size in areosol reactor, the constant kernel solution is concluded to be sufficient, Uniqueness of nano-scale property of zinc oxide was confirmed by the higher photocatalytic activity of zinc oxide than nanosize titania particles.

• Proceedings of the Korean Magnestics Society Conference
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• 2002.04a
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• pp.78-79
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• 2002

• Electrical & Electronic Materials
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• v.9 no.5
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• pp.476-482
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• 1996

The multi-dielectric layer SiO$_{2}$/Si$_{3}$N$_{4}$/SiO$_{2}$(ONO) is used to improve electrical capacitance and to scale down the memory device. In this paper, improvement of the capacitance by reducing the bottom oxide thickness in the nitride deposition with load lock(L/L) vacuum system is studied. Bottom oxide thickness under the nitride layer is measured by ellipsometer both in L/L and non-L/L systems. Both results are in the range of 3-10.angs. and 10-15.angs., respectively, independent of the nitride and top oxide thickness. Effective thickness and cell capacitance for SONOS capacitor are in the range of 50-52.angs. and 35-37fF respectively in the case of nitride 70.angs. in L/L vacuum system. Compared with non-L/L system, the bottom oxide thickness in the case of L/L system decreases while cell capacitance increases about 4 fF. The results obtained in this study are also applicable to ONO scaling in the thin bottom oxide region of memory stacked capacitor.

• Corrosion Science and Technology
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• v.6 no.1
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• pp.1-6
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• 2007

Ferritic stainless steels for the SOFC interconnect applications are required to possess not only a good oxidation resistance, but also a high electrical conductivity of the oxide scale that forms during exposure at the SOFC operating environment. In order to understand the effects of alloying elements on the oxidation behavior of ferritic stainless steels and on the electrical properties of oxide scales, two kinds of commercial ferritic stainless steels, STS 430 and STS 444, were investigated by performing isothermal oxidations at $800^{\circ}C$ in a wet air containing 3% $H_{2}O$. The results showed that STS 444 was superior to STS 430 in both of the oxidation resistance and the area specific resistance. Although STS 444 contained a less amount of Mn for the $(Mn,Cr)_{3}O_{4}$ spinel formation than STS 430, the minor alloying elements of Al and Mo in STS 444, which were accumulated in the base metal region adjacent the scale, were suggested to reduce the scale growth rate and to enhance the scale adherence to the base metal.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.7
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• pp.21-29
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• 2004

Hot carrier degradation characteristics of Nano-scale CMOSFETs with dual gate oxide have been analyzed in depth. It is shown that, PMOSFET lifetime dominate the device lifetime than NMOSFET In Nano-scale CMOSFETs, that is, PMOSFET lifetime under CHC (Channel Hot Carrier) stress is much lower than NMOSFET lifetime under DAHC (Dram Avalanche Hot Carrier) stress. (In case of thin MOSFET, CHC stress showed severe degradation than DAHC for PMOSFET and DAHC than CHC for NMOSFET as well known.) Therefore, the interface trap generation due to enhanced hot hole injection will become a dominant degradation factor in upcoming Nano-scale CMOSFET technology. In case of PMOSFETs, CHC shows enhanced degradation than DAHC regardless of thin and thick PMOSFETs. However, what is important is that hot hole injection rather than hot electron injection play a important role in PMOSFET degradation i.e. threshold voltage increases and saturation drain current decreases due to the hot carrier stresses for both thin and thick PMOSFET. In case of thick MOSFET, the degradation by hot carrier is confirmed using charge pumping current method. Therefore, suppression of PMOSFET hot carrier degradation or hot hole injection is highly necessary to enhance overall device lifetime or circuit lifetime in Nano-scale CMOSFET technology

• Corrosion Science and Technology
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• v.16 no.1
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• pp.15-22
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• 2017

An oxidation-reduction scheme is an alternative approach for improving the galvanizability of advanced high-strength steel in the continuous hot-dip galvanizing process. Here, we investigated the effect of oxygen partial pressure ($P_{O_2}$) on the oxidation behavior of a transformation-induced plasticity steel containing 1.5 wt% Si and 1.6 wt% Mn during heating to and holding for 60 s at $700^{\circ}C$ under atmospheres with various $P_{O_2}$ values. Irrespective of $P_{O_2}$, a thin amorphous Si-rich layer of Si-Mn-O was formed underneath the Fe oxide scale (a $Fe_2O_3/Fe_3O_4$ bilayer) in the heating stage. In contrast to Si, Mn tended to segregate at the scale surface as $(Fe,Mn)_2O_3$. The multilayered structure of $(Fe,Mn)_2O_3/Fe_2O_3/Fe_3O_4$/amorphous Si-Mn-O remained even after extended oxidizing at $700^{\circ}C$ for 60 s. $Fe_2O_3$ was the dominantly growing oxide phase in the scale. The enhanced growth rate of $Fe_2O_3$ with increasing $P_{O_2}$ resulted in the formation of more Kirkendall voids in the amorphous Si-rich layer and a less Mn segregation at the scale surface. The mechanisms underlying the absence of FeO and the formation of Kirkendall voids are discussed.

• Corrosion Science and Technology
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• v.20 no.6
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• pp.373-383
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• 2021

The effect of Cr addition to high Mn steel on flow-accelerated corrosion (FAC) behavior in a neutral aqueous environment was evaluated. For comparison, two types of conventional ferritic steels (API X70 steel and 9% Ni steel) were used. A range of experiments (electrochemical polarization and impedance tests, weight loss measurement, and metallographic observation of corrosion scale) were conducted. This study showed that high Mn steel with 3% Cr exhibited the highest resistance to FAC presumably due to the formation of a bi-layer scale structure composed of an inner Cr enriched Fe oxide and an outer Mn substituted partially with Fe oxide on the surface. Although the high Mn steels had the lowest corrosion resistance at the initial corrosion stage due to rapid dissolution kinetics of Mn elements on their surface, the kinetics of inner scale (i.e. Cr enriched Fe oxide) formation on Cr-bearing high Mn steel was faster in dynamic flowing condition compared to stagnant condition. On the other hand, the corrosion scales formed on API X70 and 9% Ni steels did not provide sufficient anti-corrosion function during the prolonged exposure to dynamic flowing conditions.

• Journal of Satellite, Information and Communications
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• v.10 no.2
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• pp.90-94
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• 2015

We stuidied liauid crystal alignment treatment using solution process for making thin oxide layer in liquid crystal display. It is the one of very effient and popular process in making thin oxide layer in electronical industrial fields. Particularly, this process has highly potential value in liquid crystal display industrial fields because it cause automatically induced alignment process without tranditional alignment process in liquid crystal alignment process. We made several different kinds of mol density solutions using strontium oxide solution. And those solutions were treated for solidification layers using annealing process for 2 hours. And we stuided pretilt angle properties of these alignment layers of strontium oxide for clarifying the relationship of liquid crystal molecules and thin strontium oxide layer. And we also tested the existence of strontium oxide thin layer on substrate using XPS measurement. We expected the hig gain of electro-optical properties in liquid crystal display using strontium oxide thin layer because it has high K property material than the other metal-based oxide layers. In this results, we measured 1.447 to 1.613 thresholds volts as 0.1 mol to 0.4 mol density in 0.1 mol density steps. This is significant better characteristics than conventional liquid crystal display as higher than 1.85 thresholds volts. And it make possible to making next-generation liquid crystal display which present low-power consumption and wide gray scale in liquid crystal display.

• Resources Recycling
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• v.15 no.4 s.72
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• pp.44-51
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• 2006

Most electric arc furnace dust (EAFD) treatment processes to recover zinc from EAFD employ carbon as a reducing agent for the zinc oxide in the EAFD. In the present work, the reduction reaction of zinc oxide with carbon in the present of iron oxide was kinetically studied. The experiments were carried out at temperatures between 1173 K and 1373 K under nitrogen atmosphere using a weight-loss technique. From the experimental results, it was concluded that adding the proper amount of iron oxide to the reactant accelerates the reaction rate of zinc oxide with carbon. This is because iron oxide in the reduction reaction of zinc oxide with carbon promotes the carbon gasification reaction. The spherical shrinking core model for a surface chemical reaction control was found to be useful in describing kinetics of the reaction over the entire temperature range. The reaction has an activation energy of 53 kcal/mol (224 kJ/mol) for ZnO-C reaction system, an activation energy of 42 kcal/mol (175 kJ/mol) for $ZnO-Fe_{2}O_{3}-C$ reaction system, and an activation energy of 44 kcal/mol (184 kJ/mol) for ZnO-mill scale-C reaction system.

• Proceedings of the Korea Association of Crystal Growth Conference
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• 1996.06a
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• pp.508-508
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• 1996

;The growth of films have considerable interest in the field of superlattice structured multi-layer epitaxy led to realization of new devices concepts. Molecular beam epitaxy (MBE) with in situ observation by reflection high-energy electron diffraction (RHEED) is a key technology for controlled layered growth on the atomic scale in oxide crystal thin films. Also, the combination of radical oxygen source and MBE will certainly accelerate the progress of applications of oxides. In this study, the growth process of single crystal films using by MBE method is discussed taking the oxide materials of Bi-Sr-Ca-Cu family. Oxidation was provided by a flux density of activated oxygen (oxygen radicals) from an rf-excited discharge. Generation of oxygen radicals is obtained in a specially designed radical sources with different types (coil and electrode types). Molecular oxygen was introduced into a quartz tube through a variable leak valve with mass flowmeter. Corresponding to the oxygen flow rate, the pressure of the system ranged from $1{\;}{\times}{\;}10^{-6}{\;}Torr{\;}to{\;}5{\;}{\times}{\;}10^{-5}$ Torr. The base pressure was $1{\;}{\times}{\;}10^{-10}$ Torr. The growth of Bi-oxides was achieved by coevaporation of metal elements and oxygen. In this way a Bi-oxide multilayer structure was prepared on a basal-plane MgO or $SrTiO_3$ substrate. The grown films compiled using RHEED patterns during and after the growth. Futher, the exact observation of oxygen radicals with MBE is an important technology for a approach of growth conditions on stoichiometry and perfection on the atomic scale in oxide. The oxidization degree, which is determined and controlled by the number of activated oxygen when using radical sources of two types, are utilized by voltage locked loop (VLL) method. Coil type is suitable for oxygen radical source than electrode type. The relationship between the flux of oxygen radical and the rf power or oxygen partial pressure estimated. The flux of radicals increases as the rf power increases, and indicates to the frequency change having the the value of about $2{\times}10^{14}{\;}atoms{\;}{\cdots}{\;}cm^{-2}{\;}{\cdots}{\;}S^{-I}$ when the oxygen flow rate of 2.0 seem and rf power 150 W.150 W.