• Applied Science and Convergence Technology
• /
• v.26 no.5
• /
• pp.133-138
• /
• 2017

We investigated the interface defect engineering and reaction mechanism of reduced transition layer and nitride layer in the active plasma process on 4H-SiC by the plasma reaction with the rapid processing time at the room temperature. Through the combination of experiment and theoretical studies, we clearly observed that advanced active plasma process on 4H-SiC of oxidation and nitridation have improved electrical properties by the stable bond structure and decrease of the interfacial defects. In the plasma oxidation system, we showed that plasma oxide on SiC has enhanced electrical characteristics than the thermally oxidation and suppressed generation of the interface trap density. The decrease of the defect states in transition layer and stress induced leakage current (SILC) clearly showed that plasma process enhances quality of $SiO_2$ by the reduction of transition layer due to the controlled interstitial C atoms. And in another processes, the Plasma Nitridation (PN) system, we investigated the modification in bond structure in the nitride SiC surface by the rapid PN process. We observed that converted N reacted through spontaneous incorporation the SiC sub-surface, resulting in N atoms converted to C-site by the low bond energy. In particular, electrical properties exhibited that the generated trap states was suppressed with the nitrided layer. The results of active plasma oxidation and nitridation system suggest plasma processes on SiC of rapid and low temperature process, compare with the traditional gas annealing process with high temperature and long process time.

• Journal of the Korean Ceramic Society
• /
• v.43 no.12 s.295
• /
• pp.805-811
• /
• 2006

The microstructural changes in Ni/YSZ anode substrate and crack formation during Ni oxidation were investigated. The composition of as-sintered anodes was 56 wt% NiO+44 wt% YSZ and that of electrolyte was 8 mol% yttria. After complete reduction, specimens were oxidized in $N_2$ + air at $600\sim800^{\circ}C$. Oxygen partial pressure was controlled in between 0.05 atm and 0.2 atm $O_2$. When the anode was oxidized, at higher than $690^{\circ}C$, three layers were formed in the specimens. The first was fully oxidized layer(NiO/YSZ), the second was a mixed layer and the third, near-intact layer. Under $640^{\circ}C$ such distinctive layers were not observed. Cracks formed at electrolyte layer when weight gain attained at $65\sim75%$ of the total gain due to complete oxidation despite of different oxidation temperature and oxygen partial pressure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2000.07a
• /
• pp.735-738
• /
• 2000

This paper shows experimentally that oxide layer on the p-type Si-substrate can grow at low temperature(500$^{\circ}C$∼600$^{\circ}C$) using high pressure water vapor system. As the result of experiment, oxide layer growth rate is about 0.19${\AA}$/min at 500$^{\circ}C$, 0.43${\AA}$/min at 550$^{\circ}C$, 1.2${\AA}$/min at 600$^{\circ}C$ respectively. So, we know oxide layer growth follows reaction-controlled mechanism in given temperature range. Consequently, granting that oxide layer growth rate increases linearly to temperature over 600$^{\circ}C$, we can expect oxide growth rate is 5.2${\AA}$/min at 1000$^{\circ}C$. High pressure oxidation of silicon is particularly attractive for the thick oxidation of power MOSFET, because thermal oxide layers can grow at relatively low temperature in run times comparable to typical high-temperature, 1 atm conditions. For higher-temperature, high-pressure oxidation, the oxidation time is reduced significantly

• Corrosion Science and Technology
• /
• v.2 no.3
• /
• pp.141-147
• /
• 2003

Sputter-deposited Nb-Al-Cr alloys. $3-5{\mu}m$ thick, have been prepared on quartz substrates as oxidation-and sulfidation-resistant materials at high temperatures. The oxidation or the alloys in the $Ar-O_2$ atmosphere of an oxygen partial pressure of 20 kPa follows approximately the parabolic rate law, thus being diffusion controlled. Their oxidation rates are almost the same as or even lower than those ofthc typical chromia-forming alloys. The multi-lavered oxide scales are formed on the ternary alloys. The outermost layer is composed of $Cr_2O_3$, which is"mainly responsible for the high oxidation'resistance of these alloys. In contrast to sputter-deposited Cr-Nb binary alloys reported previously, the inner layer is not porous. TEM observation as well as EDX analysis indicates that the innermost layer is a mixture of $Al_2O_3$ and niobium oxide. The dispersion of $Al_2O_3$ in niobium oxide may be attributable to the prevention of the formation of the porous oxide layer. The sulfidation rates of the present ternary alloys arc higher than those of the sputter-deposited Nb-AI binary alloys, but still several orders of magnitude lower than those of conventional high temperature alloys. Two-layered sulfide scales are formed, consisting of an outer $Al_2S_3$ layer containing chromium and an inner layer composed of $NbS_2$ and a small amount of $Cr_2S_3$. The presence of $Cr_2S_3$ in the inner protective $NbS_2$ layer may be attributed to the increase in the sulfidation rates.

• Journal of the Semiconductor & Display Technology
• /
• v.18 no.1
• /
• pp.32-37
• /
• 2019

Titanium dioxide ($TiO_2$) is a promising dielectric material in the semiconductor industry for its high dielectric constant. However, for utilization on Si substrate, $TiO_2$ film meets with a difficulty due to the large leakage currents caused by its small conduction band energy offset from Si substrate. In this study, we propose an in-situ plasma oxidation process in plasma-enhanced atomic layer deposition (PE-ALD) system to form an oxide barrier layer which can reduce the leakage currents from Si substrate to $TiO_2$ film. $TiO_2$ film depositions were followed by the plasma oxidation process using tetrakis(dimethylamino)titanium (TDMAT) as a Ti precursor. In our result, $SiO_2$ layer was successfully introduced by the plasma oxidation process and was used as a barrier layer between the Si substrate and $TiO_2$ film. Metal-oxide-semiconductor ($TiN/TiO_2/P-type$ Si substrate) capacitor with plasma oxidation barrier layer showed improved C-V and I-V characteristics compared to that without the plasma oxidation barrier layer.

• Journal of the Korean institute of surface engineering
• /
• v.44 no.4
• /
• pp.125-130
• /
• 2011

$Cr_2AlC$ compounds were synthesized by hot pressing, and oxidized between 900 and $1200^{\circ}C$ in air for up to 50 hours. They oxidized to a thin $Al_2O_3$ layer containing a small amount of $Cr_2O_3$with the liberation of carbon as CO or $CO_2$ gases. The consumption of Al to form the $Al_2O_3$ layer led to the depletion of Al and enrichment of Cr just below the $Al_2O_3$ layer, resulting in the formation of an underlying $Cr_7C_3$ layer. As the oxidation temperature and time increased, the $Cr_7C_3$ oxide layer and the underlying $Cr_7C_3$ layer thickened. The oxidation resistance of $Cr_2AlC$ was generally good due to the formation of the $Al_2O_3$ barrier layer.

• Journal of the Korean institute of surface engineering
• /
• v.40 no.6
• /
• pp.250-253
• /
• 2007

Plasma nitrocarburizing and plasma oxidizing treatments were performed to improve the wear and corrosion resistance of SKD 11 steel. Plasma nitrocarburizing was conducted for 12 h at $520^{\circ}C$ in the nitrogen, hydrogen and methane atmosphere to produce the $\varepsilon-Fe_{2-3}(N,C)$ phase. It was found that the compound layer produced by plasma nitrocarburising was predominantly composed of $\varepsilon-phase$, with a small proportion of $\gamma'-Fe_4(N,C)$ phase. The thickness of the compound layer was about $5{\mu}m$ and the diffusion layer was about $150{\mu}m$ in thickness, respectively. Plasma post oxidation was performed on the nitrocarburized samples with various oxygen/hydrogen ratio at constant temperature of $500^{\circ}C$ for 1 hour. The very thin magnetite($Fe_3O_4$) layer $1-2{\mu}m$ in thickness on top of the compound layer was obtained by plasma post oxidation. It was confirmed that the corrosion characteristics of the nitrocarburized compound layer could be further improved by the application of the superficial magnetite layer.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.2
• /
• pp.1-7
• /
• 2001

In order to form a uniform oxidation layer of spinel phase on Kovar which helps the strong bonding in Kovar-to-glass sealing, the humidified $N_2/H_2$ was used as an oxidation atmosphere. The oxidation of Kovar was controlled by diffusion mechanism and the activation energy was 31.61 kacl/mol at 500~$800^{\circ}C$. After oxidation at $600^{\circ}C$, the external oxidation layer was below 0.5 $\mu \textrm{m}$ thick. According to TEM analysis, oxidized Kovar was spinel its lattice parameter of 7.9 $\AA$. Oxidation of under $600^{\circ}C$ and in a humidified $N_2/H_2$ atmosphere, Kovar was found to be appropriate for the Kovar-to-glass sealing.

• Journal of the Korean Society of Industry Convergence
• /
• v.27 no.2_2
• /
• pp.397-402
• /
• 2024

Silicon carbide materials undergo an oxidation reaction in a high-temperature oxidizing environment and show different characteristics depending on the test temperature and time. In particular, the added oxides form a secondary phase within the sintering process and exhibit different oxidation characteristics depending on the added sintering materials. Therefore, to evaluate the oxidation characteristics, the weight of the test piece and the thickness of the oxidation layer were observed, and the structure and oxidation characteristics of the material were analyzed using SEM. SEM observation showed that an oxide layer was formed on the surface of the liquid sintered silicon carbide material after it was oxidized at 1200 ℃, 1300 ℃, and 1400 ℃ for 10 hours, respectively. Then, a bending test was performed at each temperature on the test piece with the oxidation layer formed to evaluate the change in flexural strength. The strength was 466.6 MPa at 1200 ℃, 363.1 MPa at 1300 ℃, and 350.8 MPa at 1400 ℃. Al₂O₃-SiO₂ oxidized at 1200 ℃ for 10 hours showed an increase in strength of about 21.0 MPa compared to the data before the oxidation test.

• Journal of the Korean institute of surface engineering
• /
• v.34 no.5
• /
• pp.494-498
• /
• 2001

Ferromagnets(FM)-Al-$O_{x}$ -Ferromagnets (FM) tunneling junctions were evaluated by changing the fabricating conditions of an Al-X$/_{x}$ layer. The junction composed of a thicker Al-$O_{x}$ shows the low resistance and the stable MR ratio about 16% in a wide range of oxidation time. For the junctions with the thinner Al-$O_{x}$ , they showed a fast increase of the barrier width as an increase of an oxidation time and exhibited a strong bias dependence. As oxidation time increased, the coercivity ($H_{c}$ ) of bottom Co layer increased gradually due to the local oxidation of Co bottom layer at a interface. However, the small formation of Co oxide did not largely influence on the deterioration of MR ratio.