• The Korean Journal of Community Living Science
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• v.24 no.2
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• pp.243-249
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• 2013

Identification of coating film species from ancient coating materials is needed to maintaine their surfaces without loss of their original beauty for a long time and understand the historical background of manufacturing techniques. A pyrolysis-gas chromatography/mass spectrometry (Py-GC/MS) was applied to identify the origine of films in ancient coating materials. The pyrolysis products, which reflect the source from which they originate were detected distinctively at $500^{\circ}C$. This is a rapid technique that does not require large amounts of sample or any sample preparation. Sesquiterpenes are a class of terpenes that consist of three isoprene units were identified as cadienes, selinenes, cubebenes from the raw material of dendropanax morbifera. On the other hand, alkanes(tetra~heptadecanes), alkenes (tri~heptadecenes), allkyphenols, catechols and fatty acids were detected from the raw material of the lacquer film. Based on these results, the origine of historic coatings artifacts was identified using py-GC/MS by comparison with their pyrolysis products.

• Transactions of the Korean Society of Mechanical Engineers
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• v.11 no.5
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• pp.740-745
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• 1987

For the prediction of the crack growth initiation from a blunt notch or a precrack in a prestrained material under plane strain tension and small-scale yielding conditions, a microscopic fracture criterion is proposed in terms of the crack tip opening displacement(COD) needed for the attainment of fracture strain at a microstructural distance. Smooth blunting of a crack tip with an initial root radius is assumed, and strain distributions on the crack-line axis are calculated at each deformation stage until the distributions against an original distance normalized to the COD are insensitive to an initial root radius. This case of no initial-root-radius effect is taken as for a sharp crack tip, on which the criterion is applied to determine the characteristic length of material from a critical COD for a fatigue-precracked specimen. The predicted COD at the fracture initiation from a crack with an initial root radius or a prestraining shows reasonable agreement with experimental values.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.335-338
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• 2003

Chemical mechanical polishing (CMP) process has been widely used to planarize dielectric layers, which can be applied to the integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of in the defect-free inter-layer dielectrics (ILD). Especially, defects such as micro-scratch lead to severe circuit failure which affect yield. CMP slurries can contain particles exceeding $1\;{\mu}m$ in size, which could cause micro-scratch on the wafer surface. In this paper, we have studied aging effect the of CMP sin as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.6
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• pp.521-526
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• 2005

Within wafer non-uniformity(WIWNU) improves as the stiffness of pad decrease. We designed the pad groove to study of pad stiffness on WIWNU in Chemical mechanical polishing(CMP) and measured the pad stiffness according to groove width. The groove influences effective pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. An Increase of the apparent contact area of pad by groove width results in decrease of effective pad stiffness. WIWNU and profile of removal tate improved as effective pad stiffness decreased. Because grooving the pad reduce its effective stiffness and it makes slurry distribution to be uniform. Futhermore, it ensures that pad conforms to wafer-scale flatness variability. By grooving the top pad, it is possible to reduce its stiffness and hence reduce WIWNU and edge effect.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.5
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• pp.351-355
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• 2001

Via for achieving reliable fabrication of MCM(Multichip Module) substrate was formed on photosensitive BCB layer. The MCM substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in the photosensitive BCB layer, the process of forming the BCB layer and its via forming plasma etch using C$_2$F$\_$6//O$_2$ gas were evaluated. The thickness of the BCB layer after hard bake was shrunk down to 40% of the original. The resolution of vias formed on the BCB was 15㎛ and the slope after develop was 85 degree. AES analysis was done on two vias, one is etched in C$_2$F$\_$6/O$_2$ gas and the other isnot etched. On the via etched in C$_2$F$\_$6//O$_2$, native C was detected and the amount of native C was reduced after Ar sputter. On the via not etched in C$_2$F$\_$6//O$_2$, organic C was detected. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable vias.

• Journal of the Korean Society of Tobacco Science
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• v.27 no.2
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• pp.189-194
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• 2005

The morphological properties of various structure materials of domestic and foreign reconstituted tobacco products(RTP) were investigated by using the Bauer-McNett classifier and the image analyzer. The results of the fiber classification showed the fraction of the bigger size structure materials was larger in a domestic RTP than that in two foreign RTPs. In case of fine fraction, the domestic RTP had bigger fine fraction than two foreign RTPs. Images of each structure materials showed the scrap in the foreign RTPs kept the original shape which were rare in the domestic RTP fractions. Those results deduced that the raw materials in a foreign RTP process might be treated separately depending on the mechanical and morphological properties, which could reduce the amount of fine generation and increase the efficiency in raw material treatment.

• Transactions of Materials Processing
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• v.26 no.6
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• pp.365-371
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• 2017

During sling wear of a ferrous metal, a surface layer is formed. Its microstructure, constituting phases, and mechanical property are different from those of the original wearing material. Since wear occurs at the layer, it is important to characterize the layer and understand how wear rate changes with different layers. Various layers are formed depending on external wear conditions such as load, sliding speed, counterpart material, and environmental conditions. In this research, sliding wear tests of pure iron were carried out against two different counterparts (AISI 52100 bearing steel and $Al_2O_3$) in the air and in an inert Ar gas atmosphere. Pure iron was employed to exclude other effects from secondary phases in steel on the wear. Wear tests were performed at room temperature. Worn surfaces, wear debris, and cross-sections were analyzed after the test. It was found that these two different counterparts and environments produced diverse layers, resulting in significant changes in wear rate. Against the bearing steel, pure iron showed higher wear rate in an Ar atmosphere due to severe adhesion than that in the air. On the contrary, the iron showed much higher wear rate in the air against $Al_2O_3$. Different layers and wear rates were analyzed and discussed by oxidation, severe plastic deformation, and adhesion at wearing surfaces.

• Journal of the Korean Society of Radiology
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• v.14 no.4
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• pp.433-437
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• 2020

Principles of Radiation Detection and measurement include luminescence, ionization and chemical reactions. In this study, thermoluminescent properties were analyzed by exposure radiation on the glass for protective glass of smart phone. In order to analyze the thermoluminescent characteristics by radiation, 6 MV X-ray 100 cGy was irradiated to the powder annealing at 300 ℃ by grinding the tempered glass and original tempered glass. As a result of measuring the amount of thermoluminescent respectively irradiated material, the thermoluminescent increased by 3 times in the tempered glass, and when the tempered glass was grinding by powder the thermoluminescent was 2.4 times increased. Based on these results, the liquid crystal protective glass of the smart phone is evaluated as a tracer material to evaluate the radiation exposure and dose of the personal radiation monitoring.

• Transactions of Materials Processing
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• v.1 no.1
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• pp.66-74
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• 1992

According to the variation of hydrostatic pressure on the central axis of deformable material, the V-shaped central bursting defect may be created in extrusion or drawing processes. The process factors which affect the generation of defects are semi-angle of die, reduction ratio of cross-sectional area, friction factor, material properties and so on. The combination of these factors can determine the possibility of defect creation and the shape of various round holes which have been created inside already. By the rigid plastic finite element method, this paper describes the observations of change in shape of round holes with process conditions such as semi-angle of die, reduction ratio of cross-sectional area and friction factor at the non-steady state of axisymmetrical extrusion process when the round hole is already existed inside the original billet. Also, the effects of process factors are investigated to prevent the possible defects.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.39-42
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• 2002

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.