• 한국초전도학회:학술대회논문집
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• v.12
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• pp.84-84
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• 2002

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.58.1-58.1
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• 2012

Direct write technologies provide flexible and economic means to manufacture low-cost large-area electronics. In this regard inkjet printing has frequently been used for the fabrication of electronic devices. Full advantage of this method, which is capable of reliable direct patterning with line and space dimensions in the 10 to 100 um regime, is only made with all-solution based processing. Among these printable electronic materials, silver and copper nanoparticles have been used as interconnecting materials. Specially, solutions of organic-encapsulated silver and copper nanoparticles may be printed and subsequently annealed to form low-resistance conductor patterns. In this talk, we describe novel processes for forming silver nanoplates and copper ion complex which have unique properties, and discuss the optimization of the printing/annealing processes to demonstrate plastic-compatible low-resistance conductors. By optimizing both the interconnecting materials and the surface treatments of substrate, it is possible to produce particles that anneal at low-temperatures (< $200^{\circ}C$) to form continuous films having low resistivity and appropriate work function for formation of rectifying contacts.

• ETRI Journal
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• v.35 no.2
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• pp.340-343
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• 2013

A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of $130{\mu}m$ is successfully formed.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.995-996
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• 2006

This paper presents a design of the PMOLED(Passive Matrix Organic light emitting diodes) driver IC improving the terminal current offset. The proposed methods are improving the design of the usual data output circuit. This methods can be avoidance brightness non-uniformity problem.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.997-998
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• 2006

This paper proposes an design of the OLED(Organic Light Emitting Diodes) driver IC using novel verification method. This method using the HDL(hardware description language) simulator, PLI(Programing Language Interface) and image viewer. The proposed method can be used efficiently to function verification in display driver IC.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.571-574
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• 2009

Metal oxide/metal bilayer structures are explored as contacts with a low injection barrier in organic thin-film transistors (OTFTs) in an effort to realize their true potential for low-cost electronics. OTFTs with a bilayer electrode of $WO_3$ (10nm) and Al shows a saturation mobility as large as 0.97 $cm^2$/Vsec which are comparable to those of Au-based control samples (~0.90 $cm^2$/Vsec). Scaling of contact resistance with respect to the thickness of $WO_3$ layer is also discussed.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.445-446
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• 2007

The use of plastic substrates enables new applications, such as flexible display devices, and other flexible electronic devices, using low cost, rollto-roll (R2R) fabrication technologies. One of the limitations of polymeric substrate in these applications is that oxygen and moisture rapidly diffuse through the material and subsequently degrade the electro-optical devices. GE Global Research (GEGR) has developed a plastic substrate technology comprised of a superior high-heat polycarbonate (LEXAN(R)) substrate film and a unique transparent coating package that provides the ultrahigh barrier (UHB) to moisture and oxygen, chemical resistance to solvents used in device fabrications, and a high performance transparent conductor. This article describes the coating solutions for polycarbonate (LEXAN(R)) films and its compatibility with OLED device fabrication processes.

• ETRI Journal
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• v.35 no.4
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• pp.566-570
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• 2013

In this paper, we demonstrate the capabilities of 380-nm ultraviolet (UV) light-emitting diodes (LEDs) using metal organic chemical vapor deposition. The epi-structure of these LEDs consists of InGaN/AlGaN multiple quantum wells on a patterned sapphire substrate, and the devices are fabricated using a conventional LED process. The LEDs are packaged with a type of surface mount device with Al-metal. A UV LED can emit light at 383.3 nm, and its maximum output power is 118.4 mW at 350 mA.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.1
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• pp.23-28
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• 2014

In this paper, we discuss on the optimal design scheme of the bilayer OLED (Organic Light Emitting Diodes) with micro-cavity structure. We carried out the optical simulation on the OLED device and calculated optimal scale of devices with taking the micro-cavity effect into account. Our emission model is based upon an ensemble of radiating dipole antennas. Consequently, we applied Maxwell's equation to this sequence, followed by the analysis on the electrical behaviors of OLED device using Poisson's equation. It contains carrier injection and transportation mechanism. In this process, we found out the thickness of each layer can affect the recombination rate at the emission layer. Therefore, we optimized the thickness of each layer to improve the efficiency of the device.

• Proceedings of the KSR Conference
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• 2006.11b
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• pp.683-688
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• 2006

Since the most part of maintenance work for EMU depends on the worker's know-how, the quality of maintenance is different according to the worker's skill and experience. Especially EMU is composed of the various parts such as electrics, electronics, communication, signal, and machinery, etc., and performs its function by their organic work. Therefore it is very difficult to improve the quality of maintenance for EMU. In this paper we purpose how to change the know-how-based maintenance method to knowledge-based maintenance method. Consequently we can ensure the quality of maintenance for EMU, and improve the quality by continuous maintaining the knowledge.