• Journal of the Korean Vacuum Society
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• v.17 no.4
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• pp.341-345
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• 2008

The SiOC film of carbon centered system was prepared using bistrimethylsilylmethane and oxygen mixed precursor by the chemical vapor deposition. The chemical properties of the SiOC film were analyzed by the contact anlge and FTIR spectra. The dielectric constant of the deposited films decreased after annealing process, and the correlation between the increasing the BTMSM/$O_2$ flow rate ratio and the dielectric constant did not exist. However, the trend of increasing or decreasing of the dielectric constant repeated and there is the correlation ship between the dielectric constant and the Si-O-C bond in the range of $950{\sim}1200\;cm^{-1}$. The dielectric constant decreased between samples with the chemical shift. The lowest dielectric constant was 1.65 at the sample, which was observed the chemical shift.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.86-90
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• 1997

We were evaluated from organic insulator of low dielectric constants, This organic insulator material is not only conservate TFT chanel but also used to insulator material to data line and pixel ITO electrod. This organic insulator material is possessed high platness and we can coat by Spin-On-Glass type. And we can make high aperature device because minimized black matrix width from coupling cap to data line and pixel ITO electrod, This evaluation with acryl over coat and PFCB(perflorecyclobutine) and we got good results.

• Journal of the Korean Society of Safety
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• v.27 no.4
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• pp.13-19
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• 2012

The purpose of this study is to extract the major factors related to the deterioration mechanism of white organic light-emitting diodes(WOLED) by performing accelerated testing of temperature, voltage, time, etc., and to develop an accelerated life test(ALT) model. The measurement results of the brightness of the WOLED exhibited that their average brightness tended to increase as the operating voltage increased and that the half-life period of the brightness appeared after approximately 400 hours when the operating voltage was 20V and the ambient temperature was $85^{\circ}C$. It could be seen that although the WOLED showed comparatively the same brightness when the initial acceleration began after the operating voltage was applied to it, its brightness changed excessively after the WOLED's thermal storage had been made. In addition, it was observed that the half-life period was reduced as the ambient temperature and applied voltage increased. The strength of the WOLED which had been maintained in the range of visible light at the maximum load was reduced by the deterioration of the organic light emitting material due to the influence of the operating voltage and temperature, and the reduction of emitted light was small at low voltage and temperature. It could be seen that the failure of the WOLED during the ALT was caused by wear due to load accumulation over time, and that Weibull distribution was appropriate for the life distribution and acceleration was established between test conditions. From the WOLED analysis, it is thought that factors influencing the brightness deterioration are voltage, temperature, etc., and that comprehensive analysis considering discharge control, dielectric tangent margin, etc., would further increase the reliability.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.57 no.2
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• pp.140-145
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• 2008

The purpose of this paper is to discuss the fabrication of $\beta$-PVDF($\beta$-Polyvinylidene fluoride, ${\beta}-PVF_2$) organic thin films using the vapor deposition method. Vapor deposition was performed under the following conditions: the temperature of evaporator, the applied electric field, and the pressure of reaction chamber were $270^{\circ}C$, 142.4 kV/cm, and $2.0{\times}10^{-5}\;Torr$, respectively. The molecular structure of the evaporated organic thin films were evaluated by a FT-IR. The results showed that the characteristic absorption peaks of $\beta$-form crystal increase from 72% to 95.5% with an increase in the substrate temperature. In the analysis of the electric characteristics, the abnormal increases in the relative dielectric constant and the dielectric loss factor in the regions of low frequency and high temperature are known to be caused by inclusion of impurity carriers in the PVDF organic thin films. In order to analyze quantitatively the abnormalities in the conductivity mechanism caused by ionic impurities, the product of the ion density and the mobility that affect the electrical property in polymeric insulators is analyzed. In the case of a specimen produced by varying the substrate temperature from $30^{\circ}C$ to $105^{\circ}C$, the product of mobility and the ion density decreased from $4.626{\times}10^8$ to $8.47{\times}10^7/V{\cdot}cm{\cdot}s$. This result suggests that the higher the substrate temperature is maintained, the better excluded the impurities are, and the more electrically stable material can be obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.12
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• pp.1083-1089
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• 2008

We studied the dielectric characteristics of low-k SiOCH thin films by Ellipsometry. The SiOCH thin films were prepared by deposition of BTMSM precursors on p-Si wafer by CCP-PECVD method. The nano-porous structural organic/inorganic hybrid-type of SiOCH thin films correlated directly to the formation of low dielectrics close to pore(k=1). The structural groups including highly dense pores in SiOCH thin films originated the anisotropic geometry type of network structure directing to complex refractive characteristics of SiOCH single layer on the p-Si wafer. The linearly polarized beam of Xe-ramp in the range from 190 nm to 2100 nm introduced to the surface of SiOCH thin film, and the reflected beam was Elliptically polarized by complex refractive coefficients of SiOCH dipole groups. The amplitude variation $\Psi$ and phase variation $\Delta$ of the relative reflective coefficients between perpendicular and parallel components to the incident plane were measured by Ellipsometry. The complex optical constants n and k as well as the dielectric constant and thickness of SiOCH thin films were driven by the measured value of $\Psi$ and $\Delta$.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2425-2433
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• 2018

This study investigates a new organic based material and its dielectric and mechanical properties. It is a comprehensive nanocomposite comprising a combination of various types of nanofillers with hydrophobic silica nanoparticles (AEROSIL R 974) as a matrix modifier and a polyamide nano nonwoven textile, Ultramid-Polyamide 6, pulped in the electrostatic field as a dielectric barrier. The polymer matrix is an epoxy network based on diglycidyl ether of bisphenol A (DGEBA) and cycloaliphatic diamine (Laromine C260). The designed nanocomposite material is an alternative to the conventional three-component composites containing fiberglass and mica with properties that exceed current electroinsulating systems (volume resistivity on the order of $10^{16}{\Omega}{\cdot}m$, dissipation factor tan ${\delta}=4.7{\cdot}10^{-3}$, dielectric strength 39 kV/mm).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1993.11a
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• pp.85-89
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• 1993

Silicone oil exhibits the properies of both organic and inorganic substances and, thus, it has many superior properties such as higher thermal resistance and lower thermal oxidation level when compared to other dielectric liquids. In order to investigate the dielectric characteristics, dielectric liquids of viscosity 1 [cSt] is chosen as the specimen and experiment is performed in the temperature range of 20∼65 [$^{\circ}C$] and frequency range of 30∼1${\times}$10$\^$6/ [Hz] respectively. As a result, the observed linear decrease in dissipation factor at the frequency range below 3 [kHz] is due to the influence of frequency, whereas the increase in dissipation factor at higher frequency range is contributed by electrode's resistance. At a fixed frequency of 30 [kHz], increasing temperature results in higher peak value and wide width of the absorption curve. This is due to the increase in dipole and viscosity. As temperature increases, dipole moment is decreased from 0.98 to 0.64 [debye]. The activation energy which causes the relaxation and loss of dielectric is obtained about 15 [kcal/mole].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.309-310
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• 2006

We studied dielectric properties of OLEDs(Organic Light-emitting Diodes) depending on applied voltage (AC) of PTFE(Polytetrafluoroethylene), material of hole injection layer in structure of ITO/hole injection layer (PTFE)/emitting layer, Alq3(Tris(8-hydroxyquinolibe) Alumin)/Al. PTFE is deposited 2 [nm] as rate of 0.2~03 [${\AA}/s$] and $Alq_3$ is deposited 100 [nm] as rate of 1.3~1.5 [${\AA}/s$] m high vacuum ($5{\times}10^{-6}$[torr]). In result of these studies, we can know dielectric properties of OLEDs. Impedance is decreased depending on applied voltage variation, dielectric loss showed peak in specified voltage and showed cole-cole plot of a specimen.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1103-1106
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• 2006

We have presented a comprehensive study on threshold voltage $(V_{th})$ control of organic thin-film transistors (OTFTs) with dual-gate structure. The fabrication of dual-gate pentacene OTFTs using plasma-enhanced atomic layer deposited (PEALD) 150 nm thick $Al_2O_3$ as a bottom gate dielectric and 300 nm thick parylene or PEALD 200 nm thick $Al_2O_3$ as both a top gate dielectric and a passivation layer is reported. The $V_{th}$ of OTFT with 300 nm thick parylene as a top gate dielectric is changed from 4.7 V to 1.3 V and that with PEALD 200 nm thick $Al_2O_3$ as a top gate dielectric is changed from 1.95 V to -9.8 V when the voltage bias of top gate electrode is changed from -10 V to 10 V. The change of $V_{th}$ of OTFT with dual-gate structure has been successfully understood by an analysis of electrostatic potential.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.3
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• pp.228-233
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• 2010

We studied the optical characteristics correlated with low dielectric constants of low-k SiOCH thin films through ellipsometry. The low-k SiOCH thin films were prepared by CCP-PECVD method using BTMSM(Bis-trimethylsilylmethane) precursors deposited on p-Si wafer. The Si-O-CHx, Si-O-Si, Si-CHx, CHx and Si-H bonding groups were specified by FTIR spectroscopic spectra, and the groups coupled with the nano-porous structural organic/inorganic hybrid-type of SiOCH thin films which has extremely low dielectric constant close to 2.0. The structural groups includes highly dense pore as well as ions in SiOCH thin films affecting to complex refraction characteristics of single layer on the p-Si wafer. The structural complexity originate the complex refractive constants of the films, and resulted the elliptical polarization of the incident linearly polarized light source of Xe-light source in the range from 190 nm to 2100 nm. Phase difference and amplitude ratio between s wave and p wave propagating through SiOCH thin film was studied. After annealing, the amplitude of p wave was reduced more than s wave, and phase difference between p and s wave was also reduced.