• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.48.1-48.1
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• 2010

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. In this study, we investigated the characteristics of electroplated Cu films according to the variation of concentration of organic additives. The plating electrolyte composed of $CuSO_4{\cdot}5H_2O$, $H_2SO_4$ and HCl, was fixed. The sheet resistance was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the organic additives play an important role in formation of Cu film with lower resistivity by EPD.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 연구회
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• pp.88-91
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• 2001

The mechanical properties and surface luminous intensities of copper foil have been studied with variation of the amount of additives into the electrolyte. Especially, organic compound of HEC was added from 0.1 to 10ppm for the propose of increasing the mechanical property and the surface state. The total thickness of electrodeposited copper foil was decreased with increasing the amount of organic compounds. There was not so much significant effect of the current density. It has been observed that mechanical property and surface luminous intensity increase with increasing concentration of organic compounds.

• Macromolecular Research
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• 제17권1호
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• pp.14-18
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• 2009

The acceleration effect of various organic acids, such as methanesulfonic acid (MSA), ethanesulfonic acid (ESA), 4,4'-sulfonyldibenzoic acid (SDA), diphenylacetic acid (DPAA), and $\rho$-toluenesulfonic acid (TSA), on the rate of styrene bulk polymerization with 2,2,6,6-tetramethylpiperidinyloxy (TEMPO) and benzoyl peroxide (BPO) was investigated. The addition of organic acids significantly accelerated the rate. Among these organic acids, DPAA showed an efficient rate-accelerating effect with living nature of polymerization. When DPAA was used as a rate-accelerating additive for TEMPO-mediated living free radical polymerization (LFRP), the rate of polymerization was dramatically enhanced, the linearity of reaction kinetics was successfully maintained, and the polydispersity was effectively controlled.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2007년도 The 1st International Symposium on Advanced Magnetic Materials
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• pp.140.2-140.2
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• 2007

• 한국세라믹학회지
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• 제35권7호
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• pp.726-732
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• 1998

• Korean Chemical Engineering Research
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• 제57권6호
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• pp.847-852
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• 2019

본 연구에서는 퀴노잘린(quinoxaline)과 페로시아나이드(ferrocyanide)를 활물질로 활용한 알칼리 전해질 기반 수계 유기 레독스 흐름전지에 대해 다양한 첨가제를 적용하여 성능을 비교하는 실험을 진행하였다. 퀴노잘린(quinoxaline)의 경우 염화칼륨(KCl) 전해질보다는 수산화칼륨(KOH) 전해질에서의 레독스 전위(-0.97 V)가 더 작은 위치에 있으며, 이에 따라 KOH 전해질에 대해 페로시아나이드와 조합을 이루었을 때, 셀 전압 값은 1.3 V로 높게 나타났다. 상용 양이온 교환막 중 하나인 Nafion 117 멤브레인을 사용하였을 때, 퀴노잘린(quinoxaline)의 부반응 현상을 반전지 상에서 관찰할 수 있었으며, 이에 따라 충방전 자체가 잘 되지 않는 문제점이 있다. 따라서, 문제점이 되는 퀴노잘린(quinoxaline)의 부반응을 해결하기 위해 친전자체와 친핵체 중 하나인 포타슘설페이트($K_2SO_4$)와 포타슘아이오다이드(KI)를 사용하였으며, 포타슘아이오다이드(KI)를 사용하였을 때, 용량 손실율 측면에서 포타슘 아이오다이드(KI)를 첨가제로 넣지 않았을 때($0.29Ah{\cdot}L^{-1}per\;cycle$) 보다 더 낮은 용량 손실율($0.21Ah{\cdot}L^{-1}per\;cycle$)로 더 높은 용량 유지율을 보였다.

• 한국세라믹학회지
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• 제52권6호
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• pp.479-482
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• 2015

The flue gas desulfurization (FGD) process is one of the most effective methods to reduce the amount of $SO_2$ gas (up to 90%) generated by the use of fossil fuel. Limestone is usually used as a desulfurizing agent in the wet-type FGD process; however, the limestone reserves of domestic mines have become exhausted. In this study, limestone sludge produced from the steel works process is used as a desulfurizing agent. Seven different types of additives are also used to improve the efficiency of the desulfurization process. As a result, alkaline additive is identified as the least effective additive, while certain types of organic acids show higher efficiency. It is also observed that the amount of FGD gypsum, which is a by-product of the FGD process, increases with the used of some of those additives.

• Corrosion Science and Technology
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• 제10권4호
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• pp.143-150
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• 2011

Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.

• 한국표면공학회지
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• 제39권1호
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• pp.13-17
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• 2006

The effects of an organic additive, naphthalene trisulfonic acid (NTSA), contained in the nickel sulfamate bath on the surface properties of the electrodeposited nickel layer were investigated through electrochemical technique, x-ray diffraction analysis, and microscopic observation. The addition of NTSA facilitated the oxidation process of electrodeposited nickel layer during anodic scan and also increased the hardness and internal stress of the nickel film as the applied current density became higher. It seems that NTSA modulated the deposit structure during electrodeposition and so induced higher distribution of (110) orientation with respect to (200). With the increase of the NTSA in the bath, nickel layer was formed in small grain size, which resulted in enhanced surface evenness and brightness.