• Korean Journal of Metals and Materials
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• v.49 no.3
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• pp.237-242
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• 2011

The effect of shearing speed on the shear force and energy of Sn-0Ag-0.5Cu solder ball was investigated. Various UBM (under bump metallurgy)'s on Cu pads were used such as ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold; Ni/Pd/Au), ENIG (Electroless Nickel, Immersion Gold; Ni/Au), OSP (Organic Solderability Preservative). To fabricate a shear test specimen, a solder ball, $300{\mu}m$ in diameter, was soldered on a pad of FR4 PCB (printed circuit board) by a reflow soldering machine at $245^{\circ}C$. The solder bump on the PCB was shear tested by changing the shearing speed from 0.01 m/s to 3.0 m/s. As experimental results, the shear force increased with a shearing speed of up to 0.6 m/s for the ENIG and the OSP pads, and up to 0 m/s for the ENEPIG pad. The shear energy increased with a shearing speed up to 0.3 m/s for the ENIG and the OSP pads, and up to 0.6 m/s for the ENEPIG pad. With a high shear speed of over 0 m/s, the ENEPIG showed a higher shear force and energy than those of the ENIG and OSP. The fracture surfaces of the shear tested specimens were analyzed, and the fracture modes were found to have closer relationship with the shear energy than the shear force.

• Journal of Environmental Health Sciences
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• v.40 no.6
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• pp.442-453
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• 2014

Objectives: Persistent organic pollutants (POPs) are known to be the detrimental chemicals in the body, even at low levels, and are stored in adipose tissue. Recently, POPs have been reported to be associated with chronic diseases, including cancer and cardiovascular disease, and aging and obesity are reported as common factors in chronic disease. However, there have been only a few studies on the associations of POPs with age and body mass index (BMI) in Korea. Therefore, we analyzed the associations of serum POPs levels with age and BMI in Korea. Methods: This cross-sectional study includes 444 subjects (253 men and 191 women) from the Korean Cancer Prevention Study-II (2004-2011). Serum levels of 33 polychlorinated biphenyls (PCBs) and 19 organochlorine pesticides (OCPs) were measured by a gas chromatographer (Agilent 6890) coupled to high resolution mass spectrometer (JEOL JMS-800D). Results: Concentrations of PCB 153 (men: 12.26 ng/g lipid, women: 10.50 ng/g lipid) and p,p'-DDE (men: 94.66 ng/g lipid, women: 96.66 ng/g lipid) were the highest among serum PCBs and OCPs, respectively. PCBs and OCPs were significantly positively correlated with age in both sexes. After adjustment for age, non-dioxin like PCBs were significantly negatively correlated with body mass in women. However, cis-heptachlor epoxide was significantly positively correlated with body mass index in both sexes. When analyzed by sex, stronger associations were shown between POPs and age in men and POPs and BMI in women. Conclusion: These results may provide baseline data for the study of POPs and for the health management field in Korea.

• Korean Journal of Environmental Biology
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• v.26 no.4
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• pp.330-342
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• 2008

A comprehensive quality survey for PCDDs/PCDFs and coplanar PCBs as well as heavy metals (Cu, Zn, Cd and Pb) in sediments has been investigated in August 2006, Korea. Monitoring was undertaken at five streams representing different surrounding environments throughout Juwang and Gapyeong streams (reference sites), Jungrang stream (dense population site), Ansan stream (mixed small population and industrial site), and Siheung stream (heavy industrial site). The levels of heavy metal in samples were found to be significantly higher in sediment from Siheung stream compared to those of other stream sites. The heavy metal concentrations (dry weight basis) in sediment from Siheung stream were as follows; Cd (3.7 ${\mu}g$/g), Pb (1,295 ${\mu}g$/g), Cu (713.4 ${\mu}g$/g) and Zn (358.1 ${\mu}g$/g). Among 12 coplanar PCBs and 17 PCDDs/PCDFs selected as target compounds in this study, PCB (IUPAC no. 118) and OCDD were the most abundant congeners found in all sediment samples, followed by 1,2,3,4,6,7,8-HpCDD, OCDF and 1,2,3,4,6,7,8HpCDF as well as PCB (IUPAC no. 105). These results were shown to be in the same trend as the sediment samples of other countries. The levels of PCDDs/PCDFs/coplanar PCBs in sediment samples were expressed as concentrations and WHO- TEQ values. The PCDDs/PCDFs/coplanar PCBs concentrations and their WHO-TEQ values in sediment from Siheung stream were remarkably high. The levels detected were 788.16 pg/g and 36.080 pg WHO-TEQ/g dry weight for PCDDs/ PCDFs and 314 pg/g and 0.4189 pg WHO-TEQ/g dry weight for coplanar PCBs, respectively, beyond the safety level of sediment value 20 pg WHO-TEQ/g. Sediment samples of the five streams were also monitored by sensitive biomarkers using insect immune responses: hemocyte-spreading behavior and immune-associated enzyme activities of phospholipase A$_2$ (PLA$_2$) and phenoloxidase. Organic extracts of Siheung and Jungrang sediments significantly interfered with the hemocytespreading behavior, whereas those of Ansan, Gapyeong, and Juwang did not. These organic extracts did not inhibit the PLA$_2$ and phenoloxidase activities. However, phenoloxidase was highly susceptible to exposure to aqueous extracts in all site sediments. In comparison, PLA$_2$ activities of the hemocytes were significantly inhibited only by aqueous extracts of Siheung, Jungrang, and Gapyeong sediments, but not by those of Ansan and Juwang. Despite some disparity between bioand chemical monitoring results, the biomarkers can be recommended as a device warning the contamination of biohazard environmental chemicals because of a fast and inexpensive detection method.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.2
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• pp.47-53
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• 2015

The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Journal of the Korean Applied Science and Technology
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• v.32 no.3
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• pp.512-521
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• 2015

In this research, environmental friendly organic acid containing microetching system to improve adhesion strength between photoresist resin and Copper Clad Laminate(CCL) was developed without using strong oxidant $H_2O_2$. Etching rate and surface contamination on CCL were examined with various etching conditions with different etchants, organic acids and additives. to develope an optimum microetching condition. Etching solution with 0.04 M acetic acid showed the highest etching rate $0.4{\mu}m/min$. Etching solution with the higher concentration of APS showed the higher etching rate but surface contamination on CCL is very serious. In addition, stabilizer solution also played an important role to control the surface contamination. As a result of research, the etching solution containing 0.04 M of acetic acid, 0.1 M of APS with 4 g/L of stabilizer solution(ST-1) was best to improve adhesion between CCL and photoresist resin as well as showed the most clean and rough surface with the etching rate of $0.37{\mu}m/min$.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.55-61
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• 2010

An impact bending test method was used to evaluate the reliability for the solder joint of lead-free solder ball. In order to standardize the test method, the four point impact bending test was applied under the conditions of various frequencies and amounts of +/-amplitude respectively. Effects on the results were analysed. The optimum condition for impact bending test achieved in this study was the frequency of 10 Hz, and the amplitude of (+12/-1)~(+15/-1). 3 kinds of surface finishes Cu-OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), and ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) were used. Fracture surface showed that cracks were initiated and fractured along the intermetallic layer in the case of surface finishes of Cu-OSP and ENIG, while in the case of ENEPIG the cracks were initiated and propagated in the solder region.

• Bulletin of the Korean Chemical Society
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• v.31 no.5
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• pp.1252-1256
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• 2010

A polyvinylpyrrolidone (PVP)/Ag nanocomposites was prepared by the simultaneous thermal reduction and radical polymerization route. The in situ synthesis of the Ag/PVP nanocomposites is based on the finding that the silver n-propylcarbamate (Ag-PCB) complex can be directly dissolved in the NVP monomer, and decomposed by only heat treatment in the range of 110 to $130^{\circ}C$ to form silver metal. Silver nanoparticles with a narrow size distribution (5 - 40 nm) were obtained, which were well dispersed in the PVP matrix. A successful synthesis of Ag/PVP nanocomposites then proceeded upon heat treatment as low as $110^{\circ}C$. Moreover, important advantages of the in situ synthesis of Ag/PVP composites include that no additives (e.g. solvent, surface-active agent, or reductant of metallic ions) are used, and that the stable silver nanocolloid solution can be directly prepared in high concentration simply by dissolving the Ag/PVP nanocomposites in water or organic solvent.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1929_1930
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• 2009

Fully embedded tunable bandpass filter (BPF) with inductive coupling circuits is newly designed and demonstrated for UHF TV tuner ranged from 500MHz to 900MHz receivers. Conventional RF tuning circuit with an electromagnetic coupled tunable filter has several problems such as large size, high volume, and high cost, since the electromagnetic coupled filter is comprised of several passive components and air core inductors to be assembled and controlled manually. To address these obstacles, compact tunable filter with inductive coupling circuit was embedded into low cost organic package substrate. The embedded filter was optimally designed to have high performance by using high Q spiral stacked inductors, high dielectric $BaTiO_3$ composite MIM capacitors, varactor diodes. It exhibited low insertion loss of approximately -2dB, high return loss of below -10dB, and large tuning range of 56.3%. It has an extremely compact size of $3.4{\times}4.4{\times}0.5mm^3$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.202-202
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• 2008

The world gross market of many kinds of electronics, such as TV and mobile phone has been increasing rapidly these days. It is mainly caused by the amazing developments of IT technology during past decade and the changes of individual life style for the better. Thanks to the increases of electronics manufactured in quantity, much more electronic components such as MLCC (multi layer ceramic capacitor) and PCB (printed circuit board), which are our main products, have been needed as a consequence. Though it was reported that total market of electronic components exceeds several hundreds of billion dollars, there are many manufactures struggling for survival in the competition of electronics components. Then the recognition of quality as a key technology has spread and the efforts for high-yield production lines have been kept in many companies. In this paper, our efforts to eliminate the contamination of particles and the diffusion of some volatile organic compounds which is very harmful to workers at production line have been introduced.