• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 하계학술대회 논문집
• /
• pp.328-329
• /
• 2009

This paper presents the effect of organic Ag complex sintering temperature on the MEH-PPV photoluminescence (PL) properties. MEH-PPV and organic Ag complex was coated on the glass substrate by spin coating method. The coated Ag complex was sintered in an air atmosphere. The sintering temperature was varied from 100 to $200^{\circ}C$ and sintering time was 5 min. The Ag film sintered at temperature higher than $120^{\circ}C$ shows very low sheet resistance less than $0.5\;{\Omega}{/\square}$. The coated MEH-PPV measure photoluminescence (PL) intensity at 580 nm. The PL peak was shifted to the higher wavelength with increasing the sintering temperature.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.431-432
• /
• 2008

We have investigated low temperature sintering characteristics of organic Ag complex. Organic Ag complex was coated on the glass substrate by spin coating method. The coated Ag complex was sintered in an air atmosphere. The sintering temperature was varied from 100 to $300^{\circ}C$ and sintering time was varied from 1 to 4 min. The thickness of the coated film was significantly decreased as the film was sintered at the temperature between 110 and $120^{\circ}C$. The sintered Ag film at temperature higher than $115^{\circ}C$ shows very low sheet resistance less than 1 ${\Omega}{/\square}$.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
• /
• pp.78-79
• /
• 2009

We have investigated low temperature sintering characteristics of organic Ag complex. Organic Ag complex was coated on the glass substrate by spin coating method. The coated Ag complex was sintered in an air atmosphere. The sintering temperature was varied from 30 to $80^{\circ}C$ and sintering time was varied from 1 to 228 hour. The sheet resistance was abruptly changed at $80^{\circ}C$-6h, $65^{\circ}C$-24h, $30^{\circ}C$-228 hour and the thickness of the coated film was significantly decreased. The sheet resistance of Ag films were about $0.53\;{\Omega}/{\square}$ at the $80^{\circ}C$ - 12hour.

• 마이크로전자및패키징학회지
• /
• 제19권3호
• /
• pp.31-36
• /
• 2012

본 연구에서는 고 융점을 지니는 Sn-3.5Ag, Sn-0.7Cu 솔더의 복합 진동 신뢰성을 고찰하였다. 테스트 샘플은 ENIG (Electroless Nikel Immersion Gold) 표면처리 된 BGA (Ball Grid Array)칩에 Sn-3.5Ag, Sn-0.7Cu 솔더볼을 접합 후, 솔더볼이 장착된 BGA부품을 OSP (Organic Solderability Preservative) 표면처리 된 PCB에 리플로우 공정을 통하여 실장 하였다. 복합 진동 신뢰성 시험 중에 부품의 저항 변화를 측정하기 위하여 BGA칩과 PCB는 데이지 체인을 구성하여 제작하였다. 이를 통한 저항의 변화와 시험 전후의 부품에 대한 전단 강도 시험을 통하여 두 종류의 솔더에 대한 복합환경에서의 신뢰성을 비교, 평가하였다. 120시간 복합 진동 동안 전기저항 증가와 접합강도 저하를 고려할 때 Sn-0.7Cu 솔더가 복합 환경에서 높은 안정성을 나타내었다.

• Bulletin of the Korean Chemical Society
• /
• 제31권9호
• /
• pp.2575-2580
• /
• 2010

We present a method for chemically reducing silver alkylcarbamate complex with hydrazine to synthesize silver nanocolloids in an organic solvent using polyvinylpyrrolidone (PVP) as the stabilizer. To determine the optimal conditions for preparing stable silver colloids of controlled size and shape, the silver 2-ethylhexylcarbamate (Ag-EHCB) complex, PVP, hydrazine, and 2-propanol solvent concentrations in the reaction mixture were varied. The initial colloid has a mean particle diameter of 5-80 nm, and it exhibits an absorption band with various shapes in the UV region with a maximum near 420 nm. UV-vis spectroscopy, TEM, and X-ray diffraction techniques were used to investigate the formation and growth process of the metallic silver nanocolloids.

• 폴리머
• /
• 제33권1호
• /
• pp.33-38
• /
• 2009

은 카바메이트 착체 화합물의 환원에 의한 무전해 도금법으로 은/폴리스티렌 비드를 제조하기 위하여 폴리스티렌 및 아민 관능기를 가지는 공중합체 비드를 제조하였다. 스티렌, divinylbenzene(DVB) 그리고 2-(N,N-dimethylamino)ethyl methacrylate (DAEMA) 단량체들을 poly(vinyl alcohol) 존재 하에서 물/메탄올을 용매로 사용하여 무유화중합을 진행하였다. 30/0$\sim$1.5/0$\sim$3 wt%의 단량체 조성을 가지는 poly(styrene/DVB/DAEMA) 비드는 구형으로 1 ${\mu}m$의 일정한 크기를 가지고 있었다. 아민 기능기를 가지는 폴리스티렌 비드의 무전해 도금은 비드의 전처리 없이 silver 2-ethylhexylcarbamate (Ag-EHCB) 복합체와 히드라진 환원제를 사용하여 메탄올 용액에서 진행하였다. 제조된 비드와 도금된 비드 표면의 형태를 SEM으로 관찰하였으며 은 도금된 비드를 분산시켜 자외선 흡수 변화 그리고 도금된 은의 성분을 XRD로 분석하였다.

• 마이크로전자및패키징학회지
• /
• 제31권2호
• /
• pp.1-8
• /
• 2024

Bonding wires are composed of conductive metals of Au, Ag & Cu with excellent electrical conductivities for transmitting power and signals to wafer chips. Wire metals do not provide electrical insulation, adhesion promoter and corrosion passivation. Adhesion between metal wires is extremely weak, which is responsible for wire cut failures during thermal cycling. Organic coating for electrical insulation does not satisfy bondability and manufacturability, and it is complex to apply very thin organic coating on metal wires. Automotive packages require enhanced reliability of packages under harsh conditions. LED and power packages are susceptible to wire cut failures. Contrary to conventional OCB behaviors, forming gas was not required for free air ball formation for both Ag and Pd-coated Cu wires with Al₂O₃ passivation.

• Bulletin of the Korean Chemical Society
• /
• 제31권5호
• /
• pp.1252-1256
• /
• 2010

A polyvinylpyrrolidone (PVP)/Ag nanocomposites was prepared by the simultaneous thermal reduction and radical polymerization route. The in situ synthesis of the Ag/PVP nanocomposites is based on the finding that the silver n-propylcarbamate (Ag-PCB) complex can be directly dissolved in the NVP monomer, and decomposed by only heat treatment in the range of 110 to $130^{\circ}C$ to form silver metal. Silver nanoparticles with a narrow size distribution (5 - 40 nm) were obtained, which were well dispersed in the PVP matrix. A successful synthesis of Ag/PVP nanocomposites then proceeded upon heat treatment as low as $110^{\circ}C$. Moreover, important advantages of the in situ synthesis of Ag/PVP composites include that no additives (e.g. solvent, surface-active agent, or reductant of metallic ions) are used, and that the stable silver nanocolloid solution can be directly prepared in high concentration simply by dissolving the Ag/PVP nanocomposites in water or organic solvent.

• Bulletin of the Korean Chemical Society
• /
• 제33권12호
• /
• pp.3987-3992
• /
• 2012

Silver nanopowders were prepared from silver 2-ethylhexylcarbamate (Ag-EHCB) complexes by simple thermal reduction at $85^{\circ}C$ without any reducing agent in organic solvent. 2-Ethylhexylammonium 2-ethylhexylcarbamate (EHAEHC) was investigated in terms of their abilities to stabilize the silver nanoparticles (Ag-NPs) and its subsequent effects on the preventing aggregation between Ag-NPs. Conditions (concentration of stabilizer and reaction time) used to reduce Ag-EHCB complex were systematically varied to determine their effects on the sizes of Ag-NPs. The formation of the stabilized Ag-NPs were easily monitored by UV-vis spectroscopy and characterized by TGA, TEM, SEM and XRD. When EHAEHC was used as a stabilizer, Ag-NPs of 10-30 nm in diameter were easily obtained in high yield. Silver patterns were obtained from a silver nano-paste by heat treatment at $200^{\circ}C$ in air and were found to have resistivity values of $2.9{\times}10^{-8}\;{\Omega}{\cdot}m$.

• Bulletin of the Korean Chemical Society
• /
• 제30권11호
• /
• pp.2669-2674
• /
• 2009

Controlled reduction of silver alkylcarbamate complexes with hydrogen gas was investigated as a facile synthetic method for high concentrations of silver nanocolloids in organic solvent. Polyvinylpyrrolidone (PVP) was used to stabilize the silver colloids obtained from the chemical reduction. To determine optimum conditions for preparation of the stable and controlled silver colloids with the narrowest particle size and distribution, a large number of experiments were carried out involving variations in the concentrations of the silver 2-ethylhexylcarbamate (Ag-EHCB) complex, PVP, and 2-propanol. The initial colloid had a mean particle diameter between 5$\sim$50 nm, as measured by transmission electron microscopy, and exhibited a sharp absorption band in the UV region with a maximum size near 420 nm. After treatment with a reducing agent, the colloids were characterized by ultraviolet-visible spectroscopy, X-ray diffraction, and high-resolution transmission electron microscopy.