• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1999년도 춘계학술대회논문집
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• pp.124-128
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• 1999

Since the traditional designing approach of forming processes is based on trial and error it consumes much time and needs cost to design successful processes. Today for higher marketability of products a manufacturing system is required that can reduce production time and enhance product properties greatly. In order to implement the system a computerized design-supporting tool is indispensable for the design and supply of optimized production process for high product quality in short time In this study a design supporting system is developed and implemented to ballstud die. Using the developed system the designer can rapidly produce layouts of dies for each process sequences with consistency.

• 한국기계가공학회지
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• 제12권1호
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• pp.117-125
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• 2013

Variations of springback in stamped parts are induced by the uncontrollable noises including the variation of incoming material properties, lubrication and other forming process parameters. Reduction of springback variation is very important during springback compensation processes on stamping dies and assembly processes. To reduce the variation of springback, a robust optimization methodology which uses complex method combined with orthogonal array is proposed. The proposed method is applied to the robust design of U-channel die for the reduction of side wall curl. It is shown that the drawbead and die radius of U-channel draw die can be effectively optimized by the proposed method.

• 한국기계가공학회지
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• 제17권4호
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• pp.83-90
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• 2018

In this research, we developed a process design hot-forging technology that precisely forms an inner race. The inner race transmits power to a one-way clutch of an automatic transmission and minimizes the CNC machining allowance. For a multi-stage hollow shape (inner race), we proposed several shapes of blocker and finisher for the precision hot-forging process and analyzed the forging process using DEFORM. The hot-forging process was optimized for several parameters, such as metal flow pattern, forging defect, and forming load. Blockers and finisher dies in the hot-forging process were designed to select optimal shapes from finite element analysis, and experiments were conducted to optimize the hot-forging process.

• 한국정밀공학회지
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• 제22권12호
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• pp.156-162
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• 2005

In this paper, we study the mechanism of lead deformation by numerically simulating the stamping process by means of a commercial finite element code. It is very important to analyze effects that the lead shape makes on the lead deformation, because the lead shape is often modified in order to minimize the deformation or to increase the buckling critical load of the punch. Therefore the stamping process, first, numerically simulated by considering as a quasi-static problem. Second, the effect on the lead deformation due to the lead shape variation, a linear lead geometry and a bent lead, was numerically analyzed and discussed. Finally, the punching order was optimized fur multi-lead generating stamping process. The results show that the bent lead is little bit more shifted than the linear lead after the punching process. But the bent lead is vertically less deformed than the linear lead. The punching order to successively generate the lead is good to keep the lead space uniform. The results will be very effectively applied for the design of the blanking or punching dies in industry.

• Design & Manufacturing
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• 제8권2호
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• pp.1-6
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• 2014

The narrow-pitched connectors are of interest for small-scale devices such as smart phones because of theirs caling. We conducted an injection molding analysis and a warp analysis for 0.3mm and 0.5mm pitch FPC connectors. We obtained a volumetric shrinkage of 4.344%, a clamping force of 0.2529 tonne, a maximum injection pressure of 76.3 MPa as optimized molding conditions for the 0.3mm pitch FPC connector. We found that, compared with the traditional injection molding technique, the injection molding for narrow-pitched connectors comes with distinct features like low clamping force, high injection molding pressure, and narrow gate size. Adding to the optimization analysis, the deflection of 0.5mm pitch FPC connector was analyzed as well. A maximum deflection of 0.053mm was calculated, which the actual deflection of 0.062mm was compared to. The results deduced a relative error of 17%. We conclude that the deflection analysis along with the optimization analysis can be used as an effective tool to predict the behavior of narrow-pitch connectors although the relative error may need to improve.

• 한국기계가공학회지
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• 제20권1호
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• pp.34-41
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• 2021

Interventional radiology and minimally invasive surgery both require a precisely shaped microcatheter. Microcatheters are manufactured using polymer extrusion processes with a die and puller. The manufacturing parameters and die geometry greatly influence the profile of the extrudate and designing dies using a trial-and-error process is expensive and requires a lot of time. Therefore, predicting the profile of the extrudate is important for manufacturing microcatheters. This study investigates the effects of die design and geometry on the profile of the extrudate. The profiles of the extrudate are predicted using ANSYS Polyflow with respect to the different die geometries. The outer and inner diameters and wall thickness of the predicted extrudate are compared to those of a target extrudate. The die swell of melt polymer and the effect of the pulling are both examined. Optimized die designs are suggested for manufacturing the target extrudate.

• 대한기계학회논문집A
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• 제37권7호
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• pp.865-873
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• 2013

CNG 압력용기의 제조를 위하여 고성능 수평식 프레스를 이용한 딥드로잉과 아이어닝의 연속공정(D.D.I. 공정)이 도입되었다. 그러나, 몇몇 D.D.I. 공정 변수들은 현장 경험에 의존하여 결정되는 문제점이 있으며, 다이의 짧은 수명 역시 고성능, 저비용의 압력용기 제조를 위하여 필수적으로 개선되어야 한다. 본 연구에서는, 공정의 신뢰성 확보 및 다이 수명 향상을 위하여 기존 관련 연구 및 현장 경험을 바탕으로 드로잉비, 다이 간의 간격, 드로잉 다이의 라운딩 반경, 아이어닝 다이의 각도를 공정변수로 결정하였다. FEA 를 이용하여 각 성형 단계에서 찢어짐과 주름이 발생하지 않는 한계 드로잉비를 결정하였고, 다이 간의 간격, 드로잉 다이의 라운딩 반경, 아이어닝 다이의 각도에 대하여 실험계획법을 이용하여 최적 공정설계를 수행하였으며, 기존 공정에 의한 결과와 비교하여 효율성을 검증하였다.

• 한국산학기술학회논문지
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• 제20권4호
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• pp.503-509
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• 2019

더욱 작고 얇고 빠르며, 많은 기능을 가진 모바일 기기에 대한 요구가 그 어느 때보다 높다. 이에 대한 기술적 대응의 하나로 여러 개의 칩을 적층하는 Stacked Chip Scale Package(SCSP)가 어셈블리 업계에서 사용되고 있다. 다수의 칩을 접착하는 유기접착제로는 필름형 접착제인 die attach film(DAF)가 사용된다. 칩과 유기기판의 접착의 경우, DAF가 기판의 단차를 채우기 위해서는 고온에서 높은 유동성이 요구된다. 또한 와이어 사이를 채우면서 고용량 메모리와 같이 동일한 크기의 칩을 접착하는 DAF의 경우에도, 본딩 온도에서 높은 유동성이 요구된다. 본 연구에서는 DAF의 주요 원재료 3성분에 대한 혼합물 설계 실험계획법을 통하여 고온에서 낮은 탄성계수를 갖도록 최적화하고, 이에 따른 점착 특성 및 경화 특성을 평가하였다. 3성분은 아크릴 고분자(SG-P3)와 연화점이 다른 두 개의 고상에폭시 수지(YD011과 YDCN500-1P)이다. 실험계획법 평가 결과에 따르면, 고온에서는 아크릴 고분자 SG-P3의 함량이 작을수록 탄성계수가 작은 값을 나타내었다. $100^{\circ}C$에서의 탄성계수는 SG-P3의 함량이 20% 감소한 경우, 1.0 MPa에서 0.2 MPa 수준으로 감소하였다. 반면, 상온에서의 탄성계수는 연화점이 높은 에폭시 YD011에 의해 크게 좌우되었다. 최적 처방은 UV 다이싱 테이프를 적용시 98.4% 수준의 비교적 양호한 다이픽업 성능을 나타냈다. 유리칩을 실리콘 기판에 부착하고 에폭시를 1단계 경화시킨 경우, 크랙이 발생하였으나, 아민 경화 촉진제의 함량 증가와 2단계 경화를 통하여 크랙의 발생을 최소화할 수 있었다. 이미다졸계 촉진제가 아민계 촉진제에 비해 효과가 우수하였다.