• 한국광학회:학술대회논문집
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• 한국광학회 2009년도 동계학술발표회 논문집
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• pp.387-388
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• 2009

바이오포토닉스는 생물학과 포토닉스의 융합학문으로 특히, 최근 바이오이미징기술, 광바이오센서, 광조절 및 바이오칩의 광학센서시스템 및 광학집게 개발등에 큰 관심을 받고 있고 다양한 융합연구를 창출하고 있다. 미세기전시스템(MEMS: Microelectromechancial system)은 센서나 구동기를 초소형화 하기 위해 매우 유용한 기술로서 지난 10여년간 광통신분야에서 미세광학소자 및 집적광통신 반도체소자개발에 응용되어왔다. 최근 이러한 MEMS 기술을 이용하여 고감도 바이오센서나 고분해능, 실시간 바이오 이미징시스템을 초소형하는 연구가 활발히 진행되고 있다. 본 연구에서는 바이오포토닉스 응용을 위한 광학소자의 초소형화 기술의 장점과 응용가능분야에 관해 소개하고자 한다.

• 한국광학회지
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• 제28권4호
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• pp.153-157
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• 2017

지향성적외선방해장비의 정렬 정밀도를 높히고 중량을 감소시키기 위해 적용된 적외선 카메라-레이저 공통광학계 구조에서 영상 성능 저하를 야기시키는 레이저빔 열 영향성을 분석하였다. 높은 에너지 밀도를 가지는 레이저빔이 광부품에 흡수되면 열이 발생하고 온도가 상승한다. 공통광학계 광부품 표면에서 발생한 열은 시스템 투과율을 감소시켜 적외선 카메라의 영상 품질을 저하시킬 수 있다. 지향성적외선방해장비의 운용개념을 고려하여 파장 $4{\mu}m$, 출력 3 W의 레이저빔이 10초간 미러(알루미늄, 실리카 글래스, 실리콘) 및 렌즈(사파이어, 셀레늄화아연, 실리콘, 게르마늄) 재료에 조사되는 상황을 가정하여 온도 분포를 계산하였다. 계산 결과, 미러 재료로는 실리카 글래스, 렌즈 재료로는 사파이어의 온도 상승이 상대적으로 컸고, 재료 온도 분포에 가장 큰 영향을 미치는 요소는 재료의 레이저빔 흡수율과 열전도도임을 확인하였다. 결론적으로 적외선 카메라-레이저 공통광학계에 사용하는 광부품은 흡수율이 낮고 열전도도가 높은 특성을 갖도록 선정되어야 광부품 온도 상승에 의한 적외선 카메라의 영상 품질 저하를 방지할 수 있다.

• 소성∙가공
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• 제11권2호
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• pp.103-107
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• 2002

With the great demand for WDM (Wavelength Division Multiplexing) optical communications, optical switches are expected to become one of the dominant components in future networks. Conventional mechanical switches suffer from poor reliability and large size; however, many micromachined optical switches with moving mirrors have been proposed for high scale OXC (Optical Crossconnect) or ADM (Add/Drop Multiplex) because of the low power consumption and high reliability of these switches. In this paper, we introduce the technological trends of optical switches using MEMS, related micromachining technologies and their characteristics.

• 천문학논총
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• 제20권1호
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• pp.151-161
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• 2005

The reimaging optics of the KASINICS (KASI Near Infrared Camera System) includes many transparent components like an entrance window, band-pass filters, and blocking filters. As observational targets or in-field background objects, bright stars may cause optical ghosts that can significantly degrade the system performance of the KASINICS. We estimated analytically the relative brightness of ghost components with respect to a point source and examined the effects of tilting optical components as a method of suppressing ghosts. We also performed numerical ray tracings including all the optical components and found the results are consistent with those of the analytic estimations. We conclude that the KASINICS will not suffer from significant ghost effects with appropriate anti-reflection coatings and fittings for the optical components.

• 한국기계가공학회지
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• 제9권6호
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• pp.1-6
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• 2010

Patterned optical components are widely used for optical products such as LCD and lighting. Since CCFL was used as a light source in the products, prism films having linear continuous optical patterns were widely used. However, LED which is a dot light source is popular recently, therefore, the optical products need new optical components having non-continuous optical patterns. Indentation machining method is a powerful method for machining of non-continuous pattern. When a copper mold and a brass mold were machined by this method, severe plastic deformation called pile-up was observed around the patterns. Since pile-up has negative relationship to ductility, this deformation can be eliminated by annealing treatment which makes the materials ductile. No plastic deformation occurred when machined after annealing at $600{^{\circ}C}$ and $575{^{\circ}C}$ for copper and brass, respectively. Finally, non-continuous optical patterns with high quality were machined on a copper mold and a brass mold successively.

• 전자통신동향분석
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• 제34권5호
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• pp.81-90
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• 2019

The data rate for transmission through fiber-optic cables has increased to 400 Gbps in single-wavelength channels. However, speeds up to 1 Tbps are required now to meet the ever-increasing bandwidth demand driven by the diverse requirements of contemporary applications for high-quality on-demand video streaming, cloud services, various social media, and emerging 5G-enabled applications. Because the data rates of the per-channel optical interfaces depend strongly on the operational speed of the optoelectronic devices used in optical transceivers, ultrahigh-speed photonic devices and components, and eventually, chip-level transmitter and receiver technologies, are essentially required to realize futuristic optical transceivers with data rates of 1 Tbps and beyond. In this paper, we review the recent progress achieved in high-speed optoelectronic devices, such as laser diodes, optical modulators, photodiodes, and the transmitter-receiver optical subassembly for optical transceivers in data centers and in metro/long-haul transmission.

• ETRI Journal
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• 제28권1호
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• pp.9-16
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• 2006

In this paper, we analyzed and measured the electrical crosstalk characteristics of a 1.25 Gbps triplexer module for Ethernet passive optical networks to realize fiber-tothe-home services. Electrical crosstalk characteristic of the 1.25 Gbps optical triplexer module on a resistive silicon substrate should be more serious than on a dielectric substrate. Consequently, using the finite element method, we analyze the electrical crosstalk phenomena and propose a silicon substrate structure with a dummy ground line that is the simplest low-crosstalk layout configuration in the 1.25 Gbps optical triplexer module. The triplexer module consists of a laser diode as a transmitter, a digital photodetector as a digital data receiver, and an analog photodetector as a cable television signal receiver. According to IEEE 802.3ah and ITU-T G.983.3, the digital receiver and analog receiver sensitivities have to meet -24 dBm at $BER=10^{-12}$ and -7.7 dBm at 44 dB SNR. The electrical crosstalk levels have to maintain less than -86 dB from DC to 3 GHz. From analysis and measurement results, the proposed silicon substrate structure that contains the dummy line with $100\;{\mu}m$ space from the signal lines and 4 mm separations among the devices satisfies the electrical crosstalk level compared to a simple structure. This proposed structure can be easily implemented with design convenience and greatly reduce the silicon substrate size by about 50 %.

• Current Optics and Photonics
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• 제7권5호
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• pp.529-536
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• 2023

The Morlet wavelet transform method is proposed to analyze a single interferogram with spatial carrier frequency that is captured by an optical interferometer. The method can retain low frequency components that contain the phase information of a measured optical surface, and remove high frequency disturbances by wavelet decomposition and reconstruction. The key to retrieving the phases from the low-frequency wavelet components is to extract wavelet ridges by calculating the maximum value of the wavelet transform amplitude. Afterwards, the wrapped phases can be accurately solved by multiple iterative calculations on wavelet ridges. Finally, we can reconstruct the wave-front of the measured optical element by applying two-dimensional discrete cosine transform to those wrapped phases. Morlet wavelet transform does not need to remove the spatial carrier frequency components manually in the processing of interferogram analysis, but the step is necessary in the Fourier transform algorithm. So, the Morlet wavelet simplifies the process of the analysis of interference fringe patterns compared to Fourier transform. Consequently, wavelet transform is more suitable for automated programming analysis of interference fringes and avoiding the introduction of additional errors compared with Fourier transform.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 춘계학술대회 논문집
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• pp.167-172
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• 2002

Recent years, optical components'are widely used in optical communication industry for high speed and mass storage data processing. Micro grooving of planar lightwave circuit and glass, those are widely used in optical component, are realized by polycrystalline diamond tool with ultrasonic vibration. To know the characteristics of brittle materials cutting, ultrasonic vibration cutting tool and machining system are built for the experiment. Grooving on planar lightwave circuit and glass experiments are performed and their shape are measured by photograph with microscope. It reveals that better groove shape with low chipping of planar lightwave circuit and glass are obtained by micro grooving machining with ultrasonic vibration. These experiments are considered as a possibility to the micro grooving of optical communication components.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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• pp.1586-1589
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• 2007

The influence of optical components constituting the backlight of TV on the luminance property of backlight was analyzed. The variation of luminance when the light emitted from light source passes each optical part was evaluated.