• Journal of the Korean Wood Science and Technology
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• 제37권1호
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• pp.65-72
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• 2009

잣나무와 낙엽송 조림목 수간 내에서 단열방사조직과 방추형방사조직의 연륜 내 및 축방향의 변이성을 조사하였다. 잣나무와 낙엽송의 단열방사조직의 높이는 각기 평균 6.3 및 9.1 세포고로서 낙엽송이 더 높았다. $0.25mm^2$ 면적당 단열방사조직의 개수는 각각 평균 6.5개 및 7.5개로써 낙엽송이 더 많았으며 방추형방사조직의 높이는 양 수종 모두 평균 20세포고 정도로서 거의 차이가 없었다. 연륜 내에서 조재부에서 만재부로 이행해 감에 따라 단열방사조직과 방추형방사조직의 높이는 감소하였으나 개수에는 거의 변화가 없었다. 축방향으로 단열방사조직의 세포고는 지상고가 증가함에 따라 점차 증가하였다. 단열방사조직의 개수는 잣나무에서 지상고 5.2m까지 거의 일정하였고 그 이상의 지상고부터 증가하였으나 낙엽송에서는 일관된 경향을 찾아보기 어려웠다. 방추형방사조직의 높이는 지상고가 낮은 수간의 기부에서 가장 낮았으며 수간의 중앙부로 올라감에 따라 높아 지다가 수관부에서 다시 낮아지는 경향이 있었다. 본 연구 결과, 연륜 내에서의 방사조직의 변이성은 비교적 뚜렷하였으나 축방향에서의 변이성은 일관된 경향이 없어 그 경향을 명확히 밝히는 것은 어려울 것으로 생각되었다.

• Journal of the Korean Wood Science and Technology
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• 제35권6호
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• pp.43-49
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• 2007

국내 간척지에서 생장한 양마(kenaf)의 생장기관과 높이에 따른 해부학적 특성을 광학현미경과 주사전자현미경(SEM)을 사용하여 관찰하였다. 2006년 5월에 파종한 케나프를 동년 7, 8, 9,10월 총 4회에 걸쳐 채취하고, 각 생장기간 별로 3, 35, 70, 105 cm의 높이에서 시료를 채취하여 실험을 실시하였다. 사부에는 인피섬유, 방사조직, 사관이 존재하였고 목부에는 도관, 목섬유, 방사조직과 수가 존재하였다. 목질부의 도관은 산재상으로 고립관공과 방사복합관공이 혼재하였고 도관상호간벽공은 교호상 벽공의 형태가 관찰되었다. 또한 목부의 방사조직은 단열, 복열 및 다열방사조직이 혼재하였고 방사유세포의 형태는 직립, 평복, 방형세포가 모두 존재하였다. 생장기간이 길어질수록 사부와 목부가 증가하였고 수심부가 감소하였으며, 인피섬유의 층수와 사부방사조직이 증가하였다. 그리고 사부에 있어서 형성층부위에 가까운 인피섬유의 층이 외층부의 인피섬유의 층보다 더 크고 세포수가 많았다. 또한 생장기간이 길어질수록 접선단면에서 다열방사조직이 많이 관찰되었다. 생장 높이가 높아질수록 사부가 증가하였고 목부가 감소하였으며, 인피섬유의 층수와 사부방사조직이 감소하였다. 그리고 생장높이가 높아질수록 접선단면에서 단열방사조직이 많이 관찰되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.271-272
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• 2012

Bulk Metallic Glasses (BMGs or amorphous alloy) exhibit high strength and good corrosion resistance. Applications of thin films and micro parts of BMGs have been used a lot since its inception in the research of BMGs. However, Application and fabrication of BMGs are limited to make structural materials. Thin films of BMGs which is sputtered on the surface of structural materials by sputtering process is used to improve limits about application of BMGs. In order to investigate the difference of properties between designed alloys and thin films, we identified that thin films deposited on the surface that have the characteristic of the amorphous films and the composition of designed alloys. Zr-Cu (Cu=30, 35, 38, 40, 50 at.%) and Zr-Cu-Al (Al=10 at.% fixed, Cu=26, 30, 34, 38 at.%) alloys were fabricated with Zr (99.7% purity), Cu (99.997% purity), and Al (99.99% purity) as melting 5 times by arc melting method before rods 2mm in diameter was manufactured. In order to analyze GFA (Glass Forming Ability), rods were observed by Optical Microscopy and SEM and $T_g$, $T_x$, ($T_x$ is crystallization temperature and $T_g$ is the glass transition temperature) and Tm were measured by DTA and DSC. Powder was manufactured by Gas Atomizer and target was sintered using powder in large supercooled liquid region ($=T_x-T_g$) by SPS(Spark Plasma Sintering). Amorphous foil was prepared by RSP process with 5 gram alloy button. The composition of the foil and sputtered thin film was analyzed by EDS and EPMA. In the result of DSC curve, binary alloys ($Zr_{62}Cu_{38}$, $Zr_{60}Cu_{40}$, $Zr_{50}Cu_{50}$) and ternary alloys ($Zr_{64}Al_{10}Cu_{26}$, $Zr_{56}Al_{10}Cu_{34}$, $Zr_{52}Al_{10}Cu_{38}$) have $T_g$ except for $Zr_{70}Cu_{30}$ and $Zr_{60}Al_{10}Cu_{30}$. The compositions with $T_g$ made into powders. Figure shows XRD data of thin film showed similar hollow peak.

• 미생물학회지
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• 제38권1호
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• pp.26-30
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• 2002

담수식물 수초의 근계 에 부착하는 미생물의 자정력을 탐색하기 위하여 분리된 세균인 Pseudomonas cepacia KH410 을 대상으로 중금속인 납과 구리, 카드뮴이온에 대한 영향을 조사하였다. 이 균의 최적 배지로 Nutrient기본배지를 사용하였고 최대 균체 생산을 위하여 yeast extract, soytone을 각각 1%씩 첨가하였고, NaCl은 0.5%, 초기 pH는 7.0 그리고 배양은 $28^{\circ}C$에서 24 시간 진탕 배양하였다. 이러한 배양 조건하에서 얻어진 최대 균체는 2.72 g DCW/ι-medium이었다. 각각의 100 mg/ι중금속 첨가에 따른 균체 생산은 납은 1.98 g/ι, 구리는 1.58g/ι, 카드뮴은 0.2 g/ι로 세가지 중금속 첨가에 따른 균체 생산이 낮아졌으며 중금속별로 균체 생산량에 차이를 나타내었다. 균의 생육에 영향을 미치는 각각의 중금속 농도를 비교하여 본 결과 최저생육저지농도 (MIC)가 납은 1.3 mM, 구리는 0.8 mM, 카드윰은 0.4 mM로써 카드윰이 균체에 미치는 영향이 가장 높게 나타났다. 동일 농도인 100 mg/ι용액 내에서의 세가지 중금속에 대한 균체의 변화는 균체끼리의 응집 현상이 광학현미경하에서 1 일에서 4 일 사이에 관찰되었고 전자현미경하에서는 각각의 중금속을 10분 노출시킨 후부터 세포벽 쪽으로 이온들이 이동되는 것이 관찰되었고 2 시간 후에는 세포외피, 원형질분리 및 세포내부로 침적된 양상이 각각 다르게 나타났으며 균체의 손상은 카드뮴이 가장 높았고 그 정도는 카드뮴>구리>납의 순이었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 한국재료학회지
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• 제23권3호
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• pp.155-160
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• 2013

ZnO thin films co-doped with Mg and Ga (MxGyZzO, x + y + z = 1, x = 0.05, y = 0.02 and z = 0.93) were prepared on glass substrates by RF magnetron sputtering with different sputtering powers ranging from 100W to 200W at a substrate temperature of $350^{\circ}C$. The effects of the sputtering power on the structural, morphological, electrical, and optical properties of MGZO thin films were investigated. The X-ray diffraction patterns showed that all the MGZO thin films were grown as a hexagonal wurtzite phase with the preferred orientation on the c-axis without secondary phases such as MgO, $Ga_2O_3$, or $ZnGa_2O_4$. The intensity of the diffraction peak from the (0002) plane of the MGZO thin films was enhanced as the sputtering power increased. The (0002) peak positions of the MGZO thin films was shifted toward, a high diffraction angle as the sputtering power increased. Cross-sectional field emission scanning electron microscopy images of the MGZO thin films showed that all of these films had a columnar structure and their thickness increased with an increase in the sputtering power. MGZO thin film deposited at the sputtering power of 200W showed the best electrical characteristics in terms of the carrier concentration ($4.71{\times}10^{20}cm^{-3}$), charge carrier mobility ($10.2cm^2V^{-1}s^{-1}$) and a minimum resistivity ($1.3{\times}10^{-3}{\Omega}cm$). A UV-visible spectroscopy assessment showed that the MGZO thin films had high transmittance of more than 80 % in the visible region and that the absorption edges of MGZO thin films were very sharp and shifted toward the higher wavelength side, from 270 nm to 340 nm, with an increase in the sputtering power. The band-gap energy of MGZO thin films was widened from 3.74 eV to 3.92 eV with the change in the sputtering power.

• Corrosion Science and Technology
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• 제9권4호
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• pp.147-152
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• 2010

Conventional paints for conversion coating applications in steel production derived mainly from water-based polymer dispersions containing several additives actually show good general performance, but suffer from poor scratch and abrasion resistance during use. The reason for this is because the relatively soft organic binder matrix dominates the mechanical surface properties. In order to maintain the high quality and decorative function of coated steel sheets, the mechanical performance of the surface needs to be improved significantly. In fact the wear resistance should be enhanced without affecting the optical appearance of the coatings by using appropriate nanoparticulate additives. In this direction, nanocomposite coating compositions (Nanomer$^{(R)}$) have been derived from water-based polymer dispersions with an increasing amount of surface-modified nanoparticles in aqueous dispersion in order to monitor the effect of degree of filling with rigid nanoparticles. The surface of nanoparticles has been modified for optimum compatibility with the polymer matrix in order to achieve homogeneous nanoparticle dispersion over the matrix. This approach has been extended in such a way that a more expanded hybrid network has been condensed on the nanoparticle surface by a hydrolytic condensation reaction in addition to the quasi-monolayer type small molecular surface modification. It was expected that this additional modification will lead to more intensive cross-linking in coating systems resulting in further improved scratch-resistance compared to simple addition of nanoparticles with quasi-monolayer surface modification. The resulting compositions have been coated on zinc-galvanized steel and cured. The wear resistance and the corrosion protection of the modified coating systems have been tested in dependence on the compositional change, the type of surface modification as well as the mixing conditions with different shear forces. It has been found out that for loading levels up to 50 wt.-% nanoparticles, the mechanical wear resistance remains almost unaffected compared to the unmodified resin. In addition, the corrosion resistance remained unaffected even after $180^{\circ}$ bending test showing that the flexibility of coating was not decreased by nanoparticle addition. Electron microscopy showed that the inorganic nanoparticles do not penetrate into the organic resin droplets during the mixing process but rather formed agglomerates outside the polymer droplet phase resulting in quite moderate cross linking while curing, because of viscosity. The proposed mechanisms of composite formation and cross linking could explain the poor effect regarding improvement of mechanical wear resistance and help to set up new synthesis strategies for improved nanocomposite morphologies, which should provide increased wear resistance.

• 한국재료학회지
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• 제9권10호
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• pp.1006-1011
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• 1999

$SiH_4$, $CH_4$, $B_2H_6$ 혼합기체를 이용하여 플라즈마 화학증착법으로 탄화실리콘 (a-SiC:H) 박막을 증착하였다. 증착중에 혼합기체중의$CH_4$농도 ($CH_4/CH_4+SiH_4$)를 변화시켜 얻은 박막의 물성을 SEM, XRD, Raman 분광법, FTIR, XPS, 광흡수도와 광전도도 분석을 통하여 살펴보았다. $SiH_4$기체만 이용하여 증착한 Si:H 박막은 비정질상태를 나타내었으나, $CH_4$가 첨가됨에 따라 실리콘 박막의 Si-$\textrm{H}_{n}$(n은 정수) 결합기가 Si-$\textrm{C}_{n}\textrm{H}_{m}$ (n,m은 정수) 형태의 결합기로 변화되었으며, 박막내 수소함량은 $CH_4$농도가 0~0.8의 범위에서 증가함에 따라 30~45% 범위에서 증가하였다. 반응기체중의 $CH_4$농도의 증가에 따라 박막 내의 탄소 농도가 증가함을 확인하였으며, 이에 따라 막의 전기비저항과 광학적밴드갭 역시 증가하였다.

• 한국안광학회지
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• 제5권2호
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• pp.167-173
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• 2000

시편의 열분석과 SEM 분석에서 투명한 BP-계열의 시료 중 BP-1은 두 가지의 미세한 상으로 형성된 액적을 가진 유리 상을 발견할 수 있었고 열처리에 의하여 불혼화 영역이 생겨났다. BP-2 시료의 경우에서는 구형의 불혼화 영역이 관찰되는데 이와 같은 불혼화 현상의 원인은 용융액 내에 존재하는 양이온의 이온장 세기에 의한 것으로 해석하였다. 그리고 BP-계열 유리의 파장에 대한 흡수도는 $Bi_2O_3$의 함량이 많을수록 크게 나타났으며 400~800 nm 파장범위에서 흡수도의 변화는 완만하게 나타났다. 그리고 자외선에 대한 흡수단은 좀더 긴 파장 쪽으로 이동하였다. FT-IR 스펙트럼에서 BP-계열의 유리는 PbO 함량이 많은 시료가 보다 큰 흡수가 일어났으며 $3382cm^{-1}$과 $2800cm^{-1}$에서 나타나는 흡수대는 각각 사면체 $BO_1$에서 B-O 신축진동에 해당하는 흡수대와 B-O-B 변각진동에 해당하는 흡수대임을 알 수 있었다. BP-계열에서 $3400cm^{-1}$ 흡수대들이 예리해지는 것은 유리질 내 생성된 결정상이 성장하고 있는 것으로 판명되었다.

• Journal of Periodontal and Implant Science
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• 제28권2호
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• pp.337-350
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• 1998

The purpose of this' study was to compare surface roughness and morphologic changes after use of various plaque control devices to titanium implant surfaces. The study materials were 6 ITI titanium implants($Bonefit^{(R)}$) and 5 plaque control devices. 6 implants were divided into 6 different groups and instrumented by each plaque control devices as follows. 1) Group I : untreated control 2) Group II : Titanium curette(Titanium $curette^{(R)}$, 3i) 80 vertical/horizontal strokes 3) Group III : Plastic curette($Implacare^{(R)}$, Hu-Friedy) 80 vertical/horizontal strokes 4) Group N : Plastic tip-ultrasonic scaler($Amdent^{(R)}$, Amdent) 160 seconds 5) Group V : Rotating interdental brush($Identobrush^{(R)}$, Identoflex) 160 seconds 6) Group VI : Abrasive rubber cup polisher($Zircate^{(R)}$, Prophy paste, Dentsply) 160 sec-onds. All specimens were prepared for evaluation by surface roughness tester, optical stereomicroscopy(OM) and scanning electron microscopy(SEM). The Ra and Rt mean values of the tested specimens were 1) Group I ($Ra=0.170{\pm}0.007{\mu}m$, $Rt=1.297{\pm}0.016{\mu}m$) 2) Group II ($Ra=0.209{\pm}0.006{\mu}m$, $Rt=1.602{\pm}0.110{\mu}m$) 3) Group III ($Ra=0.179{\pm}0.001{\mu}m$, $Rt=1.429{\pm}0.055{\mu}m$) 4) Group IV ($Ra=0.182{\pm}0.005{\mu}m$, $Rt=1.511{\pm}0.085{\mu}m$) 5) Group V ($Ra=0.301{\pm}0.008{\mu}m$, $Rt=1.882{\pm}0.131{\mu}m$) 6) Group VI ($Ra=0.147{\pm}0.010{\mu}m$, $Rt=1.059{\pm}0.021{\mu}m$) In Ra values, experimental group II, V, VI were statistically significant different when compared with control. OM and SEM observation showed that experimental group III, IV were minimal changes when compared with control and group VI was smoothest among other experimental groups. The results suggested that plastic curette and plastic tip-ultrasonic scaler were predictable devices to titanium implant surface.