• JSTS:Journal of Semiconductor Technology and Science
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• 제13권2호
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.

• ETRI Journal
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• 제33권1호
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• pp.13-17
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• 2011

A highly miniaturized on-chip $180^{\circ}$ hybrid employing periodic ground strip structure (PGSS) was realized on a silicon radio frequency integrated circuit. The PGSS was placed at the interface between $SiO_2$ film and silicon substrate, and it was electrically connected to top-side ground planes through the contacts. Owing to the short wavelength characteristic of the transmission line employing the PGSS, the on-chip $180^{\circ}$ hybrid was highly miniaturized. Concretely, the on-chip $180^{\circ}$ hybrid exhibited good radio frequency performances from 37 GHz to 55 GHz, and it was 0.325 $mm^2$, which is 19.3% of a conventional $180^{\circ}$ hybrid. The miniaturization technique proposed in this work can be also used in other fields including compound semiconducting devices, such as high electron mobility transistors, diamond field effect transistors, and light emitting diodes.

• 마이크로전자및패키징학회지
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• 제6권4호
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• pp.61-71
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• 1999

통신분야에서 사용주파수대역의 증가, 제품의 소형화 및 가격경쟁력등의 요구에 따라 RF 소자의 패키징 기술도 플라스틱 패키지 대신에 flip chip interconnection, MCM(multichip module)등과 같은 고밀도 실장기술이 발전해가고 있다. 따라서, 본 논문은 최근 수년간 보고된 응용사례를 중심으로 RF flip chip의 기술적인 개발방향과 장점들을 분석하였고, RF 소자 및 시스템의 개발단계에 따른 적합한 적용기술을 제시하였다. RF flip chip의 기술동향을 요약하면, 1) RF chip배선은 microstrip 대신에 CPW 구조을 선택하며, 2) wafer back-side grinding을 하지 않아서 제조공정이 단순하고 wafer 파손이 적어 제조비용을 낮출 수 있고, 3) wire bonding 패키징에 비해 전기적인 특성이 우수하고 고집적의 송수신 모듈개발에 적합하다는 것이다. 그러나, CPW 배선구조의 RF flip chip 특성에 대한 충분한 연구가 필요하며 RF flip chip의 초기 개발 단계에서 flip chip interconnection 방법으로는 Au stud bump bonding이 적합할 것으로 제안한다.

• 한국정보통신학회논문지
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• 제26권10호
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• pp.1559-1562
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• 2022

As electronic devices technology scales down into the deep-submicron to achieve high-density, low power and high performance integrated circuits, multiple bit upsets by soft errors have become a major threat to on-chip memory systems. To address the soft error problem, single error correction, double error detection and double adjacent error correction (SEC-DED-DAEC) codes have been recently proposed. But these codes do not troubleshoot mis-correction problem. We propose the SEC-DED_DAEC code with without mis-correction. The decoder for proposed code is implemented as hardware and verified. The results show that there is no mis-correction in the proposed codes and the decoder can be employed on-chip memory system.

• 한국정보통신학회논문지
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• 제26권11호
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• pp.1747-1750
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• 2022

As shrinking the semiconductor process into the deep sub-micron to achieve high-density, low power and high performance integrated circuits, MBU (multiple bit upset) by soft errors is one of the major challenge of on-chip memory systems. To address the MBU, single error correction, double error detection and double adjacent error correction (SEC-DED-DAEC) codes have been recently proposed. But these codes do not resolve mis-correction. We propose the SEC-DED-DAEC-TAED(triple adjacent error detection) code without mis-corrections. The generated H-matrix by the proposed heuristic algorithm to accomplish the proposed code is implemented as hardware and verified. The results show that there is no mis-correction in the proposed codes and the 2-stage pipelined decoder can be employed on-chip memory system.

• 전자공학회논문지
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• 제53권8호
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• pp.49-58
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• 2016

어플리케이션 특성에 따라 링크 대역폭 요구량이 다양하게 분포하는 이종 (heterogeneous) 아키텍처 기반 네트워크-온-칩 (Network-on-Chip, NoC) 설계에 있어 링크 지연 시간이 독립적으로 설정될 수 있는 비동기식 프로토콜을 적용할 경우 동기식 설계에 비해 성능 향상의 기회가 확대될 수 있다. 본 논문에서는 비동기식 NoC에서 각 링크의 대역폭 요구량과 도선 길이에 따른 지연 시간 모델을 제시하고 이를 최적화하는 simulated annealing (SA) 기법을 이용한 플로어플랜 기반 토폴로지 생성 알고리즘을 제안하였다. 생성된 토폴로지와 각 링크의 도선 길이를 기반으로 대응하는 도선 지연시간을 계산하고 로직 합성 단계를 거쳐 생성된 gate-level netlist와 표준지연시간 모델을 이용한 시뮬레이션을 통해 성능을 측정하였다. 링크 도선 길이를 고려하지 않은 일반적인 토폴로지 생성 알고리즘인 TopGen과 비교하여, 제안된 알고리즘이 다양한 어플리케이션 실험에서 평균 13.7% 지연 시간 단축 효과 및 처리량 측면 지표인 실행 시간에서 평균 11.8% 감소 효과가 있음을 확인할 수 있었다.

• 전자공학회논문지B
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• 제33B권2호
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• pp.149-158
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• 1996

In this paper we describe designing and implementing a digital neural chip and a parallel neural machine for simulating large scale neural netsorks. The chip is a single-chip multiprocessor which has four digiral neural processors (DNP-II) of the same architecture. Each DNP-II has program memory and data memory, and the chip operates in MIMD (multi-instruction, multi-data) parallel processor. The DNP-II has the instruction set tailored to neural computation. Which can be sed to effectively simulate various neural network models including on-chip learning. The DNP-II facilitates four-way data-driven communication supporting the extensibility of parallel systems. The parallel neural machine consists of a host computer, processor boards, a buffer board and an interface board. Each processor board consists of 8*8 array of DNP-II(equivalently 2*2 neural chips). Each processor board acn be built including linear array, 2-D mesh and 2-D torus. This flexibility supports efficiency of mapping from neural network models into parallel strucgure. The neural system accomplishes the performance of maximum 40 GCPS(giga connection per second) with 16 processor boards.

• Nuclear Engineering and Technology
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• 제53권10호
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• pp.3327-3334
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• 2021

Present electric grids are advanced to integrate smart grids, distributed resources, high-speed sensing and control, and other advanced metering technologies. Cybersecurity is one of the challenges of the smart grid and nuclear plant digital system. It affects the advanced metering infrastructure (AMI), for grid data communication and controls the information in real-time. The research article is emphasized solving the nuclear and smart grid hardware security issues with the integration of field programmable gate array (FPGA), and implementing the latest Time Authenticated Cryptographic Identity Transmission (TACIT) cryptographic algorithm in the chip. The cryptographic-based encryption and decryption approach can be used for a smart grid distribution system embedding with FPGA hardware. The chip design is carried in Xilinx ISE 14.7 and synthesized on Virtex-5 FPGA hardware. The state of the art of work is that the algorithm is implemented on FPGA hardware that provides the scalable design with different key sizes, and its integration enhances the grid hardware security and switching. It has been reported by similar state-of-the-art approaches, that the algorithm was limited in software, not implemented in a hardware chip. The main finding of the research work is that the design predicts the utilization of hardware parameters such as slices, LUTs, flip-flops, memory, input/output blocks, and timing information for Virtex-5 FPGA synthesis before the chip fabrication. The information is extracted for 8-bit to 128-bit key and grid data with initial parameters. TACIT security chip supports 400 MHz frequency for 128-bit key. The research work is an effort to provide the solution for the industries working towards embedded hardware security for the smart grid, power plants, and nuclear applications.

• ETRI Journal
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• 제35권5호
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• pp.767-774
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• 2013

In this paper, a novel parallel Viterbi decoding scheme is proposed to decrease the decoding latency and power consumption for the software-defined radio (SDR) system. It implements a divide-and-conquer approach by first dividing a block into a series of subblocks, then performing independent Viterbi decoding for each subsequence, and finally merging the surviving subpaths into the final path. Moreover, a network-on-chip-based SDR platform is used to evaluate the performance of the proposed parallel Viterbi decoding scheme. The experiment results show that our scheme can speed up the Viterbi decoding process without increasing the BER, and it performs better than the current state-of-the-art methods.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권6호
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• pp.810-817
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• 2014

An on-chip current sensor with fast response time for the peak-current-mode buck regulator is proposed. The initial operating points of the peak current sensor are determined in advance by the valley current level, which is sensed by a valley current sensor. As a result, the proposed current sensor achieves a fast response time of less than 20 ns, and a sensing accuracy of over 90%. Applying the proposed current sensor, the peak-current-mode buck regulator for the mobile application is realized with an operating frequency of 2 MHz, an output voltage of 0.8 V, a maximum load current of 500 mA, and a peak efficiency of over 83%.