• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.7
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• pp.131-139
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• 2013

To overcome the limitations in performance and power consumption of traditional electrical interconnection based network-on-chips (NoCs), a hybrid optical network-on-chip (HONoC) architecture using optical interconnects is emerging. However, the HONoC architecture should use circuit-switching scheme owing to the overhead by optical devices, which worsens the latency unfairness problem caused by frequent path collisions. This resultingly exert a bad influence in overall performance of the system. In this paper, we propose a new task mapping algorithm for optimizing latency by reducing path collisions. The proposed algorithm allocates a task to a certain processing element (PE) for the purpose of minimizing path collisions and worst case latencies. Compared to the random mapping technique and the bandwidth-constrained mapping technique, simulation results show the reduction in latency by 43% and 61% in average for each $4{\times}4$ and $8{\times}8$ mesh topology, respectively.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.4A
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• pp.415-422
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• 2004

DSRC provides high speed radio link between Road Side Equipment and On-Board Equipment within the narrow communication area. In this paper, a 5.8 GHz down-conversion mixer for DSRC communication system was designed and fabricated using 0.8 ${\mu}{\textrm}{m}$ SiGe HBT process technology and RF/LO matching circuits, RF/LO input balun circuits, and If output balun circuit were all integrated on chip. The chip size of fabricated mixer was 1.9 mm${\times}$1.3 mm and the measured performance was 7.5 ㏈ conversion gain, －2.5 ㏈m input IP3, 46 ㏈ LO to RF isolation, 56 ㏈ LO to IF isolation, current consumption of 21 mA for 3.0 V supply voltage.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.4A
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• pp.350-357
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• 2005

DSRC provides high speed radio link between Road Side Equipment and On-Board Equipment within the narrow communication area. In this paper, a 5.8 GHz up-conversion mixer for DSRC communication system was designed and fabricated using 0.8 m SiGe HBT process technology and IF/LO/RF matching circuits, IF/LO input balun circuits, and RP output balun circuit were all integrated on chip. The chip size of fabricated mixer was $2.7mm\times1.6mm$ and the measured performance was 3.5 dB conversion gain, -12.5 dBm output IP3, 42 dB LO to If isolation, 38 dB LO to RF isolation, current consumption of 29 mA for 3.0 V supply voltage.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.63-66
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• 2013

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.3
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• pp.410-415
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• 2002

This paper describes the implementation of a SoC(System-on-a-Chip) and an ISDN communication terminal by the SoC in ISDN network. The SoC has been developed with the functions of 32-bit ARM7TDMI RISC core processor, network connection with S/T interface, TDM--bus interface and voice codec, user interface. And we also review the developed software structure and the ISDN service protocol procedures which are working on the SoC. And finally this paper describers a structure of an ISDN terminal equipment using the implemented SoC and terminal software.

• Journal of Institute of Control, Robotics and Systems
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• v.22 no.8
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• pp.671-677
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• 2016

A Controller Area Network (CAN) is a serial communication protocol that is highly reliable and efficient in many aspects, such as wiring cost and space, system flexibility, and network maintenance. Therefore, it is chosen for the communication protocol between a single chip controller based on Field Programmable Gate Array (FPGA) and peripheral devices. In this paper, the design and implementation of CAN IP, which is written in VHSIC Hardware Description Language (VHDL), is presented. The implemented CAN IP is based on the CAN 2.0A specification. The CAN IP consists of three processes: clock generator, bit timing, and bit streaming. The clock generator process generates a time quantum clock. The bit timing process does synchronization, receives bits from the Rx port, and transmits bits to the Tx port. The bit streaming process generates a bit stream, which is made from a message received from a micro controller subsystem, receives a bit stream from the bit timing process, and handles errors depending on the state of the CAN node and CAN message fields. The implemented CAN IP is synthesized and downloaded into SmartFusion FPGA. Simulations using ModelSim and chip test results show that the implemented CAN IP conforms to the CAN 2.0A specification.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.3
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• pp.488-493
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• 2008

This paper represents a dual-mode type transmission technique for a high reliable narrow-band power line communication(PLC) modem, and its design and implementation of a system-on-chip(SoC). The proposed transmission technique is based on a Chirp modulation for the purpose of overcoming time variations of power line channel environments in the narrow-bandwidth of the frequency range of 95-145.5 kHz. The designed modem is fabricated utilizing a mixed 0.18 ${\mu}m$ CMOS technology. Especially, according to the power line channel environments the data transmission rate can be selectively changed into 2.5 kbps and 480 bps. The total hardware complexity of the implemented chip is about 50,000 gates, the power consumption is about 26mW, and the operating frequency is up to 5.12 MHz.

• Journal of Korea Multimedia Society
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• v.23 no.2
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• pp.293-300
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• 2020

Since the communication networks like the Internet collapses at disaster and calamity sites, a maintenance system that can be operated offline is required for the maintenance of various facilities. In this paper, we propose a system that memory tags attached on the facilities may transmit the emergency manual to a smart-phone, and the smart phone displays it off-line. The main issue is to design low energy mode memory tags. This study presents two kinds of methods and analyzes each's energy consumption mode. The first one is to develop memory tags by using one chip, and the next one is to design memory tags by forming multi-modules. Both ways show proper application fields under the low energy mode. This research selects the off-line maintenance system by using one chip design, and proposes the direction of contents for enhancing the effectiveness of the system. And we expect that this memory tags will be valuable for disaster scenes as well as battle fields.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.3
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• pp.632-638
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• 2011

This paper presents on-chip Design-for-Testability (DFT) circuit for radio frequency System-on-Chip (SoC) applications. The proposed circuit measures functional specifications of RF integrated circuits such as input impedance, gain, noise figure, input voltage standing wave ratio (VSWRin) and output signal-to-noise ratio (SNRout) without any expensive external equipment. The RF DFT scheme is based on developed theoretical expressions that produce the actual RF device specifications by output DC voltages from the DFT chip. The proposed DFT showed deviation of less than 2% as compared to expensive external equipment measurement. It is expected that this circuit can save marginally failing chips in the production testing as well as in the RF system; hence, saving tremendous amount of revenue for unnecessary device replacements.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.3
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• pp.754-766
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• 2010

In the wireless communication protocols, a network device is responsible for the operation of lower-layers. The network device consists of hardware and software modules, so it can be designed using system-on-chip simulator. The simulator design needs the support of a network simulator as well as system-on-chip simulator, because the network device interact with various higher layer communication protocols. Therefore the co-simulator can become a development environment of the network device through the combining of them. In this paper we propose a co-simulator combining these two simulators. The proposed co-simulator does not degrade performance due to integrations. Also, it is easy to integrate them because the implementation of the kernel is independent.