• Title/Summary/Keyword: Ohmic

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The Analysis of Arc-Flow Interaction in the GCB using the Modified FLIC Method and the Arc Model (Modified FLIC법과 아크 모델을 이용한 차단기 내의 아크 유동 해석)

  • Sin, Seung-Rok;Kim, Hong-Gyu;Jeong, Hyeon-Gyo
    • The Transactions of the Korean Institute of Electrical Engineers B
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    • v.49 no.3
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    • pp.172-179
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    • 2000
  • In this paper, the analysis of the arc-flow in the GCB is presented by using the modified FLIC method and the arc model. The modified FLIC method adopts the upwind scheme and requires short calculation time. The arc model used in this paper treats the arc as a energy source in the energy equation. The energy source is composed of the ohmic heating and the radiation energy transfer. At each step, the movement of electrode is simulated. From the simulation, reasonable results can be obtained.

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The Change of Contamination Performance of Polymeric Insulators for Outdoor Use (Salt fog 내에서 옥외용 고분자 절연물의 내오손 성능 변화)

  • 김정호;문중섭;박용판;김동명;원호상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.505-508
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    • 1999
  • In this study, weight loss, ESDD, surface conductivity and leakage current were measured at the different saline solutions by salt fog method. The magnitude of leakage current was higher at higher conductivity of 2 S/m saline water, but weight loss ESDD and surface conductivity which are indices of degradation were lower. This is considered that the current includes mainly ohmic component which doesn\`t contribute to surface degradation. In addition, it is shown that FFT could be useful in measuring initial transition from hydrophobic to hydrophilic surface.

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Temperature Dependent Hall Effect Characteristics of InSb Thin Film (InSb 박막 홀효과의 온도의존성)

  • 이우선;조준호;최권우;김남오;김상용
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.21-24
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    • 2000
  • lnSb temperature dependent hall effect of multilayerd structures were investigated. According to variation of magnetic field measured hall coefficient, Hall mobility, carrier density and hall voltage. For the measurement of electrical properties of hall device, evaperated InSb thin film fabricated with series and parallel multilayers. We found that the XRD analysis of InSb thin film showed good properties at 20$0^{\circ}C$, 60 minutes. Resistance of ohmic contact increased linearly due to increasing current. Some of device fabrication technique and analysis of Hall effect were discussed.

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Charge Transport Phenomena of Polyaniline-DBSA/Polystyrene Blends (폴리 아닐 린-DBSA/폴리스타이렌 블렌드의 전하 이동 현상)

  • 김원중;김태영;고정우;김윤상;박창모;서광석
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.53 no.6
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    • pp.305-311
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    • 2004
  • Charge transport phenomena of polyaniline-DBSA/High Impact Polystyrene (PAM-DBSA/HIPS) blends have been studied through an examination of electrical conduction. HIPS used host polymer in the blends and PANI-DBSA obey a space charge limited conduction mechanism and a ohmic conduction mechanism respectively. However, PANI-DBSA/HIPS blends do not obey any classical conduction mechanism. Analysis of conduction mechanism revealed that the charging current of PANI-DBSA/HIPS blends increased with the increase of PANI-DBSA content. This result migrlt be explained by the reduction in the distance between PANI-DBSA particles enabling the charge carriers to migrate from a chain to a neighboring chain via hopping or micro tunneling. It was also found that the charging current of PANI-DBSA/HIPS blends decreased as the temperature was elevated, which is of typical phenomena in metals. It is speculated that the charge transport in PANI-DBSA particle was somewhat constrained due to strong phonon scattering.

Permittivity Characteristics of SiO/TiN Thin Film according to Coating Thickness (SiO/TiN 박막의 증착두께에 따른 유전율 특성)

  • 김창석;이우선;정천옥;김병인
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.570-575
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    • 1997
  • In this days, the thinner film of dielectric materials is required while its capacitance is required to be still large at the VLSI process. Most of such VLSI have MOS structures. For the research on this requirement, MOS capacitors were fabricated on the silicon wafer in four different thickness groups by RF sputtering method. SiO of the SiO/TiN film is used as the insulating layer and TiN is chosen as the barrier against the diffusion of Al which is the terminal connected by ohmic contact because TiN has the advantageous properties such as good thermal stability and very low diffusion rate in spite of its relatively low specific resistance. In this study their electrical and optical characteristics are investigated to find refractive index, absorption coefficient and Permittivity.

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Enhanced Electrochemical Reactivity at Electrolyte/electrode Interfaces of Solid Oxide Fuel Cells with Ag Grids

  • Choi, Mingi;Hwang, Sangyeon;Byun, Doyoung;Lee, Wonyoung
    • Journal of the Korean Ceramic Society
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    • v.52 no.5
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    • pp.356-360
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    • 2015
  • The specific role of current collectors was investigated at the electrolyte/electrode interface of solid oxide fuel cells (SOFCs). Ag grids were fabricated as current collectors using electrohydrodynamic (EHD) jet printing for precise control of the grid geometry. The Ag grids reduced both the ohmic and polarization resistances as the pitch of the Ag grids decreased from $400{\mu}m$ to $100{\mu}m$. The effective electron distribution along the Ag grids improved the charge transport and transfer at the interface, extending the active reaction sites. Our results demonstrate the applicability of EHD jet printing to the fabrication of efficient current collectors for performance enhancement of SOFCs.

Electrical Conduction Mechanism in ITO/Alq3/Al Organic Light-emitting Diodes

  • Chung, Dong-Hoe;Lee, Joon-Ung
    • Transactions on Electrical and Electronic Materials
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    • v.5 no.1
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    • pp.24-28
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    • 2004
  • We have used ITO/Alq$_3$/Al structure to study electrical conduction mechanism in organic light-emitting diodes. Current-voltage-luminance characteristics were measured at room temperature by varying the thickness of Alq$_3$ layer from 60 to 400mm. We were able to confirm that there are three different mechanisms depending on the applied voltage region; ohmic, space-charge-limited current, and trap-charge-limit-current mechanism. And the maximum luminous efficiency was obtained when the thickness of Alq$_3$ layer is 200nm.

A Study on the Electrical Properties of Polyimide Langmuir-Blodgett Films (폴리이미드 랭뮤어-블로젯막의 전기적 특성에 관한 연구)

  • 정순욱;임현성
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.11a
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    • pp.480-483
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    • 2000
  • Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, the electrical properties of PI LB films were investigated at room temperature. At low electric field, ohmic conduction(I∝V) was observed and the calculated electrical conductivity was about 9.7$\times$10$^{-15}$ S/cm. At high electric field, conduction(I∝V$^2$) was observed and the conduction mechanism was explained by space charge limited region effect. The dielectric constant of LB film was about 7.5.

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Study on the Possible Ohmic Mechanisms of the In/In2O3:Sn p-type contacts for GaN-based Light-emitting Diodes (질화갈륨계 발광다이오드용 p형 인듐/인듐주석산화물 박막 전극의 오믹메커니즘에 대한 연구)

  • O, Jun-Ho;Hong, Hyeon-Gi;Kim, Gyeong-Guk;Byeon, Gyeong-Jae;Lee, Heon;Yun, Sang-Won;An, Jae-Pyeong;Jeon, Jun-U;Jeong, Se-Yeon;Seong, Tae-Yeon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2008.11a
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    • pp.38-38
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    • 2008
  • 질화갈륨계 발광다이오드는 차세대 반도체 조명용 및 기타 광전소자 등에의 응용 가능성 때문에 주목을 받고 있다. 본 발표에서는 발광다이오드용 In/ITO 전극이 p-형 질화갈륨과 열처리 후 오믹접촉을 이루는 메커니즘을 설명한다.

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Enhanced Electrical and Optical Properties of Ag Ohmic Contacts for GaN-based FCLEDs by an NiZn Alloy Capping Layer (Capping층으로의 NiZn 합금을 이용한 Ag 오믹 반사전극의 전기적, 광학적 특성 향상에 대한 연구)

  • Kim, Yun-Han;Jeong, Se-Yeon;Hong, Hyeon-Gi;Jeon, Jun-U;Jeong, Sang-Yong;Lee, Jin-Bok;Seong, Tae-Yeon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2008.11a
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    • pp.39-39
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    • 2008
  • 기존의 Flip-chip형 발광소자에에서의 Ag반사층 상에 NiZn 합금을 적용한 구조를 통하여 기존보다 향상된 열적 안정성과 전기적, 광학적 물성을 얻고 이에 따른 오믹 메커니즘의 규명을 실시하였다.

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