• 제목/요약/키워드: Ohmic

검색결과 614건 처리시간 0.025초

마이크로 볼로미터 어레이의 모놀로식 공정을 위한 ohmic contact 최적화 구조 설계에 대한 연구 (A Study on the Design of Optimized Ohmic Contact Structure for Micro Bolometer Monolithic Process)

  • 김범준;고수빈;정은식;강태영;강이구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.201-201
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    • 2010
  • 볼로미터 제작 공정 중 One step via 공정 시 via hole 모양에 의해 정기적 연결 및 구조적 안정성에 문제를 해결하기 위하여 다른 via 식각 방식으로 공정을 진행하였으며 그에 따른 via 공정 차이에 대한 결과를 연구하였다.

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액체금속이온이 주입된 p형 GaAs의 오옴성 접촉 (Ohmic Contact of P-type GaAs Implanted the Liquid Metal Ion)

  • 김송강;강태원;홍치유;임재영;엄기석;이재환;위영호;이정주
    • 대한전자공학회논문지
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    • 제26권9호
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    • pp.1381-1387
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    • 1989
  • For the fabrication of ohmic contact to p-type GaAs, In Liquid Metal Ions were implanted into p-type GaAs (Zn:1.5x10**19/cm**3). After the samples were processed by Infrared rapid thermal annealing (IRTA0 or Furance Annealing (FA), I-V and specific contact contact resistivity were measured. Specific contact resistivity was found to be 1.7x10**-5 \ulcorner-cm\ulcornerin IRTA 750\ulcorner, 10 sec annealed sample. The surface characteristics of the samples were investigated with SEM, RHEED, AES. From these results we can know that implanted In ions were formed mixing layer of InAs at the surface.

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아크플라즈마와 유동간의 상호작용을 고려한 열가스 유동 해석 (Analysis of Hot Gas Flew Considering Arc-Flow Interaction)

  • 김홍규;박경엽;배채윤;조경연;정현교
    • 대한전기학회논문지:전기기기및에너지변환시스템부문B
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    • 제51권3호
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    • pp.107-115
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    • 2002
  • This parer presents the analysis of hot gas flow in puffer-type circuit breakers using FVFLIC method. For the analysis of arc-flow interaction, the flow field is analyzed from the equations of conservation for mass, momentum and energy with the assumption of local thermodynamic equilibrium state. The arc is represented as the energy source term composed of ohmic heating and radiation term in the energy conservation equation. Ohmic heating is computed by the electric field analysis only within the conducting plasma region. An approximate radiation transport model is employed for the evaluation of emission and absorption of the radiation. The analysis method was applied to the real circuit breaker model and simulation results such as pressure rise and arc voltage were compared with the experimental ones.

점도변화에 따른 실리콘유의 전기전도특성 (The Electrical Conduction Characteristics of Silicone oils due to Viscosity Variation)

  • 조경순;홍진웅;신종열;이충호;이수원
    • E2M - 전기 전자와 첨단 소재
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    • 제10권9호
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    • pp.945-951
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    • 1997
  • Inorder to investigated electrical conduction characteristics of silicone oils due to viscosity variation we studied the electrical conduction properties at temperature range of 10~110[$^{\circ}C$] and electrical field from 1 to 1.33$\times$10$^4$[V/cm] The viscosity of used specimens was low viscous(1, 2, 5[cSt]) silicone oils. It was shown the ohmic conduction characteristics in low temperature and low field by Ion dipole and humidity included specimen. And we known the conduction mechanism due to electron injection by Schottky's effect in the high temperature an d high field region.

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고체산화물 연료전지의 공기극 박리 현상에 관한 연구 (Study on the cathode delamination of solid oxide fuel cell)

  • 박광진;배중면
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2009년도 추계학술대회 논문집
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    • pp.139-142
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    • 2009
  • In this study, the performance degradation of SOFC single cell caused by the delamination between a cathode and an electrolyte is investigated. As the delamination rate increases, the voltage sharply decreases due to the decrease of reaction sites and losses increase. The current is concentrated to the intact area so that the current density is increased and the ohmic loss and the activation loss become higher. Most part of loss is due to the ohmc loss of electrolyte.

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인가 바이어스 조건이 전기화학적 식각정지 특성에 미치는 영향 (Effects of Applied Bias Conditions on Electrochemical Etch-stop Characteristics)

  • 정귀상;강경두;김태송;이원재;송재성
    • 한국전기전자재료학회논문지
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    • 제14권4호
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    • pp.263-268
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    • 2001
  • This paper describes the effects of applied bias conditions on electrochemical etch-stop characteristics. THere are a number of key issues such as diode leakage and ohmic losses which arise when applying the conventional 3-electrochemical etch-stop to fabricated some of he MEMS(microelectro mechanical system) and SOI(Si-on-insulator) structures which employ SDB(Si-wafer direct bonding). This work allows to perform anin situ diagnostic to predict whether or not an electrochemical etch-stop would fail due to diode-leakage-induced premature passivation. In addition, it presents technology which takes into account the effects of ohmic losses and allows to calculate the appropriate bias necessary to obtain a successful electrochemical etch-stop.

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p-InP의 저항성 합금 접촉 특성 연구 (The Properties of Alloyed Ohmic Contact to p-InP)

  • 이중기;박경현;한정희;이용탁
    • 대한전자공학회논문지
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    • 제27권4호
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    • pp.555-562
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    • 1990
  • Alloyed ohmic contact properties of Au-Zn/Au, Au-Be/Au,Au-Zn/Cr/Au, and Au-Be/Cr/Au metal system to p-InP were investigated. Optimum alloying conditions were obtained at the annealing temperature of 425\ulcorner for all the metal systems using a rapid thermal annealing system. Surface AES analysis and auger depth profiling were done for each metal system annealed at the optimum conditions. Outdiffusions of In and P from the InP substrate were found in the metal systems without Cr intermediate layer. Also, small amount of In. P and Cr were detected at the surface in the case of Au-Zn/Cr/Au system, while there were occured no outdiffusion of In, P, and Cr for Au-Be/Cr/Au system. The best surface morpholoty and specific contact resistivity of 4.5x 10**-5 \ulcornercm\ulcornerhave been obtained in this Au-Be/Cr/Au material system alloyed at 425\ulcorner for 60 second.

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Differences in Design Considerations between InGaN and Conventional High-Brightness Light-Emitting Diodes

  • Lee, Song-Jae
    • Journal of the Optical Society of Korea
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    • 제2권1호
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    • pp.13-21
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    • 1998
  • Based on the escape cone concepts, high-brightness light-emitting diodes (LEDs) have been analyzed. In AlGaAs or InGaAlP LEDs, photon absorption in the ohmic region under the electrode is known to be significant. Thus, ins general, a thick window layer (WL) and a transparent substrate (TS) would minimize photon shielding by the electrodes and considerably improve photon output coupling efficiency. However, the schemes do not seem to be necessary in InGaN system. Photon absorption in ohmic contact to a wide bandgap semiconductor such as GaN may be negligible and, as a result, the significant photon shielding by the electrodes will not degrade the photon output coupling efficiency so much. The photon output coupling efficiency estimated in InGaN LEDs is about 2.5 - 2.8 times that of the conventional high-brightness LED structures based on both WL and TS schemes. As a result, the extenal quantum efficiency in InGaN LEDs is as high as 9% despite the presumably very low internal quantum efficiency.

액체금속이온원을 이용한 n형 GaAs의 오옴성 접촉 (The Ohmic Contact of n-GaAs Using by Liquid Metal Ion Source)

  • 강태원;이정주;김송강;홍치유;임재영;강승언
    • 대한전자공학회논문지
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    • 제26권12호
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    • pp.1995-2000
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    • 1989
  • The ion beam system of 20keV C-W (Cockroft Walton) type composed of the AuGe alloy LMIS(Liquid Metal Ion Source) has been designed and constructed. For the fabrication of the ohmic contact to the n-GaAs, the ion beam extracted from the AuGe alloy source was implanted into the n-GaAs, and it was measured by contact resistivity. The stable AuGe ion beam(2.5\ulcorner/cm\ulcorner was obtained at the extraction voltage of 14.5kV. The measurements of the contact resistivity were done by the TLM (Transmission Line Model) method and the specific contact resistivity was found to be 2.4x10**-5 \ulcornercm\ulcornerfor the implanted sample by the 1.9x10**20/cm**3 and the annealed sample at 30\ulcorner for 2 min.

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Hot Gas Analysis of Circuit Breakers By Combining Partial Characteristic Method with Net Emission Coefficient

  • Park, Sang-Hun;Bae, Chae-Yoon;Jung, Hyun-Kyo
    • KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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    • 제3B권3호
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    • pp.115-121
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    • 2003
  • This paper proposes a radiation model, which considers radiation transport as an important component in hot gas analysis. This radiation model is derived from combining the method of partial characteristics (MPC) with net emission coefficient (NEC), and it covers the drawbacks of existing models. Subsequently, using this proposed model, the arc-flow interaction in an arcing chamber can be efficiently computed. The arc is represented as an energy source term composed of ohmic heating and the radiation transport in the energy conservation equation. Ohmic heating term was computed by the electric field analysis within the conducting plasma region. Radiation transport was calculated by the proposed radiation model. Also, in this paper, radiation models were introduced and applied to the gas circuit breaker (GCB) model. Through simulation results, the efficiency of the proposed model was confirmed.