• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.259-259
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• 2016

반도체 산업 전반에 걸쳐 이루어지고 있는 연구는 소자를 더 작게 만들면서도 구동능력은 우수한 소자를 만들어내는 것이라고 할 수 있다. 따라서 소자의 미세화와 함께 트랜지스터의 구동능력의 향상을 위한 기술개발에 대한 필요성이 점차 커지고 있으며, 고유전(high-k)재료를 트랜지스터의 게이트 절연막으로 이용하는 방법이 개발되고 있다. High-k 재료를 트랜지스터의 게이트 절연막에 적용하면 낮은 전압으로 소자를 구동할 수 있어서 소비전력이 감소하고 소자의 미세화 측면에서도 매우 유리하다. 그러나, 초미세화된 소자를 제작하기 위하여 high-k 절연막의 두께를 줄이게 되면, 전기적 용량(capacitance)은 커지지만 에너지 밴드 오프셋(band-offset)이 기존의 실리콘 산화막(SiO2)보다 작고 또한 열공정에 의해 쉽게 결정화가 이루어지기 때문에 누설전류가 발생하여 소자의 열화를 초래할 수 있다. 따라서, 최근에는 이러한 문제를 해결하기 위하여 게이트 절연막 엔지니어링을 통해서 누설전류를 줄이면서 전기적 용량을 확보할 수 있는 연구가 주목받고 있다. 본 실험에서는 high-k 물질인 Ta2O5와 SiO2를 적층시켜서 누설전류를 줄이면서 동시에 높은 캐패시턴스를 달성할 수 있는 게이트 절연막 엔지니어링에 대한 연구를 진행하였다. 먼저 n-type Si 기판을 표준 RCA 세정한 다음, RF sputter를 사용하여 두께가 Ta2O5/SiO2 = 50/0, 50/5, 50/10, 25/10, 25/5 nm인 적층구조의 게이트 절연막을 형성하였다. 다음으로 Al 게이트 전극을 150 nm의 두께로 증착한 다음, 전기적 특성 개선을 위하여 furnace N2 분위기에서 $400^{\circ}C$로 30분간 후속 열처리를 진행하여 MOS capacitor 소자를 제작하였고, I-V 및 C-V 측정을 통하여 형성된 게이트 절연막의 전기적 특성을 평가하였다. 그 결과, Ta2O5/SiO2 = 50/0, 50/5, 50/10 nm인 게이트 절연막들은 누설전류는 낮지만, 큰 용량을 얻을 수 없었다. 한편, Ta2O5/SiO2 = 25/10, 25/5 nm의 조합에서는 충분한 용량을 확보할 수 있었다. 적층된 게이트 절연막의 유전상수는 25/5 nm, 25/10 nm 각각 8.3, 7.6으로 비슷하였지만, 문턱치 전압(VTH)은 각각 -0.64 V, -0.18 V로 25/10 nm가 0 V에 보다 근접한 값을 나타내었다. 한편, 누설전류는 25/10 nm가 25/5 nm보다 약 20 nA (@5 V) 낮은 것을 확인할 수 있었으며 절연파괴전압(breakdown voltage)도 증가한 것을 확인하였다. 결론적으로 Ta2O5/SiO2 적층 절연막의 두께가 25nm/10nm에서 최적의 특성을 얻을 수 있었으며, 본 실험과 같이 게이트 절연막 엔지니어링을 통하여 효과적으로 누설전류를 줄이고 게이트 용량을 증가시킴으로써 고집적화된 소자의 제작에 유용한 기술로 기대된다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.3
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• pp.34-41
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• 2011

This paper presents a wide tuning range, fine-resolution DCO (Digitally Controlled Oscillator) with an active inductor. In order to control the frequency of the DCO, the transconductance of the active inductor is tuned digitally. In addition, the DCO gain needs to be calibrated digitally to compensate for gain variations. To cover the wide tuning range, an automatic three-step coarse tuning scheme is proposed. The DCO total frequency tuning range is 1.4 GHz (2.1 GHz to 3.5 GHz), it is 58 % at 2.4 GHz. An effective frequency resolution is 0.14 kHz/LSB. The proposed DCO is implemented in 0.13 ${\mu}m$ CMOS process. The total power consumption is 6.6 mW from a 1.2 V supply voltage. The phase noise of the DCO output at 2.4 GHz is -120.67 dBc/Hz at 1 MHz offset.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.1
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• pp.126-142
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• 2016

This paper presents a wide-frequency-range, low-power transceiver with an automatic impedance-matching calibration for TV-white-space (TVWS) application. The wide-range automatic impedance matching calibration (AIMC) is proposed for the Drive Amplifier (DA) and LNA. The optimal $S_{22}$ and $S_{11}$ matching capacitances are selected in the DA and LNA, respectively. Also, the Single Pole Double Throw (SPDT) switch is integrated to share the antenna and matching network between the transmitter and receiver, thereby minimizing the systemic cost. An N-path filter is proposed to reject the large interferers in the TVWS frequency band. The current-driven mixer with a 25% duty LO generator is designed to achieve the high-gain and low-noise figures; also, the frequency synthesizer is designed to generate the wide-range LO signals, and it is used to implement the FSK modulation with a programmable loop bandwidth for multi-rate communication. The TVWS transceiver is implemented in $0.13{\mu}m$, 1-poly, 6-metal CMOS technology. The die area of the transceiver is $4mm{\times}3mm$. The power consumption levels of the transmitter and receiver are 64.35 mW and 39.8 mW, respectively, when the output-power level of the transmitter is +10 dBm at a supply voltage of 3.3 V. The phase noise of the PLL output at Band 2 is -128.3 dBc/Hz with a 1 MHz offset.

• Journal of Sensor Science and Technology
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• v.9 no.1
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• pp.1-8
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• 2000

One of today's very critical and sensitive accurate accelerometer which can be used higher temperature than $200^{\circ}C$ and corrosive environment, is particularly demanded for automotive engine. Because silicon is a material of large temperature dependent coefficient, and the piezoresistors are isolated with p-n junctions, and its leakage current increase with temperature, the performance of the silicon accelerometer degrades especially after $150^{\circ}C$. In this paper, The temperature characteristic of a accelerometer using silicon on insulator (SOI) structure is studied theoretically, and compared with experimental results. The temperature coefficients of sensitivity and offset voltage (TCS and TCO) are related to some factors such as thermal residual stress, and are expressed numerically. Thermal stress analysis of the accelerometer has also been carried out with the finite-element method(FEM) simulation program ANSYS. TCS of this accelerometer can be reduced to control the impurity concentration of piezoresistors, and TCO is related to factors such as process variation and thermal residual stress on the piezoresistors. In real packaging, The avarage thermal residual stress in the center support structure was estimated at around $3.7{\times}10^4Nm^{-2}^{\circ}C^{-1}$ at sensing resistor. The simulated ${\gamma}_{pT}$ of the center support structure was smaller than one-tenth as compared with that of the surrounding support structure.

• Journal of Sensor Science and Technology
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• v.7 no.3
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• pp.171-178
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• 1998

Silicon piezoresistive absolute pressure sensor for gas leakage alarm system was developed. This sensor must operate normally in the range of $0{\sim}600\;mmH_{2}O$ pressure, and $0{\sim}100^{\circ}C$ temperature. To make the most of this sensor for gas leakage alarm system, gas must not leak from the sensor itself when the diaphragm of the sensor fractures. Thus, the sealed diaphragm cavity was anodically bonded to pyrex 7740 glass under the condition of $10^{-4}$ torr, at $400^{\circ}C$. The sensitivity of developed sensor was $4.06{\mu}V/VmmH_{2}O$ for $600\;mmH_{2}O$ full-scale pressure range. And temperature compensation method of this sensor is to change bridge-in put-voltage linearly in proportion to the temperature variation by using diode(PXIN4001) or Al thin film resistor. By these methods the temperature effect in the range of $0{\sim}100^{\circ}C$ was compensated over 80 % for offset drift, 95 % for sensitivity.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.12
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• pp.16-21
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• 2007

In this paper, the dual-band voltage-controled oscillator (VCO) using the composite right/left-handed (CRLH) transmission line (TL) and the tunable negative resistance based on the fin diode is presented. It is demonstrated that the CRLH TL can lead to metamaterial transmission line with the dual-band tuning capability. The dual-band operation of the CRLH TL is achieved by the frequency offset and the phase slope of the CRLH TL, and the frequency ratio of the two operating frequencies can be a non-integer. Each frequency band of VCO has to operate independently, so we have used the tunable negative resistance based on the pin diode. When the forward bias has been into the pin diode, the phase noise of VCO is $-108.34\sim-106.67$ dBc/Hz @ 100 kHz in the tuning range, $2.423\sim2.597$ GHz, whereas when the reverse bias has been fed into the pin diode, that of VCO is $-114.16\sim-113.33$ dBc/Hz @ 100 kHz in the tuning range, $5.137\sim5.354$ GHz.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.3
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• pp.399-405
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• 2011

In this paper, we present the design of Q-band LC VCO and injection locking buffer for 77 GHz automotive radar sensor using 130 nm RF CMOS process. To improve the phase noise characteristic of LC tank, the transmission line is used. The negative resistance by the active device cross-coupled pair of buffer is used for high output power, with or without oscillation of buffer. The measured phase noise is -102 dBc/Hz at 1 MHz offset frequency and tuning range is 34.53~35.07 GHz. The output power is higher than 4.1 dBm over entire tuning range. The fabricated chip size is $510{\times}130\;um^2$. The power consumption of LC VCO is 10.8 mW and injection locking buffer is 50.4 mW from 1.2 V supply.

• Korean Chemical Engineering Research
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• v.52 no.3
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• pp.321-327
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• 2014

Polymer dispersed liquid crystal lenses of the cell gap of $11{\mu}m$ and $30{\mu}m$ were made from a uniformly dispersed mixture of 40 wt% NOA65 prepolymer - 60 wt% E7 liquid crystal with the variations of the additional photoinitiator. The photoinitiator, benzophenone of 5.0 wt% was originally in the commercial prepolymer NOA65. In this works, the influence of the benzophenone amount intentionally added in the commercial NOA65 on the electrical properties of polymer dispersed liquid crystal lens for smart electronic glasses. The additional quantities of the photoinitiator were 1, 2, 4, 8 and 16 wt% of the weight of NOA65 - E7 mixture. All the electro-optical properties of the sample with added benzophenone such as the driving voltage, the slope of the linear region, the response time and contrast ratio were more improved than that of commercial NOA65 only. These improvements were due to the increase of the average size of E7 liquid crystal droplets in the samples with the increase of the added benzophenon amount. The liquid crystal droplet size was increased from $5.3{\mu}m$ to $12.2{\mu}m$ when the photoinitiator was added from 0 wt% to 8 wt%. At the same concentration range of the photoinitiator, the driving voltage was ranged from 11.1 V to 17.3 V. The slopes of the linear region were in the range of 10.35~13.96 %T/V, which were more enhanced than that of NOA65 without the additional benzophenone. In particular, though the deteriorations by cell gap of $11{\mu}m$ were so effective to offset the influence of the added benzophenone for both rising and falling response time, it is confirmed that there were still somewhat improvement by the additional benzophenone. Response time and contrast ratios of all the samples with excess benzophenone were slightly enhanced.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.8
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• pp.880-886
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• 2007

We have proposed a new "hybrid" envelope elimination and restoration(EER) transmitter architecture using an efficiency optimized power amplifier(PA) and modified bias modulator. The efficiency of the PA at the average drain voltage is very important for the overall transmitter efficiency because the PA operates mostly at the average power region of the modulation signal. Accordingly, the efficiency of the PA has been optimized at the region. Besides, the bias modulator has been accompanied with the emitter follower for the minimization of memory effect. A saturation amplifier, class $F^{-1}$ is built using a 5-W PEP LDMOSFET for forward-link single-carrier wideband code-division multiple-access(WCDMA) at 1-GHz. For the interlock experiment, the bias modulator has been built with the efficiency of 64.16% and peak output voltage of 31.8 V. The transmitter with the proposed PA and bias modulator has been achieved an efficiency of 44.19%, an improvement of 8.11%. Besides, the output power is enhanced to 32.33 dBm due to the class F operation and the PAE is 38.28% with ACLRs of -35.9 dBc at 5-MHz offset. These results show that the proposed architecture is a very good candidate for the linear and efficient high power transmitter.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.98-106
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• 2009

This work proposes a 1280-RGB $\times$ 800-Dot 70.78mW 0.l3um CMOS LCD driver IC (LDI) for high-performance 16M-color low temperature poly silicon (LTPS) thin film transistor liquid crystal display (TFT-LCD) systems such as ultra mobile PC (UMPC) and mobile applications simultaneously requiring high resolution, low power, and small size at high speed. The proposed LDI optimizes power consumption and chip area at high resolution based on a resistor-string based architecture. The single column driver employing a 1:12 MUX architecture drives 12 channels simultaneously to minimize chip area. The implemented class-AB amplifier achieves a rail-to-rail operation with high gain and low power while minimizing the effect of offset and output deviations for high definition. The supply- and temperature-insensitive current reference is implemented on chip with a small number of MOS transistors. A slew enhancement technique applicable to next-generation source drivers, not implemented on this prototype chip, is proposed to reduce power consumption further. The prototype LDI implemented in a 0.13um CMOS technology demonstrates a measured settling time of source driver amplifiers within 1.016us and 1.072us during high-to-low and low-to-high transitions, respectively. The output voltage of source drivers shows a maximum deviation of 11mV. The LDI with an active die area of $12,203um{\times}1500um$ consumes 70.78mW at 1.5V/5.5V.