• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.237.1-237.1
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• 2015

OLED의 낮은 외부 광자 효율 문제를 해결하기 위해서는 발광층은 물론 전극 재료에 대한 연구가 함께 진행되어야 한다. 최근 플렉서블 디스플레이(Flexible Display) 분야에서 투명전극(Transparent Electrode)은 큰 주목을 받고 있다. 기존 전자소자의 투명전극으로는 인듐산화물(ITO, Indium Tin Oxide)이 널리 사용되어 왔으나, ITO의 주원료인 인듐(Indium)은 희소성으로 인해 앞으로 30년 후에 고갈될 것으로 예상되어 ITO를 대체할만한 투명전극 재료가 필요하게 되었다. 인듐이 포함되지 않은(Indium-free) 투명전극을 개발하려는 많은 연구들이 진행 중인데, 본 연구에서는 PEN(Polyethylene Naphthalate) 유연기판 상에 그래핀(Graphene)을 투명전극으로 구현하여 OLED의 효율을 높이는데 이용하고자 하였다. 화학 기상 증착(CVD, Chemical Vapor Deposition) 방법을 이용하여 Cu 호일 위에 그래핀을 성장시킨 후 PEN 유연기판에 전사하여 그래핀 투명전극을 구현하면서 그래핀 성장층을 단층 또는 다층으로 구분하여 성장시켜 각각의 투명전극을 구현해보았다. 유연기판 상의 그래핀의 상태를 확인하기 위해 라만 분광(Raman Spectroscopy) 분석을 이용하여 그래핀 고유의 라만 꼭지점(Raman peak)인 G 꼭지점(G peak: 1580 cm-1), 2D 꼭지점(2D peak: ~2700 cm-1)을 확인하였는데 그래핀 전사 상태가 양호하여 D 꼭지점(D peak: ~1360 cm-1)은 나타나지 않았다. 원자힘 현미경(AFM, Atomic Force Microscope) 분석을 통해 다층 및 단층 그래핀 표면의 거칠기(Roughness) 및 두께(Thickness)를 각각 확인할 수 있었고 자외선-가시광선 분광법(UV-Visible Spectroscopy) 분석으로 그래핀 투명전극과 유연기판의 투과도(Transmittance)를 분석하였으며, 단층 그래핀 투과도가 90%수준의 높은 값이 나타나 ITO보다 개선됨을 확인하였다. 그래핀 면저항은 TLM(Transmission Line Measurement)법을 통해 측정하였는데, 단층 그래핀의 경우 $800{\Omega}/{\square}$ 내외 수준임을 확인할 수 있었다. 본 연구에서는 근자외선 영역에서 높은 투과도와 우수한 전기적 특성을 가지는 그래핀 투명 전도성 전극 구조를 제안하고, 나아가 가시영역에서 ITO를 대체할 수 있는 투명 전도성 전극 물질을 개발함으로써 발광다이오드의 광효율을 높일 수 있는 투명 전도성 전극을 구현하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.309-310
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• 2005

In the fabrication of high performance red organic light emitting diode, 2-TNA TA [4,4',4" -tris (2-naphthylphenyl- phenylamino)-triphenylamine] as hole injection material and N PH [N,N'-bis (1-naphthyl) -N,N' -diphenyl-1, 1'-biphenyl-4,4'- diamine] as hole transport material were deposited on the ITO (indium tin oxide)/glass substrate by vacuum evaporation, And then, red color emission layer was deposited using Alq3 as a host material and Rubrene (5,6,11,12- tetraphenylnaphthacene) and GDI 4234 as dopants. Finally, small molecular weight OLED with the structure of ITO/2-TNATA/ NPB/Alq3+Rubrene+GDI4234/Alq3/LiF/Al was obtained by in-situ deposition of Alq3, LiF and Al as electron transport material, electron injection material and cathode. respectively. Green OLED fabricated in our experiments showed the color coordinate of CIE(0.65,0.35) and the maximum luminescence efficiency of 2.1 lm/W at 7 V with the peak emission wavelength of 632 nm.

• 한국재료학회지
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• 제16권4호
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• pp.253-256
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• 2006

The blue emitting OLEDs using GDI host-dopant phosphors have been fabricated and characterized. In the device fabrication, 2-TNATA [4,4',4'-tris(2-naphthylphenyl-phenylamino)- triphenylamine] as a hole injection material and NPB [N,N'-bis(1-naphthyl)-N,N'-diphenyl-1,1'-biphenyl-4,4'-diamine] as a hole transport material were deposited on the ITO(indium thin oxide)/glass substrate by vacuum evaporation. And then, blue color emission layer was deposited using GDI602 as a host material and GDI691 as a dopant. Finally, small molecule OLEDs with structure of ITO/2-TNATA/NPB/GDI602:GDI691/Alq3/LiF/Al were obtained by in-situ deposition of Alq3, LiF and Al as the electron transport material, electron injection material and cathode, respectively. Blue OLEDs fabricated in our experiments showed the color coordinate of CIE(0.14, 0.16) and the maximum power efficiency of 1.1 lm/W at 11 V with the peak emission wavelength of 464 nm.

• 반도체디스플레이기술학회지
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• 제20권4호
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• pp.157-160
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• 2021

As an insulator for a thin film transistor(TFT) and an encapsulation material of organic light emitting diode(OLED), aluminum oxide (Al₂O₃) has been widely studied using several technologies. Especially, in spite of low deposition rate, atomic layer deposition (ALD) has been used as a process method of Al₂O₃ because of its low process temperature and self-limiting reaction. In the Al₂O₃ deposition by ALD method, Ar Purge had some crucial effects on the film properties. After reaction gas is injected as a formation of pulse, an inert argon(Ar) purge gas is injected for gas desorption. Therefore, the process parameter of Ar purge gas has an influence on the ALD deposited film quality. In this study, Al₂O₃ was deposited on glass substrate at a different Ar purge time and its structural characteristics were investigated and analyzed. From the results, the growth rate of Al₂O₃ was decreased as the Ar purge time increases. The surface roughness was also reduced with increasing Ar purge time. In order to obtain the high quality Al₂O₃ film, it was known that Ar purge times longer than 15 sec was necessary resulting in the self-limiting reaction.

• 한국진공학회지
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• 제19권2호
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• pp.148-154
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• 2010

본 논문에서는 유기발광다이오드의 보호막 적용을 위하여 TCP-CVD를 이용한 실리콘 산화막 형성에서 산화막의 특성에 영향을 미치는 Power, 가스종류 및 유량, 소스와 기판거리 및 공정온도 등의 공정조건에 따른 증착된 산화막의 특성을 나타내는 증착률, 굴절률을 제어하고자 한다. 그 결과 $SiH_4$ : $O_2$ = 30 : 60 [sccm], 70 [mm]의 source와 기판 거리, Bias를 인가하지 않은 조건에서 80 [$^{\circ}C$] 이하의 공정온도를 보였으며 투과율 90% 이상, 높은 증착률 및 굴절률 1.4~1.5인 안정된 $SiO_2$ 산화박막을 제조할 수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.198.1-198.1
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• 2016

Organic light-emitting diode (OLED) displays have promising potential to replace liquid crystal displays (LCDs) due to their advantages of low power consumption, fast response time, broad viewing angle and flexibility. Organic light emitting materials are vulnerable to moisture and oxygen, so inorganic thin films are required for barrier substrates and encapsulations.[1-2]. In this work, the silicon-based inorganic thin films are deposited on plastic substrates by plasma-enhanced chemical vapor deposition (PECVD) at low temperature. It is necessary to deposit thin film at low temperature. Because the heat gives damage to flexible plastic substrates. As one of the transparent diffusion barrier materials, silicon oxides have been investigated. $SiO_x$ have less toxic, so it is one of the more widely examined materials as a diffusion barrier in addition to the dielectric materials in solid-state electronics [3-4]. The $SiO_x$ thin films are deposited by a PECVD process in low temperature below $100^{\circ}C$. Water vapor transmission rate (WVTR) was determined by a calcium resistance test, and the rate less than $10.^{-2}g/m^2{\cdot}day$ was achieved. And then, flexibility of the film was also evaluated.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.1025-1028
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• 2005

Microcrystalline Si (${\mu}c-Si$) TFTs were fabricated using a conventional bottom gate amorphous Si (a-Si) process. A unique ${\mu}c-Si$ deposition technique and TFT architecture was proposed to enhance the reliability of the TFTs. This three-mask TFT fabrication process is comparable with existing a-Si TFT procesess. In order to suppress nucleation at the bottom interface of Si, before deposition of the ${\mu}c-Si$ an $N_2$ plasma passivation was conducted. A typical transfer characteristic of the TFTs shows a low off-current with a value of less than 1 pA and a sub threshold slop of 0.7 V/dec. The DC stress was applied to verify the use of ${\mu}c-Si$ TFTs for AMOLED displays. After 10,000 s of application of the stress, the off-current was even lowered and sub-threshold slope variation was less than 5%. For AMOLED displays, OLED pixel simulation was performed. A pixel current of 13 ${\mu}A$ was achieved with $V_{data}$ of 10 V. After the simulation, a linear equation for the pixel current was suggested.

• 한국전기전자재료학회논문지
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• 제19권1호
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• pp.71-74
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• 2006

In this paper, we investigated the characterization of silicon oxide(SiOx) thin film on Ethylene Terephthalate(PET) substrates by e-beam deposition for transparent barrier application. The temperature of chamber increases from $30^{\circ}C$ to $110^{\circ}C$, the roughness increase while the Water vapor transmission rate (WVTR) decreases. Under these conditions, the WVTR for PET can be reduced from a level of $0.57 g/m^2/day$ (bare subtrate) to $0.05 g/m^2/day$ after application of a 200-nm-thick $SiO_2$ coating at 110 C. A more efficient way to improve permeation of PET was carried out by using a double side coating of a 5-${\mu}m$-thick parylene film. It was found that the WVTR can be reduced to a level of $-0.2 g/m^2/day$. The double side parylene coating on PET could contribute to the lower stress of oxide film, which greatly improves the WVTR data. These results indicates that the $SiO_2$ /Parylene/PET barrier coatings have high potential for flexible organic light-emitting diode(OLED) applications.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.349-350
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• 2008

In the structure of ITO/N,N'-diphenyl-N,N' bis (3-methylphenyl)-1,1'-biphenyl-4,4'-diamine(TPD) /2,9-Dimethy 1-4,7-diphenyl-1,10-phenanthroline (BCP)/tris (8-hydroxyquinoline)aluminum$(Alq_3)$/Al device, we studied the efficiency improvement of organic light-emitting diodes due to thickness variation of BCP materials used for a electron breaking layer. The thickness of TPD and $Alq_3$ was manufactured 40 nm, 60 nm, respectively under a base pressure of $5\times10^{-6}$Torr using a thermal evaporation. The TPD and $Alq_3$ layer were evaporated to be at a deposition rate of 2.0 A/s. The BCP was evaporated to be at a deposition of 1.0 A/s. When the thickness of BCP increased from 5 to 30 nm, we found that the luminous efficiency and the external quantum efficiency is superior to the others when the thickness of BCP is 20 nm. Compared to the ones from the devices made without BCP, the luminous efficiency and the external quantum efficiency was improved by 57 %, 70%, respectively.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.99-99
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• 2010

Recently, amorphous transparent oxide semiconductors (TOS) have been widely studied for many optoelectronic devices such as AM-OLED (active-matrix organic light emitting diodes). The TOS TFTs using a-IGZO channel layers exhibit a high electron mobility, a smooth surface, a uniform deposition at a large area, a high optical transparency, a low-temperature fabrication. In spite of many advantages of the sputtering process such as better step coverage, good uniformity over large area, small shadow effect and good adhesion, there are not enough researches about characteristics of a-IGZO thin films. In this study, therefore, we focused on the electrical properties of a-IGZO thin films as a channel layer of TFTs. TFTs with the a-IGZO channel layers and Y2O3 gate insulators were fabricated. Source and drain layers were deposited using ITO target. TFTs were deposited on unheated non-alkali glass substrates ($5cm{\times}5cm$) with a sintered ceramic IGZO disc (3 inch $\varnothing$, 5mm t), Y2O3 disc (3 inch $\varnothing$, 5mm t) and ITO disc (3 inch $\varnothing$, 5mm t) as a target by magnetron sputtering method. The O2 gas was used as the reactive gas. Deposition was carried out under various sputtering conditions to investigate the effect of sputtering process on the characteristics of a-IGZO thin films. Correlation between sputtering factors and electronic properties of the film will be discussed in detail.