• Textile Coloration and Finishing
• /
• v.4 no.2
• /
• pp.76-83
• /
• 1992

Wool tropical and nylon taffeta were treated with low temperature plasma of $O_2$, $N_2$, NH$_3$, CF$_4$ and CH$_4$ for the intervals of 10 to 300 sec, and then dyed with leveling and milling type acid dyes in presence or absence of buffer solution. From the color depth of dyed fabrics, effect of plasma gases, treated time, dyeing time and temperature on dyeing property was studied. The results of the experiment can be summarized as follows: 1) The plasma treatments except methane gas increased the color depth of dyed wool fabrics, but not that of dyed nylon fabrics regardless of the plasma gases used. 2) The color depth of wool fabrics dyed in the dye bath without buffer solution was increased by the low temperature plasma, especially increased much more by CF$_4$ plasma treatment. It is found that with the identification of F- ion in the residual dye bath the hydrogen fluoride gas was adsorbed on wool fabrics in the plasma treatment. 3) The color depth of wool fabrics was increased with the time of $O_2$ and CF$_4$ plasma treatments. 4) In both cases of the leveling and milling type acid dyes, the rate of dyeing was increased in the low temperature plasma treatments, and it is found that the leveling type acid dye increased the color depth at relatively low temperature below 4$0^{\circ}C$, compared with the milling type acid dye.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.05b
• /
• pp.11-14
• /
• 2004

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and AFM. Adhesion was obtained from T-peel tests of semiconductive layer having different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the the creation of O-H and C=O. It is observed that adhesion performance was determined by not surface energy but roughness level of silicone surface. It is found that ac dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.164-165
• /
• 2007

The effect of hydrogen and oxygen plasma treatments on the structural properties of carbon nanotubes (CNTs) has been systematically investigated. The plasma treatment resulted in the removal of the amorphous carbon particles. As the plasma treatment time was longer, the CNT diameter was reduced, regardless of gas types. Especially, for the sample treated in hydrogen plasma, the catalyst metal on the tip of CNTs was eliminated.

• Textile Coloration and Finishing
• /
• v.7 no.1
• /
• pp.1-9
• /
• 1995

In order to improve dyeability of poly(ethylene terephthalate)(PET) micro filament fabrics, the effect of the prior oxygen low temperature plasma on the subsequent dyeing(deep dyeing, printing) was examined in various conditions. The apparent concentration of dyed PET micro filament fabrics was increased by $O_{2}$plasma treatment. Higher discharge power levels and higher reactor pressure values created more significant effect. The wettability was significantly increased by $O_{2}$ plasma treatment. Therefore, it is predicted that introducing hydrophilic group on the surface of material can improve the apparent concentration of PET micro filament fabrics.

• Transactions on Electrical and Electronic Materials
• /
• v.8 no.5
• /
• pp.211-214
• /
• 2007

Chemical and morphological changes of phenol formaldehyde-based photoresist after $O_2$ radiofrequency(RF) plasma treatment depending on exposure time and source power were investigated. It was found that etch rate of photoresist sharply increased after discharge turn on and reached a limit with increase in plasma exposure time. Contact angle measurements and X-ray photoelectron spectroscopy(XPS) analysis showed that the surface chemical structure become nearly constant after 15 sec of the treatment. Atomic force microprobe(AFM) measurements were shown that surface roughness was increased with plasma exposure time.

• Textile Coloration and Finishing
• /
• v.26 no.3
• /
• pp.201-208
• /
• 2014

The high value-added functionality for synthetic fiber can be considered through a plasma enhanced treatment. In this study, PET(Polyethyleneterephthalate) was treated with a glow plasma and corona treatment. Surface characteristics of treated fabric were investigated using electron scanning microscopy(SEM), contact angle, X-ray photoelectron spectroscopy(XPS), tensile and adhesion strength. It was found that the contact angle showed $85.5^{\circ}$ for untreated fabric, $0^{\circ}$ for plasma and corona treatment at the condition of 200W for 7min. By XPS analysis, atomic ratio of O 1s/C 1s was increased from 0.27 to 0.43 by glow plasma and 0.27 to 0.41 by corona treatment at 200W for 7min, respectively. Glow plasma and corona treatment did not significantly change the tensile strength of PET fabric. Adhesion strength showed a substantial enhancement for the surface treated with the glow plasma, while corona treatment was adversely affected.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2005.11a
• /
• pp.173-174
• /
• 2005

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.882-885
• /
• 2007

This study discussed the effect of ink adhesion on color filter glass after different kinds of plasma treatment. From contact angle analysis, we could get different ink adhesion results after HMDSZ, $O_2$, IPA, and $CF_4$ plasma treatment. Substrates after PFMCH plasma treatment have good surface hydrophobic property, and contact angle raise from $<10^{\circ}\;to\;50^{\circ}$.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2013.08a
• /
• pp.78-78
• /
• 2013

Recently, many platinoid metals like platinum and ruthenium have been used as an electrode of microelectronic devices because of their low resistivity and high work-function. However the material cost of Ru is very expensive and it usually takes long initial nucleation time on SiO2 during chemical deposition. Therefore many researchers have focused on how to enhance the initial growth rate on SiO2 surface. There are two methods to deposit Ru film with atomic layer deposition (ALD); the one is thermal ALD using dilute oxygen gas as a reactant, and the other is plasma enhanced ALD (PEALD) using NH3 plasma as a reactant. Generally, the film roughness of Ru film deposited by PEALD is smoother than that deposited by thermal ALD. However, the plasma is not favorable in the application of high aspect ratio structure. In this study, we used a bis(ethylcyclopentadienyl)ruthenium [Ru(EtCp)2] as a metal organic precursor for both thermal and plasma enhanced ALDs. In order to reduce initial nucleation time, we use several methods such as Ar plasma pre-treatment for PEALD and usage of sacrificial RuO2 under layer for thermal ALD. In case of PEALD, some of surface hydroxyls were removed from SiO2 substrate during the Ar plasma treatment. And relatively high surface nitrogen concentration after first NH3 plasma exposure step in ALD process was observed with in-situ Auger electron spectroscopy (AES). This means that surface amine filled the hydroxyl removed sites by the NH3 plasma. Surface amine played a role as a reduction site but not a nucleation site. Therefore, the precursor reduction was enhanced but the adhesion property was degraded. In case of thermal ALD, a Ru film was deposited from Ru precursors on the surface of RuO2 and the RuO2 film was reduced from RuO2/SiO2 interface to Ru during the deposition. The reduction process was controlled by oxygen partial pressure in ambient. Under high oxygen partial pressure, RuO2 was deposited on RuO2/SiO2, and under medium oxygen partial pressure, RuO2 was partially reduced and oxygen concentration in RuO2 film was decreased. Under low oxygen partial pressure, finally RuO2 was disappeared and about 3% of oxygen was remained. Usually rough surface was observed with longer initial nucleation time. However, the Ru deposited with reduction of RuO2 exhibits smooth surface and was deposited quickly because the sacrificial RuO2 has no initial nucleation time on SiO2 and played a role as a buffer layer between Ru and SiO2.

• Transactions on Electrical and Electronic Materials
• /
• v.14 no.3
• /
• pp.152-155
• /
• 2013

$TiO_2$ films were deposited on glass substrates with and without $O_2$ plasma etching by using the RF-magnetron sputtering method. We focused on the effect of surface structure on the photoinduced hydrophilic properties of $TiO_2$ films, fabricated on different surface conditions according to the presence or absence of the $O_2$ plasma treatment on glass substrates. The wettability and photoinduced hydrophilic properties of the $TiO_2$ films were investigated according to the changes in water contact angles under UV light irradiations with a very low intensity of 0.1 $mW/cm^2$. The photoinduced hydrophilic properties on the $TiO_2$ formed above the plasma treated glass were also superior to those on the $TiO_2$ formed above the bare glass. This enhanced $TiO_2$ film has been used practically for self cleaning and anti-fogging glasses.