• Korean Journal of Materials Research
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• v.24 no.11
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• pp.639-643
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• 2014

Hydrophilic $SiO_2$ layers were obtained by the atmospheric-pressure plasma treatment. Superhydrophobic $SiO_2$ layers were first deposited by the electrospray deposition method. The electrospunable solution that was prepared based on the solgel method was sprayed on Si (100) substrates. The surface of the electrosprayed $SiO_2$ layers consisted of the agglomeration of nano-sized grains, which led to a very high roughness and revealed a very high contact angle to water droplets over $162^{\circ}$. After having been exposed to the atmospheric $Ar/O_2$ plasma, the observed superhydrophobicity of the $SiO_2$ layers were greatly changed: a dramatic variation of the water contact angle from $162^{\circ}$ to $3^{\circ}$, namely realization of superhydrophillicity. Interestingly, the surface microstructure was almost preserved. According to the XPS analysis, it is more likely that thanks to the plasma exposure, the surface of $SiO_2$ layers will be cleaned in terms of organic species that are hydrophobic-inducing, consequently leading to the hydrophilic nature observed for the plasma-exposed $SiO_2$ layers.

• Resources Recycling
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• v.25 no.6
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• pp.92-97
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• 2016

Spray dried $Cr_2O_3$ powder having an agglomerated structure of particles was twice treated into a plasma flame to increase its apparent density. The powder subjected to the first densification treatment did not show the entirely melted state keeping inner particle hollows, and it was fully melted after the second processing only. The powder size as a result of the second treatment decreased, and the apparent density as well as flowability were increased due to melting and surface smoothing effects. But a part of particles after the second densified treatment showed the hollow structure, especially those which were above $30{\mu}m$ in size. This densification behavior of the powder has been qualitatively discussed in terms of the thermal conductivity and inner gas pressure within aggregates exposed to the plasma flame.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.75-81
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• 2018

The effect of $Ar-N_2$ plasma treatment on Cu surface as one of solutions to realize reliable Cu-Cu wafer bonding was investigated. Structural characteristic of $Ar-N_2$ plasma treated Cu surface were analyzed using X-ray diffraction, X-ray photoelectron spectroscopy, atomic force microscope. Ar gas was used for a plasma ignition and to activate Cu surface by ion bombardment, and $N_2$ gas was used to protect the Cu surface from contamination such as -O or -OH by forming a passivation layer. The Cu specimen under high Ar partial pressure plasma treatment showed more copper oxide due to the activation on Cu surface, while Cu surface after high $N_2$ gas partial pressure plasma treatment showed less copper oxide due to the formation of Cu-N or Cu-O-N passivation layer. It was confirmed that nitrogen plasma can prohibit Cu-O formation on Cu surface, but nitrogen partial pressure in the $Ar-N_2$ plasma should be optimized for the formation of nitrogen passivation layer on the entire surface of Cu wafer.

• Carbon letters
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• v.6 no.2
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• pp.106-110
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• 2005

In this work, the effects of atmospheric oxygen plasma treatment of carbon fibers on mechanical interfacial properties of carbon fibers-reinforced epoxy matrix composites was studied. The surface properties of the carbon fibers were determined by acid/base values, Fourier-transform infrared spectrometer (FT-IR), and X-ray photoelectron spectroscopy (XPS) analyses. Also, the crack resistance properties of the composites were investigated in critical stress intensity factor ($K_{IC}$), and critical strain energy release rate mode II ($G_{IIC}$) measurements. As experimental results, FT-IR of the carbon fibers showed that the carboxyl/ester groups (C=O) at 1632 $cm^{-1}$ and hydroxyl group (O-H) at 3450 $cm^{-1}$ were observed for the plasma treated carbon fibers, and the treated carbon fibers had the higher O-H peak intensity than that of the untreated ones. The XPS results also indicated that the $O_{1S}/C_{1S}$ ratio of the carbon fiber surfaces treated by the oxygen plasma led to development of oxygen-containing functional groups. The mechanical interfacial properties of the composites, including $K_{IC}$ (critical stress intensity factor) and $G_{IIC}$ (critical strain energy release rate mode II), were also improved for the oxygen plasma-treated carbon fibersreinforced composites. These results could be explained that the oxygen plasma treatment played an important role to increase interfacial adhesions between carbon fibers and epoxy matrix resins in our composite system.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.212-212
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• 1999

Ar-O2 분위기의 Plasma 표면 처리된 OPP 의 polymer 위에 약 400$\AA$ 정도로 sputter 코팅된 Al의 부착력에 관하여 연구를 하였다. 금속과 polymer와 같이 성질이 서로 다른 물질이 서로 결합할 때 접착력은 제품의 성능과 신뢰도를 결정하는데 매우 중요한 인자이다. 최근 고분자재료의 표면을 플라즈마 처리 (plasma surface treatment)에 의해 고분자와 금속도포(coating) 층간의 접착력향상에 따라, 증착필름 및 인쇄용 필름 등의 기능도 향상시킬 수 있다. 저온 plasma를 이용한 표면처리는 plastic 재료가 가지고 있는 기본적인 특성을 저해하지 않고, 그 표면 층만을 개량하는 plasma 또는 sputter etching 갚은 electrical discharge 방법은 진공 증착 방식에서 많이 사용되고 있다. 7$\mu\textrm{m}$의 두께 OPP polymer를 10m/min의 속도로 OPP의 표면을 연속 plasma pretreatment를 하였다. 5$\times$10-2torr에서, PEM(Plasma Emission Monitor)를 이용하여 plasma intensity에 따른 Ar/O2비를 변화시키면서 test를 하였다. AFM과 XPS를 이용하여 OPP의 표면분석을 하였다. 이 plasma처리는 기존의 D.C plasma 처리 방식과는 달리 Midium frequency AC voltage hollow cathod 방식으로 plasma를 발생된 high energy plasma 분위기를 만들 수 있다. 이러한 방식은 -cycle일 때 plasma로부터 발생된 전자가 polymer 표면을 bombard 하게 되고, +cycle 일 때 polymer 표면이 cathod 가 되어 active ion에 의해 sputtering 이 된다. 이때 plasma 처리기의 polymer 기판 후면에 magnet를 설치하여 높은 ionization을 발생시켜 처리 효과를 한층 높여 주었다. 이 plasma 처리는 표면 청정화, 표면 etching 이 동시에 행하는 것과 함께 장시간 처리에 의해 표면에서는 미세한 과, C=C기, -C-O-의 극성기의 도입에 의한 표면 개량이 된다는 것을 관찰할 수 있다. OPP polymer 표면을 Ar 100%로 plasma 처리한 경우 C-O, C=O 등의 carbonyl가 발생됨을 알 수 있었다. C-O, C=O 등의 carbynyl polor group이 도입됨에 따라 sputter된 Al의 접착력이 향상됨을 알 수 있으며, TEM 관찰 결과 grain size도 상당히 작아짐을 알 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.2
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• pp.111-117
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• 2008

We have studied surface roughness, contamination of impurity, bonding with some gas element, reflectance and zeta potential on masks to be generated or changed during photolithography/dry or wet etching process. Mask surface roughness was not changed after photolithography/dry etching process. But surface roughness was changed on some area under MoSi film of Cr/MoSi/Qz. There was not detected any impurity on mask surface after plasma dry etching process. Reflectance of mask was increased after variable plasma etching treatment, especially when mask was treated with plasma including $O_2$ gas. Blank mask was positively charged when the mask was treated with Cr plasma etching gas($Cl_2:250$ sccm/He:20 $sccm/O_2:29$ seem, source power:100 W/bias power:20 W, 300 sec). But this positive charge was changed to negative charge when the mask was treated with $CF_4$ gas for MoSi plasma etching, resulting better wet cleaning. There was appeared with negative charge on MoSi/Qz mask treated with Cr plasma etching process condition, and this mask was measured with more negative after SC-1 wet cleaning process, resulting better wet cleaning. This mask was charged with positive after treatment with $O_2$ plasma again, resulting bad wet cleaning condition.

• Journal of the Korean Vacuum Society
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• v.19 no.4
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• pp.275-280
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• 2010

The influence of $O_2$-plasma treatment on $H_2$ post-treated BZO (ZnO:B) thin film using MOCVD (Metal-Organic Chemical Vapor Deposition) are investigated. An $O_2$-plasma treatment of the $H_2$ post-treated BZO thin films resulted in XRD peak of (100), (101) and (110). Also, electrical properties resulted in an increase in sheet resistance and work function. The weighted optical transmittance and haze at 300~1,100 nm of BZO thin films with $O_2$-plasma treatment on the $H_2$ post-treatment show approximately 86% and 15%, respectively.

• Journal of Magnetics
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• v.5 no.3
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• pp.99-101
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• 2000

Oxygen-plasma effects of single crystal and thin film samples of $La_{0.7}Ca_{0.3}MnO_{3-\delta}$ have been studied. Our resistivity measurements indicate that oxygen plasma treatment gives rise to oxygen diffusion into bulk regions, which results in a decrease of $Mn^{3+}$ concentration in oxygen nonstoichiometric $La_{0.7}Ca_{0.3}MnO_{3-\delta}$ and in the activation energies of Holstein's small polarons in the paramagnetic region.

• Proceedings of the Korean Magnestics Society Conference
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• 2000.09a
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• pp.268-272
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• 2000

Oxygen-plasma effects of single crystal and thin film samples of L $a_{0.7}$C $a_{0.3}$Mn $O_{3-}$$\delta$/ have been studied. Our resistivity measurements indicate that oxygen plasma treatment gives rise to oxygen diffusion into bulk regions, which results in a decrease of M $n^{3+}$ concentration in oxygen nonstoichiometric L $a_{0.7}$C $a_{0.3}$Mn $O_{3-}$$\delta$/ and in the activation energies of Holstein's small polarons in the paramagnetic region.n.egion.n.n.

• Applied Chemistry for Engineering
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• v.33 no.1
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• pp.38-43
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• 2022

The effect of introducing oxygen functional groups by oxygen plasma treatment of activated carbon on adsorption properties of cesium ions was investigated. During the oxygen plasma treatment, the frequency, power, and oxygen gas flow rates were fixed at 100 kHz, 80 W, and 60 sccm, respectively, while the reaction time was varied. Under the experimental conditions, the amount of cesium ion adsorption increased as the content of oxygen groups on C-O-C and O=C-O bonds increased when the reaction time with oxygen gas was 10 minutes. However, when the reaction time increased to 15 minutes, the oxygen functional group content decreased resulting in the decrease of the adsorbed cesium ion amount. On the other hand, unlike the oxygen content of the surface-treated activated carbon, the specific surface area and pore properties were hardly affected by the oxygen plasma reaction time. As a result, the oxygen plasma-treated activated carbon improved the cesium ion removal rate by up to 97.3% compared to that of the untreated activated carbon. This is considered to be due to the content of oxygen groups on C-O-C and O=C-O bonds introduced on the surface of the activated carbon through oxygen plasma treatment.