• 한국정밀공학회지
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• 제28권6호
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• pp.745-750
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• 2011

In a hope to better understand the flow and convective heat transfer characteristics inside a ball bearing, air flow between the rolling elements and raceways at high speed bearing rotation is numerically investigated using a simplified inner geometry of bearing and a CFD technique. Flow simulation results reveal the pressure distribution of airflow and the shear stress distribution on the ball surface, of which nonuniformity becomes significant with the increasing rotational speed. Also, the local point of maximum shear stress coincides with the stagnation flow area on the surface of rolling elements. A complex pattern of three-dimensional vortex structures is found in the air flow due to the relative motion of bearing elements and three different types of vortex pairs exist around the rotating and orbiting rolling elements.

• International Journal of Precision Engineering and Manufacturing
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• 제9권3호
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• pp.3-6
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• 2008

Electrolytic in-process dressing (ELID) grinding is a new technique for achieving a nanoscale surface finish on hard and brittle materials such as optical glass and ceramics. This process applies an electrochemical dressing on the metal-bonded diamond wheels to ensure constant protrusion of sharp cutting grits throughout the grinding cycle. In conventional ELID grinding, a constant source of pulsed DC power is supplied to the ELID cell, but a feedback mechanism is necessary to control the dressing power and obtain better performance. In this study, we propose a new closed-loop wheel dressing technique for grinding wheel truing that addresses the efficient correction of eccentric wheel rotation and the nonuniformity in the grinding wheel profile. The technique relies on an iterative control algorithm for the ELID power supply. An inductive sensor is used to measure the wheel profile based on the gap between the sensor head and wheel edge, and this is used as the feedback signal to control the pulse width of the power supply. We discuss the detailed mathematical design of the control algorithm and provide simulation results that were confirmed experimentally.

• 한국광학회지
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• 제7권1호
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• pp.1-8
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• 1996

렌즈의 실시간 성능축정을 위하여 MTF측정장치에 CCD를 많이 사용하고 있다. 본 연구에서는 2차원 CCD를 복사기 렌즈의 실시간 MFT측정장치에 사용했을 때 CCD에 의한 각종 MTF특성을 분석하였다. CCD로 측정한 복사기 렌즈의 MTF는 2차원 CCD의 shift register가 배열된 방향과 셔터 속도, 광신호 증폭회로의 증폭률에 따라 다른 특성을 나타내었다. 광원의 밝기에 의한 MTF 값의 변화를 줄이기 위하여 축상면 및 비축상면에서 복사조도가 균일한 광원장치를 제작하였으며 MTF 값이 측정된 표준렌즈를 사용하여 복사기 렌즈용 실시간 MTF측정장치를 교정하였다.

• 한국전기전자재료학회논문지
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• 제14권3호
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• pp.223-227
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• 2001

In this paper, the authors present the fabrication of high-yield Si thin-membranes by electrochemical etch-stop in tetramethyl ammonium hydroxide (TMAH): isopropyl alcohol (IPA):pyrazine solutions. The current-voltage (I-V) characteristics of n- and p-type Si in TMAH:IPA;pyrazine solutions were analysed, repsectively. Open circuit potential (OCP)and passivation potential (PP) of n- and p-type Si, respectively, were obtained and applied potential was selected between n- and p-type Si PPs. The electrochemical etch-stop method was applied to the fabrication of 801 micro-membranes with 20.0 $\mu\textrm{m}$ thickness on a 5" Si wafer. The average thickness of fabricated 801 micro-membranes on one wafer 20.03$\mu\textrm{m}$ and the standard deviation was ${\pm}$0.26$\mu\textrm{m}$. The Si surface of the etch-stopped micro-membranes was extremely flat with no noticeable taper or nonuniformity. The results indicate that use of the electrochemical etch-stop method for the etching of Si in TMAH:IPA;pyrazine solutions provides a powerful and versatile alternative process for fabricating high-yield Si micro-membranes.

• Transactions on Electrical and Electronic Materials
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• 제2권2호
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• pp.26-31
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• 2001

This paper presents the electrochemical etch-stop characteristics of single-crystal Si(001) wafers in tetramethyl ammonium hydroxide(TMAH):isopropyl alcohol(IPA):pyrazine solutions. The addition of pyrazine to TMAH:IPA solutions increased the etch rate of (100) Si, thus the etching time required by the etch-stop process shortened. The current-voltage(I-V) characteristics of n- and p-type Si in TMAH:IPA:pyrazine solutions were obtained, respectively. Open circuit potential(OCP) and passivation potential(PP) of n- and p-type Si, respectively, were obtained and applied potential was selected between n- and p-type Si PPs. The electrochemical etch-stop method was used to fabricate 801 microdiaphragms of 20 ${\mu}{\textrm}{m}$ thickness on a 5-inch Si wafer. The average thickness of fabricated 801 microdiaphragms on one Si wafer was 20.03 ${\mu}{\textrm}{m}$ and the standard deviation was $\pm$0.26 ${\mu}{\textrm}{m}$. The Si surface of the etch-stopped microdiaphragm was extremely flat with no noticeable taper or nonuniformity.

• Progress in Superconductivity
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• 제8권2호
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• pp.152-157
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• 2007

Uniaxial square Helmholtz coils for testing SQUID sensors were designed and their field distributions were calculated. Optimum parameters for maximizing the uniform region in the Helmholtz mode were obtained for different uniformity tolerances. The coil system consists of 2 pairs of identical square loops, a Helmholtz pair for generating uniform fields and the other for the 2nd-order gradient fields in combination with the Helmholtz pair. Full expressions of the axial component of the field were calculated by using Biot-Savart's law. To understand the behavior of the field near the coil center, analytical expressions were obtained up to the 4th-order in the midplane and along the coil axis. The Helmholtz condition for generating uniform fields was calculated to be $d/{\alpha}=0.544505643$, where 2d is the inter-coil distance and $2{\alpha}$ is the side length of the coil square. Maximized uniform range can be obtained for a given nonuniformity tolerance by choosing $d/{\alpha}$ slightly lower than the Helmholtz condition. The pure second-order gradient field can be generated by subtracting the Helmholtz field from the field of the 2nd pair with equal magnitudes of the center fields of the two pairs. The coil system is useful for testing balance and sensitivity of SQUID gradiometers.

• 대한기계학회논문집B
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• 제21권10호
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• pp.1303-1313
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• 1997

A micro-macroscopic analysis on the conduction-controlled directional casting of Al-Cu alloys is performed, in which emphases are placed on the microstructural features. In order to facilitate the solution procedure, an iterative micro-macroscopic coupling algorithm is developed. The predicted results show that the effect of finite back diffusion on the transient solidification process in comparison with the lever rule depends essentially on the initial concentration of an alloy. In the final casting, the eutectic fraction is distributed in an increasing-decreasing-increasing pattern, each mode of which is named the chill, interior and end zones. This nonuniformity per se suffices to justify the necessity of this work because it originates from the combined effects of finite back diffusion and cooling path-dependent nature of the eutectic formation. As the cooling rate is enhanced, not only the influence depths of boundaries narrow, but also the eutectic fractions in the chill and interior zones increase. In addition, it is revealed for the first time that the micro segregation band is formed in response to a sudden change in cooling rate during the directional casting. An increasing change creates an overshooting band in the eutectic fraction distribution, and vice versa.

• Nuclear Engineering and Technology
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• 제40권2호
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• pp.117-126
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• 2008

In this paper, a new reactor core design is proposed on the basis of a mixed core concept consisting of a thermal zone and a fast zone. The geometric structure of the fuel assembly of the thermal zone is similar to that of a conventional thermal supercritical water-cooled reactor(SCWR) core with two fuel pin rows between the moderator channels. In spite of the counter-current flow mode, the co-current flow mode is used to simplify the design of the reactor core and the fuel assembly. The water temperature at the exit of the thermal zone is much lower than the water temperature at the outlet of the pressure vessel. This lower temperature reduces the maximum cladding temperature of the thermal zone. Furthermore, due to the high velocity of the fast zone, a wider lattice can be used in the fuel assembly and the nonuniformity of the local heat transfer can be minimized. This mixed core, which combines the merits of some existing thermal SCWR cores and fast SCWR cores, is proposed for further detailed analysis.

• Journal of Information Display
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• 제4권2호
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• pp.29-34
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• 2003

We have studied liquid crystal (LC) molecular alignment on rubbed and photoaligned surfaces. Particular attention was paid to the intermolecular liquid crystalline interaction. We will first show that uniform molecular orientation on a rubbed surface does not mean spatially uniform interaction between the surface and LC molecules. Rather LCs tend to align themselves through LC interaction. The existence of nonuniformity of rubbing was successfully visualized by double surface treatment. The importance of intermolecular LC interaction was also found in the orientation formation process in 5CB evaporated on rubbed and photoaligned surfaces. By simultaneously analyzing polarized UVNIS absorption and second-harmonic generation (SHG) using the maximum entropy method, we succeeded in obtaining the temporal variation of the orientational distribution functions in the film forming process. The distribution anisotropy and pretilt are found to be generated under the influence of intermolecular LC interaction.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.231-234
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• 2004

Chemical mechanical polishing(CMP) process was studied in terms of tribology in this paper. CMP performed by the down force and the relative motion of pad and wafer with the slurry is typically tribological system composed of friction, wear and lubrication. The piezoelectric quartz sensor for friction force measurement was installed and the friction force was detected during CMP process. Various coefficient of friction was attained and analyzed with the kind of pad, abrasive and the abrasive concentration. The lubrication regime is also classified with ${\eta}v/p(\eta,\;v\;and\;p;$ the viscosity, relative velocity and pressure). Especially, the co-relation not only between the friction force and the removal per unit distance but also between the coefficient of friction and within-wafer-nonuniformity was estimated.