• 제목/요약/키워드: Non-adhesive

검색결과 318건 처리시간 0.025초

Design and Analysis for Loss Reduction of High-Speed Permanent Magnet Motor using a Soft Magnetic Composite

  • Lee, Sung-Ho;Kim, Yong-Jae;Lee, Kyu-Seok;Kim, Sung-Jin
    • Journal of Magnetics
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    • 제20권4호
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    • pp.444-449
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    • 2015
  • Soft magnetic composites (SMCs) are especially suitable for the construction of low-cost, high-performance motors with 3-D magnetic fields. The main advantages of SMCs is that the iron particles are insulated by the surface coating and adhesive used for composite bonding, the eddy-current loss is much lower than that in laminated steels, especially at higher frequencies, and the hysteresis loss becomes the dominant component of core losses. These properties enable machines to operate at higher frequencies, resulting in reduced machine size and weight. In this paper, 3-D topologies are proposed that enable the application of SMCs to effectively reduce losses in high-speed permanent magnet (PM) motors. In addition, the electromagnetic field characteristics of the motor topologies are evaluated and compared using a non-linear finite element method (FEM) based on 3-D numerical analysis, and the feasibility of the motor designs is validated.

Fine-pitch 소자 적용을 위한 bumpless 배선 시스템 (Bumpless Interconnect System for Fine-pitch Devices)

  • 김사라은경
    • 마이크로전자및패키징학회지
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    • 제21권3호
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    • pp.1-6
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    • 2014
  • 차세대 전자소자는 입출력(I/O) 핀 수의 증가, 전력소모의 감소, 소형화 등으로 인해 fine-pitch 배선 시스템이 요구되고 있다. Fine-pitch 특히 10 um 이하의 fine-pitch에서는 기존의 무연솔더나 Cu pillar/solder cap 구조를 사용할 수 없기 때문에 Cu-to-Cu bumpless 배선 시스템은 2D/3D 소자 구조에서 매우 필요한 기술이라 하겠다. Bumpless 배선 기술로는 BBUL 기술, 접착제를 이용한 WOW의 본딩 기술, SAB 기술, SAM 기술, 그리고 Cu-to-Cu 열압착 본딩 기술 등이 연구되고 있다. Fine-pitch Cu-to-Cu interconnect 기술은 연결 방법에 상관없이 Cu 층의 불순물을 제거하는 표면 처리 공정, 표면 활성화, 표면 평탄도 및 거칠기가 매우 중요한 요소라 하겠다.

Bendable 임베디드 전자모듈의 손상 메커니즘 (Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions)

  • 조윤성;김아영;홍원식
    • Journal of Welding and Joining
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    • 제31권5호
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

지속성 경막외카테터의 거치 방법 -수혈선을 이용하여- (Fixation of Epidural Catheters using blood Set -Report of 120 cases-)

  • 장보열;김순제;김현수;김광민;최병조
    • The Korean Journal of Pain
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    • 제1권2호
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    • pp.199-202
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    • 1988
  • Secure fixation is essential for continous epidural catheterization on a long-term-basis. Adhesive tape or surgical knots were commonly used for those patients, but the surgical knot method has a tendency to cause strangulation of catheter. Another invasive technique, subcutaneous tissue tunnelling is more safe than other methods but requires sophisticated technique and time. We employed a simple device using a blood transfusion set for patients who have epidural catheters placed safely un their backs. In 120 patients treated for postoperative and chronic pain by means of this technique, the results were as follows: 1) Five of 120 patients (4.2%) developed backache and pruritus, but there were no instances of respiratory depression, local infection and headache. 2) Nine of 120 patients (7.5%) failed booster-injections, but two cases were due to be non-technical errors. 3) The duration of fixation was 1~3 days in most cases (85%), the longest being for 21 days.

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실활치 표백술 후 치관내 수복물의 미세누출에 관한 비교 (THE COMPARISON OF MICROLEAKAGE ON INTRACORONAL RESTORATION AFTER NON-VITAL BLEACHING)

  • 정재은;이희주;허복
    • Restorative Dentistry and Endodontics
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    • 제28권1호
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    • pp.57-63
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    • 2003
  • The purpose of the present study were to evaluate microleakage of a fourth generation dentin-bonding agent following a walking bleaching treatment, to determine the effect of temporary postbleaching dressing with calcium hydroxide on microleakage and to investigate the effect of delayed intracoronal restoration on microleakage. The results of this study were as follows : 1. Bleached groups showed more microleakage than unbleached group 2. Immediately restored group following bleaching procedure showed the highest microleakage score. 3. One-week delayed restorations showed less microleakage but there were no statistically significant difference between group II and III. 4. Provisional dressing with calcium hydroxide had no influence on microleakage. It is necessary to know the time that has elapsed from the bleaching treatment to the restoration procedure to achieve optimal seal, as well as to reduce the risk of microleakage in adhesive restoration.

샌드위치패널심재로 활용한 St/BA 개질 다공성 경량 콘크리트의 특성 (Properties of St/BA Modified Cellular Lightweight Concrete as Sandwich Panel Core)

  • 강내민;노정식;도정윤;문경주;소양섭
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2003년도 학술.기술논문발표회
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    • pp.31-34
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    • 2003
  • Sandwich panel is composed of the facing sheets which support the external load, the cellular core with the low thermal conductivity and the adhesive agent to bond them. The cellular core was produced by binding lightweight cellular aggregates with cement and two types of acrylic base St/BA emulsion were added with a view to improving the workability ion due to high absorption of light weight aggregate and to develope more strength, respectively. This investigation is to comprehend the effect of the addition of two types of St/BA on thermal conductivity, calorific value and exhaustion content of noxious gas in addition re compressive and flexural strength. Flexural strength of the specimen made with St/BA-2 ranged 20kgf/cm2 to 25kgf/cm2 and was about 50% to 100% as high as that of the non-fiber specimen. Thermal conductivity was recorded from 2.0 to 3.0 kcal/mh$^{\circ}C$ and calorific value of St/BA modified specimen was much lower than that of commercial sandwich panel core of EPS and urethane. Careful caution has to be taken because generation of noxious gas such as CO, NO and SO2 tend to increase with addition of polymer cement ratio.

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경량기포콘크리트(ALC) 패널을 건축물 외장 커튼월에 적용을 위한 도료의 기초적 연구 (Applications and Analysis of Exterior Paints for the Curtain Wall Panel System based on the Autoclaved Lightweight Concrete(ALC))

  • 이용수;라현주
    • 한국디지털건축인테리어학회논문집
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    • 제12권3호
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    • pp.59-66
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    • 2012
  • Autoclaved Lightweight Concrete(ALC) features such as a high performance insulation, the fire resistance, the advantage of easy handing construction, and lightweight panels applied the curtain wall system. ALC materials are certified as non-toxic environmental and eco-friendly productions. But ALC external panels mixed with blast furnace slag pounder and silica fume have to be coated with a stucco compound or plaster because of resisting the ambient environment. This study is that mixing tests to evaluate a performance analysis of exterior paints to be make-up pigments(organic or inorganic) coated with panel surface. Testing compared by KS F 2476; flow test, KS F 2426; compression strength test, KS F 2762; bond strength test. In results, the case of the inorganic binder, ratio of alumina cement : anhydrite is 90:10 to 80:20 at the highest level of intensity. In the case of the organic binder, adhesive strength rating at surface of ALC, the pullout strength is below 0.5 $N/mm^2$ but the normal concrete is over 2.0$N/mm^2$. A contents ratio of EVA resin is more than 3% and then bond strength is effectively.

대형 서점 내 서적 종류 및 가구배치에 따른 포름알데히드 발생 특성 (Formaldehyde Concentration Characteristics according to Type of Books and Furniture Arrangement in Bookstores)

  • 강동희;정찬권;김석환;이상진;김수민
    • 한국가구학회지
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    • 제23권4호
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    • pp.381-387
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    • 2012
  • Utilization of underground floor is becoming the main issue of our society to maximize and diversify the potential of recent urban space. It has brought about the changes of underground floor. Recently there are lots of huge bookstores in these underground floor. Bleach, adhesive and ink used for manufacturing books pollute indoor air in bookstore. Therefore, the purpose of this study is to analyze indoor air quality in these large bookstores. Concentrations of carbon dioxide and formaldehyde in three large bookstores in Seoul were measured by presence and type of books and distance of main entrance which is well-ventilated. According to the data, space that places lots of volumes measured higher concentration of formaldehyde than that of non-existence books. Children's book section was measured more concentration of formaldehyde than other book section. Closer main entrance near outside, lower concentration of formaldehyde was measured. Concentration of carbon dioxide was affected by the number of people in bookstore.

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전자빔 증착법으로 제작한 Cu 박막의 부착력과 저항율 특성 (The Resistivity Properties and Adhesive Strength of Cu Thin firms Fabricated by EBE Method)

  • 백상봉;신중홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.422-426
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    • 2003
  • Cu thin films of $6000{\AA}$ thickness were deposited by Electron Beam Evaporation(EBE) method on the glass. The resistivity properties and adhesion of Cu thin films were investigated by various annealing and substrate temperature. Cu thin films were annealed in the air and vacuum condition for 10 min after the deposition. The resistivity and adhesion(the force required to separate films from substrates) was measured by 4-point probe and scratch testing. The resistivity of non-annealing Cu thin films was distinguished more substrate temperature loot than substrate temperature R.T, $200^{\circ}C$. In the case of air condition annealing, as heating temperature was increased, the resistivity was decreased. In the case of vacuum condition annealing, the resistivity was increased at heating temperature $200^{\circ}C$. The best resistivity($1.72\;{\mu}{\Omega}{\cdot}cm$) of Cu thin films was obtained by the air condition heating temperature $200^{\circ}C$ at the substrate heating temperature $100^{\circ}C$. As a result of scratch testing, adhesion was increased by annealing. And maximum adhesion had 600 gf.

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DC Magetron Suttering법으로 제작한 Ti$_{x}$N 박막의 밀착력에 미치는 첨가원소(C,H,O) (The Effects of Additional Gases(C,H,O) on Adhesive strength Ti$_{x}$N Films Prepared by the DC Magetron Suttering Method)

  • 김학동;조성식
    • 한국표면공학회지
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    • 제31권3호
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    • pp.142-150
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    • 1998
  • Stainless steel is being used widely for various purposes due to its good corrosion resistance. There has been much research to produce colored stainless steel by several methods such as anodizing and ion plating. In this experiment, we coated TiN(C,O,H)films SUS304 substraate with the DC magnetron spttering system made by Leybold Heraeus and studied the interlater structure and abhesive strength of the films as a function of additional gases, acetylene, hydrogen and oxygen. When the acetylene gas was added into the chamber, the specimen with the interlayer phase had good adhesion due to the toughness of the $\gamma'-Fe_4N$ plase induced from a solid solution of carbon atoms, while low adhesion appeared on the specimen of the non interlayer phase. The formation of the interlayer phase($\gamma'-Fe_4N$) was due to hydrogen embrittlement and internal stress induced by $\gamma'-Fe_4N$ formation in the interlayer. We could fine the interlayer phase ($\gamma'-Fe_4N$) at the interface between the film and the substrate of the TEM image when $\gamma'-Fe_4N$ was detected by the X-ray duffraction metheod.

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