• Journal of Electrochemical Science and Technology
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• v.8 no.3
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• pp.197-205
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• 2017

Lead dioxide thin films were electrodeposited on nickel substrate from acidic lead nitrate solution. Current efficiency and thickness measurements, cyclic voltammetry, AFM, SEM, and X-ray diffraction experiments were conducted on $PbO_2$ surface to elucidate the effect of lead nitrate concentration, current density, temperature on the morphology, chemical behavior, and crystal structure. Experimental results showed that deposition efficiency was affected by the current density and solution concentration. The film thickness was independent of current density when deposition from high $Pb(NO_3)_2$ concentration, while it decreased for low concentration and high current density deposition. On the other hand, deposition temperature had negative effect on current efficiency more for lower current density deposition. Cyclic voltammetric study revealed that comparatively more ${\beta}-PbO_2$ produced compact deposits when deposition was carried out from high $Pb(NO_3)_2$ concentration. Such compact films gave lower charge discharge current density during cycling. SEM and AFM studies showed that deposition of regular-size sharp-edge grains occurred for all deposition conditions. The grain size for high temperature and low concentration $Pb(NO_3)_2$ deposition was bigger than from low temperature and high concentration deposition conditions. While cycling converted all grains into loosely adhered flappy deposit with numerous pores. X-ray diffraction measurement indicates that high concentration, high temperature, and high current density favored ${\beta}-PbO_2$ deposition while ${\alpha}-PbO_2$ converted to ${\beta}-PbO_2$ together with some unconverted $PbSO_4$ during cycling in $H_2SO_4$.

• Journal of the Korean Society for Nondestructive Testing
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• v.32 no.1
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• pp.41-46
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• 2012

As the development of MEMS/NEMS structure and application technology the demand for an assessment of the mechanical properties have increased. The mechanical properties are mainly evaluated by using tensile test or ultrasonic wave measurement. However, the new technology have been developed such as nano-indentation, guided wave method because they have a limitation in case of a thin plate and thin film. In the study, the guided wave velocities are measured by electromagnetic-acoustic transducer(EMAT), the material properties of thin metallic foils are obtained using optimization process of the theoretical and experimental group velocity of guided wave. The Young's modulus obtained by the optimization process(201.6 GPa), nano-indentation(207.0 GPa) and literature value(203.7 GPa) of a $50{\mu}m$ thick nickel thin plate shows good agreement within 3%.

• Transactions on Electrical and Electronic Materials
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• v.18 no.5
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• pp.261-264
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• 2017

$Ni_{0.79}Co_{0.15-x}Cu_xMn_{2.06}O_4$ ($0{\leq}x{\leq}0.09$) thick films were fabricated using the conventional solid-state reaction method and screen-printing method. Structural and electrical properties of specimens based on the amount of Cu were observed in order to investigate their applicability in the infrared detector. All specimens showed a single spinel phase with a homogeneous cubic structure. As the amount of Cu increased, the average grain size increased and was found to be approximately $5.01{\mu}m$ for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen. The thickness of all specimens was approximately $55{\sim}56{\mu}m$. As Cu content increased, the resistivity and TCR properties at room temperature decreased, and these values for the $Ni_{0.79}Co_{0.06}Cu_{0.09}Mn_{2.06}O_4$ specimen were $502{\Omega}-cm$ and $-3.32%/^{\circ}C$, respectively. The responsivity and noise properties decreased with an increase in Cu content, with the specimen with a Cu content of x=0.09 showing 0.0183 V/W and $5.21{\times}10^{-5}V$, respectively.

• Design & Manufacturing
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• v.2 no.2
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• pp.29-32
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• 2008

A back light unit (BLU) is a key module of a thin film transistor liquid crystal display (TFT-LCD), frequently utilized in various mobile displays. In this study, we experimentally characterize transcription and optical properties of concave and convex microlens arrays (MLAs) of light guide plate (LGP) fabricated by injection molding with polycarbonate as a LGP substrate material. Nickel mold inserts were manufactured by electroforming on the MLA which was fabricated by the thermal reflow of photoresist microstructures patterned by UV-photolithography. For the case of convex microlens, the height of replicated microlens was less than that of the mold insert while maintaining almost the same microlens diameter of the mold insert as the location of the microlens is far from the gate. In contrast, for the concave microlens, the diameter of replicated microlens was larger than that of mold insert, while showing almost the same microlens height as the mold insert. From the optical examination of replicated convex and concave MLAs, it was found that a higher luminance of the LGP was achieved by the concave MLAs compared to the convex MLAs (about 30% enhancement in this case)due to the utilization of a larger amount of light provided by the light sources.

• Journal of the Korean Society for Heat Treatment
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• v.24 no.5
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• pp.243-250
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• 2011

When alloys are vacuum-deposited on cooled substrates, super-rapidly cooled alloy films in the unequilibrium state can be obtained. As an application of this method, Ag-Cu, Ag-Ni and Ag-C alloys were successfully produced, and their mechanical properties with tempering temperature were investigated. The following results were obtained : (1) In case of Ag-Cu alloys, the solid solution was hardened by tempering at $150^{\circ}C$. The hardening is considered to occur when the solid solution begins to decompose into ${\alpha}$ and ${\beta}$ phases. The Knoop hardness number of a 40 at.%Ag-Cu alloy film deposited on a cooled glass substrate was 390 $kg/mm^2$. The as-deposited films were generally very hard but fractured under stresses below their elastic limits. (2) In case of Ag-Ni and Ag-C alloys, after the tempering of 4 at.%Ni-Ag alloy at $400^{\circ}C$ and of 1 and 2 at.%C-Ag alloys at $200^{\circ}C$, they were hardened by the precipitation of fine nickel and carbon particles. The linear relationship between proof stress vs. $(grain\;diameter)^{-l/2}$ for bulk silver polycrystals can be applied to vacuum-deposited films up to about 0.1 ${\mu}m$ grain diameter, but the proof stress of ultra-fine grained silver with grain diameters of less than 0.1 ${\mu}m$ was smaller than the value expected from the Petch's relation.

• Journal of Practical Engineering Education
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• v.6 no.2
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• pp.105-110
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• 2014

In this work, mechanical characteristics of titanium diaphragm have been studied as a potential robust substrate and a diaphragm material for automotive tire pressure sensor. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on titanium diaphragm have been designed, fabricated and characterized. The fabrication process for micromachined titanium devices keeps the membrane and substrate being at the environment of 20 MPa pressure and $200^{\circ}C$ for a half hour and then subsequently cooled to $24^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated titanium film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the fabricated device is $9.45ppm\;kPa^{-1}$ with a net capacitance change of 0.18 pF over a range 0-210 kPa.

• Journal of Radiation Industry
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• v.8 no.3
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• pp.141-146
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• 2014

Nickel (Ni) electroplating was implemented by using a metal Ni powder in order to establish a $^{63}Ni$ plating condition on the PN junction semiconductor needed for production of beta-voltaic battery. PN junction semiconductors with a Ni seed layer of 500 and $1000{\AA}$ were coated with Ni at current density from 10 to $50mA\;cm^{-2}$. The surface roughness and average grain size of Ni deposits were investigated by XRD and SEM techniques. The roughness of Ni deposit was increased as the current density was increased, and decreased as the thickness of Ni seed layer was increased. The results showed that the optimum surface shape was obtained at a current density of $10mA\;cm^{-2}$ in seed layer with thickness of $500{\AA}$, $20mA\;cm^{-2}$ of $1000{\AA}$. Also, pure Ni deposit was well coated on a PN junction semiconductor without any oxide forms. Using the line width of (111) in XRD peak, the average grain size of the Ni thick firm was measured. The results showed that the average grain size was increased as the thickness of seed layer was increased.

• Korean Journal of Metals and Materials
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• v.48 no.2
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• pp.133-140
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• 2010

10 nm thick Ni layers were deposited on 200 nm $SiO_2/Si$ substrates using an e-beam evaporator. Then, 60 nm or 20 nm thick ${\alpha}$-Si:H layers were grown at low temperature (<$200^{\circ}C$) by a Catalytic-CVD. NiSi layers were already formed instantaneously during Cat-CVD process regardless of the thickness of the $\alpha$-Si. The resulting changes in sheet resistance, microstructure, phase, chemical composition, and surface roughness with the additional rapid thermal annealing up to $500^{\circ}C$ were examined using a four point probe, HRXRD, FE-SEM, TEM, AES, and SPM, respectively. The sheet resistance of the NiSi layer was 12${\Omega}$/□ regardless of the thickness of the ${\alpha}$-Si and kept stable even after the additional annealing process. The thickness of the NiSi layer was 30 nm with excellent uniformity and the surface roughness was maintained under 2 nm after the annealing. Accordingly, our result implies that the low temperature Cat-CVD process with proposed films stack sequence may have more advantages than the conventional CVD process for nano scale NiSi applications.

• Journal of Electrochemical Science and Technology
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• v.13 no.4
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• pp.497-503
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• 2022

Spinel ferrites (Ni_xFe_3-xO₄; x = 0.25, 0.5, 0.75 and 1.0) have been prepared at 550℃ by egg white auto-combustion route using egg white at 550℃ and characterized by physicochemical (TGA, IR, XRD, and SEM) and electrochemical (CV and Tafel polarization) techniques. The presence of characteristic vibration peaks in FT-IR and reflection planes in XRD spectra confirmed the formation of spinel ferrites. The prepared oxides were transformed into oxide film on glassy carbon electrodes by coating oxide powder ink using the nafion solution and investigated their electrocatalytic performance for OER in an alkaline solution. The cyclic voltammograms of the oxide electrode did not show any redox peaks in oxygen overpotential regions. The iR-free Tafel polarization curves exhibited two Tafel slopes (b₁ = 59-90 mV decade^-1 and b₂ = 92-124 mV decade^-1) in lower and higher over potential regions, respectively. Ni-substitution in oxide matrix significantly improved the electrocatalytic activity for oxygen evolution reaction. Based on the current density for OER, the 0.75 mol Ni-substituted oxide electrode was found to be the most active electrode among the prepared oxides and showed the highest value of apparent current density (~9 mA cm^-2 at 0.85 V) and lowest Tafel slope (59 mV decade^-1). The OER on oxide electrodes occurred via the formation of chemisorbed intermediate on the active sites of the oxide electrode and follow the second-order mechanism.

• Journal of the Korean Electrochemical Society
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• v.19 no.1
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• pp.1-8
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• 2016

Capacity of layered lithium nickel-cobalt-manganese oxide ($LiNi_{1-x-y}Co_xMn_yO_2$) cathode material can increase by raising the charge cut-off voltage above 4.3 V vs. $Li/Li^+$, but it is limited due to anodic instability of conventional electrolyte. We have been screening and evaluating various sulfone-based compounds of dimethyl sulfone (DMS), diethyl sulfone (DES), ethyl methyl sulfone (EMS) as electrolyte additives for high-voltage applications. Here we report improved cycling performance of $LiNi_{0.5}Co_{0.2}Mn_{0.3}O_2$ cathode by the use of dimethyl sulfone (DMS) additive under an aggressive charge condition of 4.6 V, compared to that in conventional electrolyte, and cathode-electrolyte interfacial reaction behavior. The cathode with DMS delivered discharge capacities of $198-173mAhg^{-1}$ over 50 cycles and capacity retention of 84%. Surface analysis results indicate that DMS induces to form a surface protective film at the cathode and inhibit metal-dissolution, which is correlated to improved high-voltage cycling performance.