• Nuclear Engineering and Technology
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• v.32 no.2
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• pp.99-107
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• 2000

A probabilistic integrity analysis method is presented for a reactor vessel under pressurized thermal shock(PTS) based on Monte Carlo simulation. This method can be applied to the structural integrity assessment of a reactor vessel subjected to pressurized thermal shock where the coolant temperature transient cannot be expressed explicitly as a time function. An axially or circumferentially oriented infinite length surface crack is assumed to be in the beltline weld region of the rector vessel's inside surface. The random variables are the initial crack depth, neutron fluence on the vessel's inside surface, the copper and nickel content of the vessel materials, R $T_{NDT}$ , $K_{IC}$ , and K/aub la/. The reliability of a sample reactor vessel under PTS is assessed quantitatively and the influence of the amount of neutron fluence is also examined by applying the present method.sent method.

• Journal of Welding and Joining
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• v.20 no.5
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• Journal of Surface Science and Engineering
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• v.48 no.3
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• pp.100-104
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• 2015

The nickel alloys gets a great deal of attention due to their good mechanical, chemical and magnetic properties. Especially Ni-P alloy systems are very attractive due to their good corrosion resistance and the wear resistance in important technological applications. In this study, the effects of phosphorus acid concentration in plating solution on composition of Ni-P alloy coatings were studied. The Ni-P electrodeposits of the various P contents were investigated in order to understand effect of the composition on mechanical properties of Ni-P electrodeposits. The mechanical properties of electrodeposits increased as the P content in electrodeposits increase. The results of mechanical properties were explained by grain size and P solid solution effect. The effects of heat treatment on mechanical properties of Ni-P alloy coatings were also studied.

• 연구논문집
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• s.22
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• pp.151-160
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• 1992

The wear resistance of electroless Ni-P-X(X A1203, Diamond) composite coating layers was studied by Taber abrasion test technique. The wear resistance of composite coating layers was particularly relied upon the codeposited content, particle size and distribution of particles, and heat treatment of coating layers, as well as the electroless nickel plating bath employed. In this study, we lay emphasis on the wear resistance of electroless composite coating layers containing A1203 particles(1.2~Im, 6.7hIm, 11.5lIm, 20l1m) or diamond particles (1.5jim, 5gm). From the result of composite coating A1203 and diamond particles, the wear resistance of composite coating layers is as follows.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.1
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• pp.47-58
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• 2004

Loss factors of A356, Mn-Cu alloy and aluminum matrix composites reinforced with $SiC_p$ and Ni-coated graphite particles at various contents have been investigated using clamped-free cantilever beam method. The loss factors of half-power bandwidth of the specimens were measured over a wide range of frequencies from 50 to 3300Hz. Among the specimens, Al-10%$SiC_p$-10%$C_p$ showed the highest loss factor at the mode I, while Mn-Cu alloy showed the highest loss factors at the modes II and III. Consequently, at the mode I the Al-10%$SiC_p$--10%$C_p$ showed the loss factor of 0.00093, which is 2.64 and 1.58 times higher than those of A356 and Mn-Cu alloy, respectively.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.107-107
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• 2015

In order to investigate electrochemical behavior and biocompatibility of Co-Cr dental alloy by electrochemical corrosion test and MTT assay, the xCo-25Cr-yW-zNi alloys were used in this study. Samples of Co-Cr-W-Ni alloys were manufactured using arc melting furnace. The microstructure of the alloys was examined by optical microscopy (OM), Field emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD), MTT assay, and corrosion test. Corrosion resistance increased slightly as cobalt (Co) content increased. And bioactivity was concerned with nickel (Ni) and tungsten (W). Biocompatibility of Co-Cr alloy depended on Ni and W contents.

• Journal of Surface Science and Engineering
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• v.22 no.4
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• pp.161-167
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• 1989

Effects of bath composition on electroless deposition of Ni-W-B from sulphate solution were invesrigated in terms of deposition kinetics, electro resistivity and composition of deposit film. The microstruigated and crystataine structure of the films were also studied using a scanning electron microscope and X-ray diffractometer. The deposition rate increased linearly with increasing the concentration of nickel sulphate in bath solution, wheras the rate decreasing with sodium citrate. The rate was also affected by sodium tungstate, which was maaximum at the concentration of 0.06 M/1 in sodium tungstate, The content of W in the deposit increased with increased with increasing the sodium citrate had on opposite effect on the composition of W and B in the deposit. The crystal change film from armorphous to cryatallicne nature by heat treatments was proved by the reduction of specific resistance and X-ray diffration.

• Journal of Welding and Joining
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• v.20 no.1
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• pp.91-96
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• 2002

Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.

• Journal of Surface Science and Engineering
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• v.27 no.5
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• pp.285-291
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• 1994

The effects of pulse current parameters on the composition and the microstructure of Pd-Ni alloy electrodeposits were studied. The cathode current efficiency of p.c. electrolysis conditions decreased with increasing both mean and peak current density and was lower than those under D.C. electrolysis condition. Palladium content of Pd-Ni alloy increased with increasing both peak current density and on-time, while it decreased with increasing mean current density and duty cycle. The preferred orientation of Pd-Ni alloys changed with increasing mean current density in the sequence of (111)+(110).(100) or (110)longrightarrow(111)longrightarrow(100) or random distribution of crystal structure. The surface morphology of Pd-Ni alloy changed mainly according to the mean current density and was related to the preferred orientation.

• Journal of Surface Science and Engineering
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• v.55 no.5
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• pp.299-307
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• 2022

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.