• Title/Summary/Keyword: Nickel Silver

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Preliminary studies for production of 61Cu using natural nickel target with RFT-30 cyclotron

  • Lee, Jun Young;Hur, Min Goo;Yang, Seung Dae;Park, Jeong Hoon
    • Journal of Radiopharmaceuticals and Molecular Probes
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    • v.5 no.2
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    • pp.79-82
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    • 2019
  • 61Cu is a promising PET radiometal having favorable nuclear decay characteristics with appropriate half-life of 3.3 h. Owing its promising capabilities in radiopharmaceutical chemistry and its chemical similarities with its isotopes 64Cu and 67Cu, in this work we have tried to optimize the production and separation conditions of 61Cu. 61Cu was produced via (p, x) reaction with natural nickel which was electroplated on the high purity silver coated copper backing target holder. The optimization of target electrodeposition, beam energy and current modulation, target dissolution and separation were optimized in this study. Preliminary studies show that 61Cu was successfully produced and separated which can be further extended for the production of 64Cu and 67Cu.

Sintering Behavior of Ag-Ni Electrode Powder with Core-shell Structure

  • Kim, Kyung Ho;Koo, Jun-Mo;Ryu, Sung-Soo;Yoon, Sang Hun;Han, Yoon Soo
    • Journal of the Korean institute of surface engineering
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    • v.49 no.6
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    • pp.507-512
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    • 2016
  • Expensive silver powder is used to form electrodes in most IT equipment, and recently, many attempts have been made to lower manufacturing costs by developing powders with Ag-Ni or Ag-Cu core-shell structures. This study examined the sintering behavior of Ag-Ni electrode powder with a core-shell structure for silicon solar cell with high energy efficiency. The electrode powder was found to have a surface similar to pure Ag powder, and cross-sectional analysis revealed that Ag was uniformly coated on Ni powder. Each electrode was formed by sintering in the range of $500^{\circ}C$ to $800^{\circ}C$, and the specimen sintered at $600^{\circ}C$ had the lowest sheet resistance of $5.5m{\Omega}/{\Box}$, which is about two times greater than that of pure Ag. The microstructures of electrodes formed at varying sintering temperatures were examined to determine why sheet resistance showed a minimum value at $600^{\circ}C$. The electrode formed at $600^{\circ}C$ had the best Ag connectivity, and thus provided a better path for the flow of electrons.

The Research of Ni/Cu Contact Using Light-induced Plating for Cryatalline Silicom Solar Cells (결정질 실리콘 태양전지에 적용될 Light-induced plating을 이용한 Ni/Cu 전극에 관한 연구)

  • Kim, Min-Jeong;Lee, Soo-Hong
    • 한국태양에너지학회:학술대회논문집
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    • 2009.11a
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    • pp.350-355
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    • 2009
  • The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

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Partial Oxidation of Methane in Palladium-silver Alloy Membrane Reactor (팔라듐-은 막반응기를 이용한 메탄의 부분산화반응)

  • Choi, Tae-Ho;Kim, Kwang-Je;Moon, Sang-Jin;Suh, Jung-Chul;Baek, Young-Soon
    • Applied Chemistry for Engineering
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    • v.16 no.5
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    • pp.641-647
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    • 2005
  • The partial oxidation of methane is one of important processes for hydrogen production. As a membrane reactor, palladium-silver (Pd-Ag) alloy membrane prepared by electroless plating technique was employed for partial oxidation of methane. The experimental variables were reaction temperature, $O_2/CH_4$ mole ratio, $CH_4$ feed rate, and $N_2$ sweep gas flow rate. The methane conversions increased with the reaction temperatures in the range of 350 to $730^{\circ}C$. The highest methane conversion and CO selectivity were obtained at the condition of $O_2/CH_4$ mole ratio of 0.5 and $730^{\circ}C$ using commercially available nickel/alumina catalyst. The Pd-Ag membrane reactor showed higher methane conversions, 10~40% higher, compared to those in a traditional reactor.

Electrochemical Characteristics of Metal Coated Graphite for Anodic Active Material of Lithium Secondary Battery (금속 코팅된 흑연 입자로 제조된 전극의 전기화학적 특성)

  • Choi, Won-Chang;Lee, Joong-Kee;Byun, Dong-Jin;Cho, Byung-Won
    • Journal of the Korean Electrochemical Society
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    • v.6 no.2
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    • pp.103-112
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    • 2003
  • Various kinds of metals were coated on synthetic graphite in order to investigate the relationship between film characteristics and their electrochemical performance. Gas suspension spray coating method was employed for the coating of synthetic graphite. In our experimental range, all of the metal coated synthetic graphite showed the higher capacity than that of raw material at high C-rate mainly due to decrease in impedance of passivation film. In cyclic voltammetry experiments, silver-coated and tin-coated graphite anodes found the lithium-alloy reaction. Considering smaller amount of metal coating, the most increase in discharge capacity was caused by improvement of conductivity of the electrode. When single-component metal was coated, silver-coated graphite anode exhibited the highest discharge capacity and better cycleability. Double components of silver-nickel coated active material showed the highest discharge capacity, rate capability and the best cycle performance in the range of our experiments.

Investigation of Ni/Cu Solar Cell Using Selective Emitter and Plating (선택도핑에 도금법으로 Ni/Cu 전극을 형성한 태양전지에 관한 연구)

  • Kwon, Hyuk-Yong;Lee, Jae-Doo;Lee, Hae-Seok;Lee, Soo-Hong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.12
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    • pp.1010-1017
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    • 2011
  • The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. When fabricated Ni/Cu plating metallization cell with a selective emitter structure, it has been shown that efficiencies of up to 18% have been achieved using this technology.

N-type Si Schottky Junction Photoelectric Device Using Nickel and Silver (Ni과 Ag 금속을 이용한 N-type Si Schottky Junction 광전소자)

  • Seo, Cheolwon;Hong, Seung-Hyouk;Yun, Ju-Hyung;Kim, Joondong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.27 no.6
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    • pp.389-393
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    • 2014
  • A thin metal-embedding Schottky device was fabricated for an efficient photoelectric device. Semitransparent thick of 10 nm metal layers were deposited by sputtering of Ag and Ni on a Si substrate. The (111) N-type Si wafers with one-side polished, 450~500 ${\mu}m$ and resistivity $1{\sim}20{\Omega}{\cdot}cm$ were used. High rectifying ratio about 100 from Ni-Schottky device was achieved. This design would provide an effective scheme for high-performing photoelectric devices.

A Case Study of Lead-free Thick Film Conductors with Lead-containing and Lead-free Solders

  • Yu Yeon Su;Bokalo Peter;Shahbazi Samson;Matier Colleen
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2003.04a
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    • pp.1-19
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    • 2003
  • The electronic market thrust for many hybrid circuit manufacturers is changing because commercial market segments such as telecommunications, automotive and consumer electronics have increased the demand world wide for environmentally friendly thick film products. This, in turn, places a stronger emphasis on the material suppliers within the circuit fabrication industry to provide toxin free products with equal or higher performance than traditional technology. A new group of silver based thick film conductors, which are totally free of such toxins as cadmium, nickel and Bead have been developed to meet new environmental requirements. Traditional thick film products and newly developed toxin free compositions will be compared and data will be presented. To evaluate their performance, both groups of conductors were tested for solder acceptance, leach resistance and aged adhesion with standard lead-containing solder and higher temperature lead-free solder.

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Uncertainty assessment of industrial platinum resistance thermometers for different lead-wire connection methods (산업용 백금저항온도센서의 결선방식에 따른 측정불확도 평가방법)

  • Kim, Yong-Gyoo;Gam, Kee-Sool;Yang, In-Seok
    • Journal of Sensor Science and Technology
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    • v.18 no.4
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    • pp.322-326
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    • 2009
  • To estimate the measurement uncertainty for industrial platinum resistance thermometers(IPRTs) made with 3-wire connection, the immersion temperature profile was investigated using a liquid bath. Two types of IPRTs having lead wires made of silver and nickel were constructed and the immersion profiles were measured at temperatures from -50 $^{\circ}C$ to 250 $^{\circ}C$ using 3-wire and 4-wire method. As immersion depth and temperature increased, the resistances measured by 3-wire method increased linearly but not for 4-wire method. To calibrate a 3-wire IPRT, the immersion effect must be accounted for. We propose a linear equation to assess correctly the measurement uncertainty.

Strengthening and Toughening Mechanisms of Alumina-based Nanocomposites (알루미나 기재 복합재료의 고강도 고인성화 기구)

  • Awaji, Hideo;Cheon, Sung-Ho;Choi, Seong-Min
    • Ceramist
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    • v.9 no.6
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    • pp.49-55
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    • 2006
  • Intra-type alumina-based nanocomposites, in which second-phase nanoparticles are embedded within alumina grains, use dislocation activities to enhance strength and fracture toughness. The dislocations are generated around the nanoparticles by residual stresses during cooling process. In this paper, first, we explain strengthening and toughening mechanisms of alumina-based nanocomposites based on dislocation activities. Second, we propose a soaking method to construct the intra-type nanostructure and fabricate alumina/nickel and alumina/silver nanocomposites. The nanocomposites are then annealed in order to enhance the fracture toughness of the materials. Finally, we discuss the relation between the strength, fracture toughness, and critical frontal process zone size of the materials.

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