• Journal of the Korean Vacuum Society
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• v.12 no.S1
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• pp.17-20
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• 2003

We have studied magnetic and structural properties of ultrathin Ni films grown on PI(lII) surface using in situ surface magneto-optic Kerr effect and X-ray photoelectron spectroscopy. Perpendicular magnetic anisotropy was absent, and longitudinal Kerr signal was only detectable for Ni films thicker than 6 monolayers. Enhancement in longitudinal Kerr signal by 30% was achieved by post-annealing at temperatures below 800K, but upon annealing at 820K, surface alloy was formed. By using core-level binding-energy shifts, the composition was determined to be Ni 70 at. %.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Korean Journal of Crystallography
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• v.11 no.2
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• pp.80-83
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• 2000

Compound [Ni(P(OEt)3)4] (1) reacted with bis(diphenylphosphino)ethane (Ph2PCH2CH2Ph2, dppe) to give bis(bis(diphenylphosphine)ethane)nickel(0), [Ni(dppe)2] (2). Compound 2 was characterized by spectroscopy (1H-and 31P{1H}-NMR) and X-ray crystallography. Crystallographic data for 2: monoclinic space group P21/n, a=9.826(1)Å, b=21.167(2)Å, c=21.425(2)Å, β=91.957(9)°, Z=4, R(wR2)=0.0377(0.0882).

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.86-90
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• 2007

The organic-capped Ba-Ti-O nanolayers were coated uniformly on spherical Ni particles for multilayer ceramic capacitor (MLCC) applications via the formation of Ti-hydroxide nano-coating layers and their subsequent reaction with Ba-stearate at $180^{\circ}C$. The capping of organic shell on oxide coating layer changed the hydrophilic surface structure into hydrophobic one, which significantly improved the dispersion behavior in hydrophobic solvents such as terpineol and butanol. In addition, the uniform coating of Ba-Ti-O layer was advantageous to prevent Ni oxidation. This method provides a useful chemical route to fabricate organic-soluble Ba-Ti-O coated Ni particles for a highly integrated passive component.

• Journal of Welding and Joining
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• v.20 no.5
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.4
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• pp.261-265
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• 2011

This paper describes the fabrication and characteristics of a Au/Ni/Ti/3C-SiC Schottky diode with field plate (FP) edge termination. The Schottky contacts were annealed for 30 min at temperatures ranging from 0 to $800^{\circ}C$. At annealing temperature of $600^{\circ}C$, it showed an inhomogeneous Schottky barrier and had the best electrical characteristics. However, the annealing of $800^{\circ}C$ replaced it with ohmic behaviors because of the formation of many different types of nickel silicides. The fabricated Schottky diode had a breakdown voltage of 200 V, Schottky barrier height of 1.19 eV and worked normally even at $200^{\circ}C$.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.18 no.6
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• pp.636-641
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• 2009

Recently, expansion of micro-technology parts requires micro-precision machining technology. Micro-groove machining is important to fabricate micro-grating lens and many micro-parts such as microscope lens, fluidic graphite channel etc. Conventional groove fabrication methods such as etching and lithography have some problems in efficiency and surface integrity. But, mechanical micromachining methods using single crystal diamond tools can reduce these problems in chemical process. For this reason, microfabrication methods are expected to be very efficient, and widely studied. This study deals with machinability in micro-precision V-grooves machining of nickel plated layer using non-rotational single crystal diamond tool and 3-axis micro stages. Micro V-groove shape, chip formation and tool wear were investigated for the analysis of machinability of Ni plated layer.

• Proceedings of the KSR Conference
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• 2003.10c
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• pp.600-605
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• 2003

Battery of rolling stock is a very important device as power supply at starting and emergency control. This paper analyzes the quality of Ni-Cd battery by means of performance test. Ni-Cd battery have suitable and stable properties. That is very stable to discharge on low temperature state and very easy to manage and repair. This paper confirm the performance and property of Ni-Cd battery on low temperature environment by the performance test and estimate the life-cycle of Ni-Cd battery on board at rolling-stock by the life-test and the using-test.

• Bulletin of the Korean Chemical Society
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• v.34 no.1
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• pp.59-62
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• 2013

Spinel $LiMn_{1.5}Ni_{0.5}O_4$ cathode powders with different morphologies were synthesized by a co-precipitation method using oxalic acid. The calcination temperature affected the morphologies, crystalline structure and electrochemical properties of the $LiMn_{1.5}Ni_{0.5}O_4$ powders. The $LiMn_{1.5}Ni_{0.5}O_4$ powders obtained at a calcination temperature of $850^{\circ}C$ exhibited the highest initial discharge capacity with good capacity retention and high rate capability.

• Korean Journal of Materials Research
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• v.16 no.6
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• pp.382-385
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• 2006

Ni-doped $CoSb_3$ was prepared by the hot pressing, and its doping effects on the thermoelectric properties were investigated. Single phase ${\delta}-CoSb_3$ was successfully obtained by encapsulated induction melting and the subsequent heat treatment at 773 K for 24 hrs, followed by the hot pressing under 60 MPa at 773 K for 2 hrs. Nickel atoms acted as electron donors by substituting cobalt atoms. Thermoelectric properties were remarkably improved by the Ni doping.