• Title/Summary/Keyword: Nickel (Ni)

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Dissolution of Nickel Matte in Hydrochloric Acid Solution (염산 용액에서 니켈 Matte의 용해반응)

  • Lee, Hak-Sung
    • Applied Chemistry for Engineering
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    • v.3 no.4
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    • pp.686-693
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    • 1992
  • In order to investigate the mechanism of dissolutin of nickel from a matte composed essentially of heazlewoodite and ferronickel, the leaching in an aqueous solution of hydrochloric was carried out at $50-90^{\circ}C$, 0.5-3.ON HCl, and with the particle sizes between $100-160{\mu}m$ and $400-500{\mu}m$. The leaching rate of heazlewoodite was much rapider than that of ferronickel, and the two components were simultaneously dissolved with different reaction rates. Within the experimental range, NiS, an intermediate, was not formed. However a possibility to form a thin layer of NiS on particle surface upon saturating the reaction mixture with $H_2S$ was not excluded. At the initial stage, the activation energy was about 10 kcal/g mol. The reaction occurred at the particle surface, and consequently the particle size decreased with time. The rate of dissoultion for nickel was linearly proportional to the concentration of HCl up to 1.0N.

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Synthesis and Characterization of New Nickel (II) and Copper (II) Complexes of a Pentaaza Macrobicyclic Ligand (새로운 펜타아자 거대두고리 기간드의 니켈 (II) 및 구리 (II) 착화합물의 합성과 특성)

  • Kang Shin Geol;Jung Soo Kyung
    • Journal of the Korean Chemical Society
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    • v.33 no.5
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    • pp.510-515
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    • 1989
  • New nickel(II) and coppr(II) complexes of a saturated pentaaza macrobicyclic ligand $[Ni(D)]^{2+},\;[Cu(D)]^{2+},\;and\;[Cu(D)Cl]^+$, where D is 1,3,6,9,12-pentaazabicyclo[10,2,l]pentadecane, have been prepared by the template condensation reaction of tetraethylenepentamine and formaldehyde in the presence of the metal ion. The complexes contain one imidazolidine ring in the macrobicyclic ligand, D. The complexes $[Ni(D)]^{2+}\;and\;[Cu(D)]^{2+}$ have square planar geometry with 5-5-5-6 chelate ring sequence. The electronic spectra of $[Cu(D)Cl]^+$indicate that the complex has square pyramidal geometry. Synthesis, charactrization, and the spectroscopic and chemical properties of the macrobicyclic nickel(II) and copper(II) complexes are described.

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Reductive Degradation Kinetics and Pathways of Chlorophenolic Organic Pollutants by Nickel-Coated Zero Valent Iron (니켈로 코팅된 영가금속을 이용한 염소계 페놀화합물의 반응경로 및 반응율 평가)

  • Shin, Seung-Chul;Kim, Young-Hun;Ko, Seok-Oh
    • Journal of Korean Society of Environmental Engineers
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    • v.28 no.5
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    • pp.487-493
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    • 2006
  • Reductive dechlorination of chlorophenols by nickel coated iron was investigated to understand the feasibility of using Ni/Fe for the in situ remediation of contaminated groundwater. Zero Valent Iron(ZVI) was amended with Ni(II) ions to form bimetal(Ni/Fe). Dechlorination of five chlorophenol compounds and formation of intermediates were examined using Ni/Fe. Rate constant for each reaction pathway was quantified by the numerical integration of a series of differential rate equation. Experimental results showed that the sequence of hydrodechlorination rate constant was in the order of 2-CP>4-CP>2,4-DCP>2,4,6-TCP>2,6-DCP. The hydrodechlorination pathways for the conversion of each chlorophenol compound involves a full dechlorination to phenol via both concerted and stepwise mechanisms. Reaction pathways and corresponding kinetic rate constants were suggested based on the experiments and numerical simulations.

A comparative study of metal artifacts from common metal orthodontic brackets in magnetic resonance imaging

  • Kajan, Zahra Dalili;Khademi, Jalil;Alizadeh, Ahmad;Hemmaty, Yasamin Babaei;Roushan, Zahra Atrkar
    • Imaging Science in Dentistry
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    • v.45 no.3
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    • pp.159-168
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    • 2015
  • Purpose: This study was performed to compare the metal artifacts from common metal orthodontic brackets in magnetic resonance imaging. Material and Methods: A dry mandible with 12 intact premolars was prepared, and was scanned ten times with various types of brackets: American, 3M, Dentaurum, and Masel orthodontic brackets were used, together with either stainless steel (SS) or nickel titanium (NiTi) wires. Subsequently, three different sequences of coronal and axial images were obtained: spin-echo $T_1$-weighted images, fast spin-echo $T_2$-weighted images, and fluid-attenuated inversion recovery images. In each sequence, the two sequential axial and coronal images with the largest signal-void area were selected. The largest diameters of the signal voids in the direction of the X-, Y-, and Z-axes were then measured twice. Finally, the mean linear values associated with different orthodontic brackets were analyzed using one-way analysis of variation, and the results were compared using the independent t-test to assess whether the use of SS or NiTi wires had a significant effect on the images. Results: Statistically significant differences were only observed along the Z-axis among the four different brands of orthodontic brackets with SS wires. A statistically significant difference was observed along all axes among the brackets with NiTi wires. A statistically significant difference was found only along the Z-axis between nickel-free and nickel-containing brackets. Conclusion: With respect to all axes, the 3M bracket was associated with smaller signal-void areas. Overall, the 3M and Dentaurum brackets with NiTi wires induced smaller artifacts along all axes than those with SS wires.

FLIP CHIP ON ORGANIC BOARD TECHNOLOGY USING MODIFIED ANISOTROPIC CONDUCTIVE FILMS AND ELECTROLESS NICKEL/GOLD BUMP

  • Yim, Myung-Jin;Jeon, Young-Doo;Paik, Kyung-Wook
    • Journal of the Microelectronics and Packaging Society
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    • v.6 no.2
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    • pp.13-21
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    • 1999
  • Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

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Effect of surface treatment on the mechanical properties of nickel-titanium files with a similar cross-section

  • Kwak, Sang Won;Lee, Joo Yeong;Goo, Hye-Jin;Kim, Hyeon-Cheol
    • Restorative Dentistry and Endodontics
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    • v.42 no.3
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    • pp.216-223
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    • 2017
  • Objectives: The aim of this study was to compare the mechanical properties of various nickel-titanium (NiTi) files with similar tapers and cross-sectional areas depending on whether they were surface-treated. Materials and Methods: Three NiTi file systems with a similar convex triangular cross-section and the same ISO #25 tip size were selected for this study: G6 (G6), ProTaper Universal (PTU), and Dia-PT (DPT). To test torsional resistance, 5 mm of the straightened file's tip was fixed between polycarbonate blocks (n = 15/group) and continuous clockwise rotation until fracture was conducted using a customized device. To evaluate cyclic fatigue resistance, files were rotated in an artificial curved canal until fracture in a dynamic mode (n = 15/group). The torsional data were analyzed using 1-way analysis of variance and the Tukey post-hoc comparison test, while the cyclic fatigue data were analyzed using the Mann-Whitney U test at a significance level of 95%. Results: PTU showed significantly greater toughness, followed by DPT and G6 (p < 0.05). G6 showed the lowest resistance in ultimate torsional strength, while it showed a higher fracture angle than the other files (p < 0.05). In the cyclic fatigue test, DPT showed a significantly higher number of cycles to failure than PTU or G6 (p < 0.05). Conclusions: Within the limitations of this study, it can be concluded that the torsional resistance of NiTi files was affected by the cross-sectional area, while the cyclic fatigue resistance of NiTi files was influenced by the surface treatment.

Partial Substitution of Copper with Nickel for the Superconducting Bismuth Compound and Its Effect on the Physical and Electrical Properties

  • Kareem Ali Jasim;Riyam Abd Al-Zahra Fadil;Kassim Mahdi Wadi;Auday Hattem Shaban
    • Korean Journal of Materials Research
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    • v.33 no.9
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    • pp.360-366
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    • 2023
  • This study focuses on how the partial substitution of copper by nickel nanoparticles affects the electrical and structural properties of the Bi2Ba2Ca2Cu2.9Ni0.1O10+δ, Bi2Ba2Ca2Cu2.8Ni0.2O10+δ and Bi2Ba2Ca2Cu2.6Ni0.4O10+δ compounds. Approximate values of crystallization size and crystallization percentage for the three compounds were calculated using the Scherer, modified Scherer, and Williamson-Hall methods. A great similarity was observed in the crystal size values from the Scherer method, 243.442 nm, and the Williamson-Hall method, 243.794 nm for the second sample. At the same time this sample exhibited the highest crystal size value for the three methods. In the examination of electrical properties, the sample with 0.1 partial substitution, Bi2Ba2Ca2Cu2.9Ni0.1O10+δ was determined to be the best with a critical temperature of 100 K and an energy gap of 6.57639 × 10-21 MeV. Using the SEM technique to analyze the structural morphology of the three phases, it was discovered that the size of the granular forms exceeds 25 nm. It was determined that the samples' shapes alter when nickel concentration rises. The patterns that reveal the distribution of the crystal structure also exhibit clear homogeneity.

A study on the Synthesis of Nickel Hydroxide by Ammonium Sulfate from Waste Nickel-Cadmium Batteries (폐니켈-카드뮴 전지로부터 황산암모늄을 이용한 수산화니켈 제조 방안 연구)

  • Kim, Min-Jun;Park, Il-Jeong;Kim, Dae-Weon;Jeong, Hang-Chul
    • Resources Recycling
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    • v.28 no.5
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    • pp.51-59
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    • 2019
  • This study focused on the synthesis of the nickel hydroxide using ammonium sulfate in leaching solution from waste nickel-cadmium batteries. The effect of pH, temperature and the input amount of ammonium sulfate in leaching solution was investigated. The ammonium nickel sulfate with high purity was obtained in acidic leaching solution and the solution temperature of $60^{\circ}C$. The suitable molar ratio of the input amount of ammonium sulfate to nickel in solution is 2:1. The impurity about 1.4 at.% of Cd was included in the nickel hydroxide precipitates when ammonium nickel sulfate was used. At the process using sodium sulfide which precipitates the cadmium in solution, nickel and iron compounds were precipitated together.

A Study on the Recycling Process of Nickel Recovery from Inconel 713C Scrap based on Hydrometallurgy (인코넬 713C 스크랩으로부터 니켈 자원 회수를 위한 습식제련 기반 재활용공정 연구)

  • Min-seuk Kim;Rina Kim;Kyeong-woo Chung;Jong-Gwan Ahn
    • Resources Recycling
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    • v.33 no.4
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    • pp.36-46
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    • 2024
  • We investigated a hydrometallurgical process of nickel recovery from Inconel 713C scrap. The process proceeded with a series of i) comminution of pyrometallurgical treated scrap, ii) sulfuric acid leaching, iii) solvent extraction of unreacted acid, molybdenum, aluminum, and precipitation of chromium, iv) crystallization of nickel sulfate by vacuum evaporation, and v) nickel electrowinning. The nickel-aluminum intermetallic compound, Ni2Al3, was formed by the pyrometallurgical pretreatment readily grounded under 75 ㎛. Sulfuric acid leaching was done for 2 hours in 2 mol/L, 20 g/L solid/liquid ratio, and 80 ℃. It revealed that over 98 % of nickel and aluminum was dissolved, whereas 28 % of molybdenum was. A nickel sulfate solution with 2.34 g/L for the crystallization of nickel sulfate hydrate was prepared via solvent extraction and precipitation. Over 99 % of molybdenum and aluminum and 93 % of chromium was removed. Nickel metal with 99.9 % purity was obtained by electrowinning with the nickel sulfate monohydrate in the cell equipped with anion exchange membranes for catholyte pH control. The membrane did not work well, resulting in a low current efficiency of 73.3 %.

Leakage Current Reduction of Ni-MILC Poly-Si TFT Using Chemical Cleaning Method

  • Lee, Kwang-Jin;Kim, Doyeon;Choi, Duck-Kyun;Kim, Woo-Byoung
    • Korean Journal of Materials Research
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    • v.28 no.8
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    • pp.440-444
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    • 2018
  • An effective cleaning method for Ni removal in Ni-induced lateral crystallization(Ni-MILC) poly-Si TFTs and their electrical properties are investigated. The HCN cleaning method is effective for removal of Ni on the crystallized Si surface, while the nitric acid treatment results decrease by almost two orders of magnitude in the Ni concentration due to effective removal of diffused Ni mainly in the poly-Si grain boundary regions. Using the HCN cleaning method after the nitric acid treatment, re-adsorbed Ni on the Si surfaces is effectively removed by the formation of Ni-cyanide complexions. After the cleaning process, important electrical properties are improved, e.g., the leakage current density from $9.43{\times}10^{-12}$ to $3.43{\times}10^{-12}$ A and the subthreshold swing values from 1.37 to 0.67 mV/dec.