• Title/Summary/Keyword: Nickel (Ni)

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A Study on the Selective Leaching of the Copper Component by Sulfation Process (황산화 배소법에 의한 구리성분의 선택적 침출연구)

  • Kim, Woo Jin;Kim, Joon Soo;Kim, Myong Jun;Tran, Tam;Lee, Jin-Young;Shin, Shun-Myung
    • Resources Recycling
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    • v.25 no.5
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    • pp.57-63
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    • 2016
  • This study were carried out sulfation roasting and selective leaching test for the effective recovery of copper component in concentrate obtained by froth floatation of Autrallian low grade copper ore. The optimum conditions of sulfation roasting were temp. $450^{\circ}C$, $Na_2SO_4$ 2 mole ratio and time 1.5 h, and then selective leaching were room temperature and $H_2O$ or 1M $H_2SO_4$ solutions. Leaching efficiency of optimum sulfation product were 90 wt.% of copper, 20 wt.% of iron and 15wt.% of nickel elements. In this results, it was possible to selective decomposition leaching of the copper component under optimum conditions in this research.

Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향)

  • Ko, Min-Kwan;Ahn, Jee-Hyuk;Lee, Young-Chul;Kim, Kwang-Seok;Yoon, Jeong-Won;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.50 no.1
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    • pp.71-77
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    • 2012
  • We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

Study of the Optimization and the Depth Profile Using a Flat Type Ion Source in Glow Discharge Mass Spectrometry

  • Woo Jin Chun;Kim, Hyo Jin;Lim Heoung Bin;Moon Dae Won;Lee Kwang Woo
    • Bulletin of the Korean Chemical Society
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    • v.13 no.6
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    • pp.620-624
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    • 1992
  • The analytical performance of glow discharge mass spectrometer (GD-MS), using a flat type ion source is discussed. The efficiency of ion extraction was maximized at the distance between anode and cathode of 6 mm. At the operation condition of 4 mA, -1000 volt, and 1 mbar for the source, the optimum voltages for sampler and skimmer were40 volt and -280 volt, respectively. The intensities of Cu, Zn, and Mn were increased as a function of square root of current approximately. Korea standard reference materials (KSRM) were tested for an application study. The detection limits of most elements were obtained in the range of several ppm at the optimized operating condition. The peaks of aluminum and chromium were interfered by those of residual gases. The depth profile of nickel coated copper specimens (3, 5, 10 ${\mu}m$ thickness) were obtained by plotting time versus intensities of Ni and Cr after checking the thickness of nickel coated using a scanning electron microscope (SEM). At this moment, the sputtering rate of 0.2 ${\mu}m/min$ at the optimum operating condition was determined from the slope of the plot of time to the coating thickness. The roughness spectra of specimen's crater after 16 min, discharge were obtained using a Talysuf5m-120 roughness tester as well.

Effects of PCB Surface Finishes on in-situ Intermetallics Growth and Electromigration Characteristics of Sn-3.0Ag-0.5Cu Pb-free Solder Joints (PCB 표면처리에 따른 Sn-3.0Ag-0.5Cu 무연솔더 접합부의 in-situ 금속간 화합물 성장 및 Electromigration 특성 분석)

  • Kim, Sung-Hyuk;Park, Gyu-Tae;Lee, Byeong-Rok;Kim, Jae-Myeong;Yoo, Sehoon;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.2
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    • pp.47-53
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    • 2015
  • The effects of electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the in-situ intermetallics reaction and the electromigration (EM) reliability of Sn-3.0Ag-0.5Cu (SAC305) solder bump were systematically investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of the ENIG surface finish at solder top side, while at the OSP surface finish at solder bottom side,$ Cu_6Sn_5$ and $Cu_3Sn$ IMCs were formed. Mean time to failure on SAC305 solder bump at $130^{\circ}C$ with a current density of $5.0{\times}10^3A/cm^2$ was 78.7 hrs. EM open failure was observed at bottom OSP surface finish by fast consumption of Cu atoms when electrons flow from bottom Cu substrate to solder. In-situ scanning electron microscope analysis showed that IMC growth rate of ENIG surface finish was much lower than that of the OSP surface finish. Therefore, EM reliability of ENIG surface finish was higher than that of OSP surface finish due to its superior barrier stability to IMC reaction.

Shearing Characteristics of Sn3.0AgO.5Cu Solder Ball for Standardization of High Speed Shear Test (고속전단시험의 표준화를 위한 Sn3.0Ag0.5Cu 솔더볼의 전단특성)

  • Jung, Do-Hyun;Lee, Young-Gon;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.1
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    • pp.35-39
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    • 2011
  • Shearing characteristics of Sn-3.0wt%Ag-0.5wt%Cu ball for standardization of high speed shear test were investigated. The solder ball of 450 ${\mu}m$ in diameter was reflowed at $245^{\circ}C$ on FR4 PCB (Printed Circuit Board) to prepare a sample for the high-speed shear test. The metal pads on the PCB were OSP (Organic Solderability Preservative, Cu pad) and ENIG (Electroless Nickel/Immersion Gold, i.e CulNi/Au). Shearing speed was varied from 0.5 to 3.0 m/s, and tip height from 10 to 135 ${\mu}m$. As experimental results, for the OSP pad, a ductile fracture increased with tip height, and it decreased with shearing speed. In the case of ENIG pad, the ductile fracture increased with the tip height. The tip height of 10 ${\mu}m$ (2% of solder ball diameter) was unsuitable since the fracture mode was mostly pad lift. Shear energy increased with increasing shearing tip height from 10 to 135 ${\mu}m$ for both of OSP and ENIG pads.

EFFECT OF CANAL TAPERING IN TEETH OF VARIOUS APICAL SIZE & CROSS-SECTIONAL CONFIGURATION ON MICROLEAKAGE (다양한 치근단공 크기와 근관단면의 형태를 가지는 치아에서 taper의 정도가 미세누출에 미치는 영향)

  • Kim, Jung-Hee;Lee, Kyung-Ha;Lee, Se-Joon;Yu, Mi-Kyung;Lee, Kwang-Won
    • Restorative Dentistry and Endodontics
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    • v.30 no.2
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    • pp.95-101
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    • 2005
  • The aim of this study was to evaluate the microleakage of teeth according to root canal preparation with & without apical enlargement in various size of apical foramen. 60 extracted one canal roots were cross-cutted at 5 mm from root apex and divided into two groups according to their apical foramen size of large (L) and small (S). Each group was subdivided into two groups accordance with their cross-sectional configuration at 5 mm from apex, round (R) and ovoid (O); SR Group, SO Group LR Group, LO Group. Each group was shaped in .02 taper by Quantec series Nickel-Titanium (NiTi) rotary file, obturated by lateral condensation method. Leakage was measured using a fluid transport model under 40 $cmH_2O$ pressure. After the leakage test, blocks which had showed the leakage retreated with .04 taper and ,06 taper and evaluated the degree of fluid filtration in each group. The data was analysed statistically using chi-square test and fisher's exact test. The results obtained were as follows : 1. Significant difference in leakage was found in groups which had different apical foramen size in .02 taper instrumentation (p < 0.05), but not in .04 taper instrumentation (p > 0.05) 2. The difference in microleakage according to the shape of canal was not evident at 5 mm from apex (p > 0.05). 3. There was correlation between .02 taper instrumentation and .04 taper instrumentation in LR group, LO group (p < 0.05).

Recovery of Copper from Synthetic Leaching Solution of Manganese Nodule Matte by Solvent Extraction-electrowinning Process (망간단괴 매트상 모의 침출용액으로부터 용매추출-전해채취 공정에 의한 구리의 회수)

  • Kim, Hyun-Ho;Park, Kyung-Ho;Nam, Chul-Woo;Yoon, Ho-Sung;Kim, Min-Seuk;Kim, Chul-Joo;Park, Sang-Woon
    • Resources Recycling
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    • v.25 no.1
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    • pp.60-67
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    • 2016
  • A scale-up test with a continuous solvent extraction and electro-winning system was carried out to separate and recover copper from a synthetic sulfuric acid solution (Cu 10.5 g/L, Co 2.0 g/L, Ni 15.0 g/L, Fe 0.2 g/L). The solution was introduced into mixer-settlers with four stages of extraction and two stages of stripping for continuous countercurrent solvent extraction to separate copper from nickel and cobalt. The loading was carried out using 40% LIX 84-I(v/v) as extractant with a phase ratio of A : O = 1 : 1. Meanwhile, the stripping was undertaken at a phase ratio of A : O = 1 : 1.5 using depleted electrolyte containing 35.0 g/L Cu and 180 g/L $H_2SO_4$ as stripping solution. The extraction and stripping efficiencies were found to be 96.7% and 91.0%, respectively. The copper composition of the stripped solution (pregnant electrolyte) was 50.0 g/L Cu with impurities of 25 ppm nickel, 5 ppm cobalt and 3 ppm iron. In the electro-winning process, copper metal of 99.833 purity was yielded with current efficiency of 98.9% and current density of $1.50A/dm^2$.

Compositional Variation of Arsenopyrites in Arsenic and Polymetallic Ores from the Ulsan Mine, Republic of Korea, and their Application to a Geothermometer (울산광산산(蔚山鑛山産) 유비철석(硫砒鐵石)의 조성변화(組成變化) 및 지질온도계(地質溫度計)에 대(對)한 적용(適用))

  • Choi, Seon-Gyu;Chung, Jae-Ill;Imai, Naoya
    • Economic and Environmental Geology
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    • v.19 no.3
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    • pp.199-218
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    • 1986
  • Arsenopyrite in arsenic and polymetallic ores from calcic Fe-W skarn deposit of the Ulsan mine, Republic of Korea, has been investigated by means of electron microprobe analysis and X-ray diffractometry. As a result, it is revealed that the Ulsan arsenopyrite may be classified into the following three species with different generation on the basis of its mode of occurrence, chronological order during polymetallic mineralization and chemical composition; arsenopyrites I, II and III. 1) Arsenopyrite I-(Ni, Co)-bearing species belonging to the oldest generation, which has crystallized together with (Ni, Co)-arsenides and -sulpharsenides in the early stage of polymetallic mineralization. In rare cases, it contains a negligible amount of antimony. It occurs usually as discrete grains with irregular outline, showing rarely subhedral form, and is diffused in skarn zone. The maximum contents of nickel and cobalt are 10.04 Ni and 2.45 Co (in weight percent). Occasionally, it shows compositional zoning with narrow rim of lower (Ni+Co) content. 2) Arsenopyrite II-arsenian species, in which (Ni+Co) content is almost negligible, may occur widely in arsenic ores, and its crystallization has followed that of arsenopyrite I. It usually shows subhedral to euhedral form and is closely associated with $l{\ddot{o}}llingite$, bismuth, bismuthinite, chalcopyrite, sphalerite, bismuthian tennantite, etc. It is worthy of note that arsenopyrite II occasionally contains particles consisting of both bismuth and bismuthinite. 3) Arsenopyrite III-(Ni, Co)-free, S-excess and As-deficient species is close to the stoichiometric composition, FeAsS. It occurs in late hydrothermal veins, which cut clearly the Fe-W ore pipe and the surrounding skarn zone. It shows euhedral to subhedral form, being extremely coarse-grained, and is closely associated with pyrite, "primary" monoclinic pyrrhotite, galena, sphalerite, etc. Among three species of the Ulsan arsenopyrite, arsenopyrite I does not serve as a geothermometer, because (Ni+Co) content always exceeds 1 weight percent. In spite of the absence of Fe-S minerals as sulphur-buffer assemblage, the presence of $Bi(l)-Bi_2S_3$ sulphur-buffer enables arsenopyrite II to apply successfully to the estimation of either temperature and sulphur fugacity, the results are, $T=460{\sim}470^{\circ}C$, and log $f(S_2)=-7.4{\sim}7.0$. With reference to arsenopyrite III, only arsenopyrite coexisting with pyrite and "primary" monoclinic pyrrhotite may serve to restrict the range of both temperature and sulphur fugacity, $T=320{\sim}440^{\circ}C$, log $f(S_2)=-9.0{\sim}7.0$. These temperature data are consistent with those obtained by fluid inclusion geothermometry on late grandite garnet somewhat earlier than arsenopyrite II. At the beginning of this paper, the geological environments of the ore formation at Ulsan are considered from regional and local geologic settings, and physicochemical conditions are suspected, in particular the formation pressure (lithostatic pressure) is assumed to be 0.5kb (50MPa). The present study on arsenopyrite geothermometry, however, does not bring about any contradictions against the above premises. Thus, the following genetical view on the Ulsan ore deposit previously advocated by two of the present authors (Choi and Imai) becomes more evident; the ore deposit was formed at shallow depth and relatively high-temperature with steep geothermal gradient-xenothermal conditions.

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Kinetics and Mechanism of the Oxidation of Sulfur Dioxide on Nickel Oxide-${\alpha}$-Ferric Oxide System (산화니켈-${\alpha}$ 형 산화철 상에서 이산화황의 산화 반응메카니즘)

  • Kyu Yong Lee;Yong Rok Kim;Sung Han Lee
    • Journal of the Korean Chemical Society
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    • v.27 no.3
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    • pp.183-188
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    • 1983
  • The catalytic oxidation of $SO_2$ has been investigated in the presence of vacuum-activated 10 mol % Ni-doped ${\alpha}-Fe_2O_3$ under various partial pressures of $SO_2\;and\;O_2$ at temperatures from 320 to $440{\circ}C$. Over the temperature range $320{\sim}440{\circ}C$, the activation energy is 13.8 $kcal{\cdot}mol^{-1}$. The oxidation rates have been correlated with 1.5 order kinetics; first order with respect to $SO_2$ and 0.5 order with respect to $O_2$. From the kinetic data and conductivity measurements, the adsorption, oxidation mechanism of $SO_2$ and the defect structure of vacuum-activated 10 mol % Ni-doped {\alpha}-Fe_2O_3$ are suggested. $O_2\;and\;SO_2$ appear to be adsorbed essentially as ionic species. Two surface sites, probably an $O^{2-}$ lattice and an oxygen vacancy which is induced by Ni-doping, might be required to adsorb $SO_2\;and\;O_2$. The conductivity measurements and kinetic data indicate that the adsorption process of $SO_2\;{(SO_2+O^{2-}}_{(latt)}{\rightleftharpoons}{{SO_3}^-}_{(ads)}+e')$ is the rate-determining step.

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Exposure Characteristics of Particles during the After-treatment Processes of Aluminum Oxide Fibers and Nickel Powders (산화알루미늄 섬유와 니켈분말 후처리공정에서 입자의 노출특성)

  • Kim, Jong Bum;Kim, Kyung Hwan;Ryu, Sung Hee;Yun, Seong-Taek;Bae, Gwi-Nam
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.26 no.2
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    • pp.225-236
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    • 2016
  • Objectives: Nanomaterials have been used in various fields. As use of nanoproducts is increasing, workers dealing with nanomaterials are also gradually increasing. Exposure assessments for nanomaterials have been carried out for protection of worker's health in workplace. Exposure studies were mainly focused on manufacturing processes, but these studies on after-treatment processes such as refinement, weighing, and packing were insufficient. So, we investigated exposure characteristics of particles during after-treatment processes of $Al_2O_3$ fibers and Ni powders. Methods: Mass-production of Ni powder process was carried out in enclosed capture-type canopy hood. In a developing stage, $Al_2O_3$ was handled with a local ventilation unit. Exposure characteristics of particles were investigated for $Al_2O_3$ fiber and Ni powder processes during the periods of 10:00 to 16:00, 20 May 2014 and 13:00 to 16:00, 21 May 2014, respectively. Three real-time aerosol instruments were utilized in exposure assessment. A scanning mobility particle sizer(SMPS, nanoscan, model 3910, TSI) and an optical particle counter(OPC, portable aerosol spectrometer, model 1.109, Grimm) were used to determine the particle size distribution in the size range of 10-420 nm and $0.25-32{\mu}m$, respectively. In addition, a nanoparticle aerosol monitor(NAM, model 9000, TSI) was used to measure lung-deposited nanoparticle surface area. Membrane filters(isopore membrane filter, pore size of 100 nm) were also used for air sampling for the FE-SEM(model S-5000H, Hitachi) analysis using a personal sampling pump(model GilAir Plus by 2.5 L/min, Gilian). Conclusions: For Ni powder after-treatment process, only 27% increase in particle concentration was found during the process. However, for $Al_2O_3$ fiber after-treatment process, significant exposure(1.56-3.34 times) was observed during the process.