Study of Interfacial Intermetallic Compounds and Brittle Fracture Behavior of Sn-Ag-Cu Solder on Electroless Plated Nicke (무전해 Ni위에 형성된 Sn-Ag-Cu솔더 접합부의 계면 금속간화합물 변화 및 접합부 취성파괴 거동 연구)
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- Proceedings of the Korean Institute of Surface Engineering Conference
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- 2015.11a
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- pp.231-231
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- 2015