• Korean Journal of Materials Research
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• v.13 no.1
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• pp.6-10
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• 2003

Electroplated Ni and Ni-W micro-molds using LIGA-like process for replication of micro-components such as microfluidic parts and micro optical parts have been investigated. In general, it is hard to produce micro-parts using conventional mechanical processes. Micro-mold formed by LIGA-like process could fabricate micro-parts with high aspect ratio. In this paper, fabrication and properties of electroplated Ni molds with varying applied current types as well as those of Ni-W molds were investigated. Ni molds fabricated under pulse-reverse current showed the highest hardness value of about 160 Hv. Ni-W molds showed the hardness of about 500 Hv which was much harder than that of Ni electroplated molds. The above results suggested that high quality micro-molds could be fabricated by using Ni electroplating of pulse-reverse type for core molds and sequential Ni-W alloys coating.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.10a
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• pp.106-108
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• 2003

We fabricated Ni and Ni-W alloys for use as a substrate in YBCO coated conductor applications and evaluated the effect of W in Ni on texture, microstructure and surface morphology, and hardness of substrate. Pure Ni, Ni-2 at.％W, and Ni-5at.％W alloy substrates were prepared by plasma arc melting, cold rolling, and the recrystallization heat treatment at various temperature (700- 130$0^{\circ}C$). It was observed that Ni-W alloy substrates had stronger cube texture and maintained it at higher annealing temperature, compared to pure Ni substrate : The full-width at half- maximums of in-plane texture was 13.40$^{\circ}$ for Ni substrate and 4.42$^{\circ}$-5.57$^{\circ}$ for Ni-W substrate annealed at 100$0^{\circ}C$. In addition, it was observed that the Ni-W substrate had smaller grain size, shallower boundary depth, and higher hardness, compared to those of pure Ni substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.28-29
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• 2006

The magnetic properties of a series of both annealed and as-rolled Ni-$W_y$ alloy tapes with compositions y = 0, 1, 3, and 5 at.%, were studied. To compare with Ni-W alloys, the magnetic properties of a series of both annealed and as-rolled $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5 and 7 at.%, were studied, as well. Both the isothermal mass magnetization M(H) of a series of samples, such as both Ni-W and [Ni-W]-Cu alloy tapes, at different fixed temperatures and M(T) in fixed field, were measured using a PPMS-9 (Quantum Design). The degree of ferromagnetism of Ni-$W_y$ alloys have reduced as W-content y increases. Both the saturation magnetization $M_{sat}$ and Curie temperature $T_c$ decrease linearly with W-content y, and both $M_{sat}$ and $T_c$ go to zero at critical concentration of $y_c$ ~ 9.50 at.% W. The effect of Cu addition on both the saturation magnetization $M_sat$ and Curie temperature $T_c$ decrease linearly with Cu-content x in $[Ni_{97at.%}W_{3at.%}]_{100-x}Cu_x$ alloy tapes with compositions x = 0, 1, 3, 5, and 7 at.%. The results confirm that [Ni-W]-Cu alloy tapes can have much reduced ferromagnetism as Cu-content x increases.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.6
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• pp.368-374
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• 2009

Nickel titanium shape memory alloys (NiTi) have been investigated for applications in the biomedical industry. However, little is known about the influences of surface modifications on the propertise of these alloys. The effect of electropolishing and heat treatments was found to exhibit significant surface roughness. Change of phase was B2, r-phase and B19' by heat treatments. In this study, effect of the electropolishing conditions on surface roughness is investigated in Ni-Ti alloys (Nitinol). Variation in phases with heat treatment temperature is investigated for a Ni-Ti alloy by X-ray diffraction and DSC. Characteristic of the microstructure have been observed by SEM. Surface roughness have been measured by AFM. The results clearly show that significant different in surface property to heat treated at $500^{\circ}C$ (R-phase). $TiO_2$ phases preciritated all of the specimens. It is not good effect of surface roughness because made to surface relief. The surface roughness appears to be important in the property of Ni-Ti alloys for biomedical applications.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.305-305
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• 2012

Ni-W 합금의 고경도 특성을 연구하기 위하여 전해 도금 방법을 이용하여 Ni-W 합금을 제작하였다. 전해 도금시 여러 가지 제어인자 중 전류밀도, pH, Ni 금속염의 양 그리고 도금욕의 온도 등을 변수로 하여 실험을 하였다. 도금층 내 Ni과W의 함량 조성비를 EDS를 이용하여 분석하였으며, 각각의 변수에 따른 Ni-W 합금의 결정구조를 XRD를 이용하여 측정하였다. Ni-W 합금 도금층내 성분 조성비 및 결정구조에 따른 경도를 비커스 경도계를 이용하여 측정하였다.

• Journal of the Korean institute of surface engineering
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• v.50 no.5
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• pp.386-391
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• 2017

Two kinds of steels whose compositions were Fe-34.4Cr-14.5Ni-2.5Mo-0.4W-0.4Mn-0.5Si-(0.009 or 0.35)S (wt.%) were centrifugally cast, and oxidized at $900^{\circ}C$ for 50-350 h in order to find the effect of sulfur on the high-temperature oxidation of Fe-34.4Cr-14.5Ni-2.5Mo-0.4W-0.4Mn-0.5Si-(0.009 or 0.35)S (wt.%) alloys. These alloys formed oxide scales that consisted primarily of $Cr_2O_3$ as the major oxide and $Cr_2MnO_4$ as the minor one through preferential oxidation of Cr and Mn. They additionally formed $SiO_2$ particles around the scale/alloy interface as well as inside the matrices. The high affinity of Mn with S led to the formation of scattered MnS inclusions particularly in the 0.35S-containing cast alloy. Sulfur was harmful to the oxidation resistance, because it deteriorated the scale/alloy adherence so as to accerelate the adherence and compactness of the formed scales.

• Transactions on Electrical and Electronic Materials
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• v.4 no.1
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• pp.15-20
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• 2003

NiCr alloys are prepared onto poly-Si/ $SiO_2$/Si substrates to replace Pt bottom electrode with a new one for integration of high dielectric constant materials. Alloys deposited at Ni and Cr power of 40 and 40 W showed optimum properties in the composition of N $i_{1.6}$C $r_{1.0}$. The grain size of films increases with increasing deposition temperature. The films deposited at 50$0^{\circ}C$ showed a severe agglomeration due to homogeneous nucleation. The NiCr alloys from the rms roughness and resistivity data showed a thermal stability independent of increasing annealing temperature. The 80 nm thick BST films deposited onto N $i_{1.6}$C $r_{1.0}$/poly-Si showed a dielectric constant of 280 and a dissipation factor of about 5 % at 100 kHz. The leakage current density of as-deposited BST films was about 5$\times$10$^{-7}$ A/$\textrm{cm}^2$ at an applied voltage of 1 V. The NiCr alloys are possible to replace Pt bottom electrode with new one to integrate f3r high dielectric constant materials.terials.

• International Journal of Precision Engineering and Manufacturing
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• v.5 no.1
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• pp.19-26
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• 2004

The growth of solid particles in TiC-XC-2vo1.% and TiC-XC-30vo1.% Ni alloys, (where X=Zr, W or Mo) was fitted to the equation of the form $d^3$-${do}^3$=Kt during the liquid phase sintering at 1,673K. Also, the grain growth behavior decreased markedly with the addition of ${MO}_2$C or WC and increased with the addition of zrC. The contiguity was greater in the alloys with a smaller growth rate constant and especially, decreased by increasing the Ni content in the TiC-${MO}_2$C-Ni alloy. In addition, the effect of the addition of carbide on the grain growth of 2 vo1.% Ni alloys was found to be similar to that of 30vo1.% Ni alloys. Consequently, the grain growth mechanism cannot be explained by the usual solution / reprecipitation process, but can be explained in terms of a new growth velocity equation, which includes the effects of contiguous carbide grain boundaries in restricting the overall grain growth, as well as the area of the solid / liquid interface in the alloy.

• Journal of the Korean Society for Heat Treatment
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• v.15 no.2
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• pp.65-69
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• 2002

$Llo{\rightarrow}Ni_5Al_3$ reordering and related properties in Ni-Al alloys consisting of 64-65at%Ni are characterized by X-ray diffraction, shape memory effect and damping capacity. Formation of $Ni_5Al_3$ takes place by simple ordering of atoms with a continuous increase in c/a ratio. As a result, degradation of shape memory effect and damping capacity is observed after short time annealing at $200-300^{\circ}C$.

• Progress in Superconductivity
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• v.7 no.1
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• pp.64-68
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• 2005

We fabricated Ni-based alloy substrates for YBCO coated conductor using powder metallurgy. Tungsten and copper were selected as alloy elements due to their mutual solubility to the base element of nickel. The alloying elements were mixed with nickel using ball milling and dried in air. The powder mixtures were packed in a rubber mold, cold isostatic pressed 200 MPa and made into rods. The compacted rods were sintered at $1150^{\circ}C$ for 6 hours for densification. It was confirmed by neutron diffraction experiment that W and Cu atoms made complete solid solution with Ni. Lattice constant of nickel alloy increased by $0.004{\AA}$ for 1at. $\%$ W in Ni-W alloy, $0.0006{\AA}$ for 1 at. $\%$ Cu in Ni-W-Cu alloy.