• The Journal of Korean Academy of Prosthodontics
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• v.41 no.3
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• pp.342-350
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• 2003

Statement of problem. Titanium-Nickel alloy might be used in various prosthetic restorations since it has a unique property such as super-elasticity and high fatigue resistance. However, little is known about the casting ability of this alloy. Purpose. This in vitro study compared the casting accuracy and the porosity made with different investments and various sprue designs to ascertain what casting condition would be better for the fabrication of Ti-Ni cast restorations. Material and methods. A total of 70 Ti-Ni alloy crowns were made and divided into 7 groups of 10 copings on a metal master die. For measuring the effect of the sprue numbers, two groups with one and two 8-gauge sprues were compared. Moreover, the results of the conventional sprue and the double thickness sprues were compared. Three investments were used; carbon free phosphate bonded investment, titanium investment and gypsum bonded investment. The cast restorations were evaluated at 48 points on the entire circumferential margin with a stereomicroscope measuring in micrometers. Each crown was radiographically examined for casting defects and porosity. Data on casting accuracy were analyzed using two-way and Post hoc Scheffe's comparison to determine whether significant differences existed at the 95% confidence level. Student-Newman-Keuls test were performed to identify significant differences in the number of voids. Results. The double sprueing group and double thickness group had significantly less marginal discrepancy than the single sprueing group (P<.05 and P<.01, respectively). The castings with phosphate bonded investment showed the least marginal discrepancy and the smoothest surface. The castings invested in the gypsum bonded investment had the greatest gaps in margin and the largest failure rate. The double sprueing group and phosphate bonded investment group had significantly smaller void numbers and smaller void size than the other groups. Conclusion. Within the limitations of this in vitro study, the casting accuracy of the groups using thicker, double sprue design and the phosphate bonded investment was significantly superior. Moreover, void number and size were less than other groups.

• Journal of Powder Materials
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• v.18 no.5
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• pp.430-436
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• 2011

Joining of NiO-YSZ to 316 stainless steel was carried out with B-Ni2 brazing alloy (3 wt% Fe, 4.5 wt% Si, 3.2 wt% B, 7 wt% Cr, Ni-balance, m.p. 971-$999^{\circ}C$) to seal the NiO-YSZ anode/316 stainless steel interconnect structure in a SOFC. In the present research, interfacial (chemical) reactions during brazing at the NiO-YSZ/316 stainless steel interconnect were enhanced by the two processing methods, a) addition of an electroless nickel plate to NiO-YSZ as a coating or b) deposition of titanium layer onto NiO-YSZ by magnetron plasma sputtering method, with process variables and procedures optimized during the pre-processing. Brazing was performed in a cold-wall vacuum furnace at $1080^{\circ}C$. Post-brazing interfacial morphologies between NiO-YSZ and 316 stainless steel were examined by SEM and EDS methods. The results indicate that B-Ni2 brazing filler alloy was fused fully during brazing and continuous interfacial layer formation depended on the method of pre-coating NiO-YSZ. The inter-diffusion of elements was promoted by titanium-deposition: the diffusion reaction thickness of the interfacial area was reduced to less than 5 ${\mu}m$ compared to 100 ${\mu}m$ for electroless nickel-deposited NiO-YSZ cermet.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.2
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.7 no.6
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• pp.1056-1063
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• 2006

Thermal evaporated 10 nm-Ni/l nm-Ir/(or polycrystalline)p-Si(100) and 10 nm-$Ni_{50}Co_{50}$/(or polycrystalline)p-Si(100) films were thermally annealed using rapid thermal annealing fur 40 sec at $300{\sim}1200^{\circ}C$. The annealed bilayer structure developed into Ni(Ir or Co)Si and resulting changes in sheet resistance, microstructure, phase and composition were investigated using a four-point probe, a scanning electron microscopy, a field ion beam, an X-ray diffractometer and an Auger electron spectroscope. The final thickness of Ir- and Co-inserted nickel silicides on single crystal silicon was approximately 20$\sim$40 nm and maintained its sheet resistance below 20 $\Omega$/sq. after the silicidation annealing at $1000^{\circ}C$. The ones on polysilicon had thickness of 20$\sim$55 nm and remained low resistance up to $850^{\circ}C$. A possible reason fur the improved thermal stability of the silicides formed on single crystal silicon substrate is the role of Ir and Co in preventing $NiSi_2$ transformation. Ir and Co also improved thermal stability of silicides formed on polysilicon substrate, but this enhancement was lessened due to the formation of high resistant phases and also a result of silicon mixing during high temperature diffusion. Ir-inserted nickel silicides showed surface roughness below 3 nm, which is appropriate for nano process. In conclusion, the proposed Ir- and Co- inserted nickel silicides may be superior over the conventional nickel monosilicides due to improved thermal stability.

• Current Photovoltaic Research
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• v.8 no.2
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• pp.60-65
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• 2020

In perovskite solar cells with planar heterojunction configuration, selection of proper charge-transporting layers is very important to achieve stable and efficient device. Here, we developed solution processible Cu doped NiO_x (Cu:NiO_x) thin film as a hole-transporting layer (HTL) in p-i-n structured methylammonium lead trihalide (MAPbI₃) perovskite solar cell. The transmittance and thickness of NiO_x HTL is optimized by control the spin-coating rate and Cu is additionally doped to improve the surface morphology of undoped NiO_x thin film and hole-extraction properties. Consequently, a perovskite solar cell containing Cu:NiO_x HTL with optimal doping ratio of Cu exhibits a power conversion efficiency of 14.6%.

• Journal of Korea Foundry Society
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• v.22 no.1
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• pp.42-48
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• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.

• Journal of the Korean Magnetics Society
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• v.23 no.1
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• pp.12-17
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• 2013

Nanocrystalline nickel (Ni) tick films were synthesized by direct current electrodeposition at current density from 1 to $30mA/cm^2$ and pH = 4. The basic composition of the bath, which was prepared by dissolving Ni metal particles in HCl, was 0.2M Ni ions. The effects of the current density on the average grain size of Ni deposits were investigated by XRD and SEM techniques. The results showed that the surface roughness was decreased as the saccharin addition was increased up to 2 g/l. The experimental results showed that the increase in the current density had a considerable effect on the average grain size of the Ni deposits. The perpendicular magnetization was raised as the thickness of coating layer was increased.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.26 no.7
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• pp.522-527
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• 2013

In this paper, We studied the change of surface and variation of elements on both electrodes of hydrogen generator of alkaline electrolysis in use of FE-SEM and SIMS. We used the stainless steel 316(600 ${\mu}m$) as electrode in condition of 25%KOH, $60^{\circ}C$ Temperature. The results show that the intensity of elements (C, Si, P, S, Ti, Cr, Mn, Fe, Ni, Mo) of Positive Electrode are decreased as much as about $10^1{\sim}10^3 $than the original electrode. Thickness of Positive Electrode is decreased about 40 ${\mu}m$ after chemical reaction. The negative electrode, however, shows a slight variation in the intensity of elements (C, Si, P, Fe, Ni, Mn, Mo) but Change of thickness and surface' shape of electrode show nothing after chemical reaction. The change in thickness and variation of Stainless Steel 316 cause the lifetime of electrode to be shorted. We also observed hydrogen, oxygen, potassium in both electrodes. Especially, The potassium is increased in proportional with depth of positive electrode. this means the concentration of alkali solutions is changed. and so we have to supply alkaline solution to generator in order to produce same quantity of hydrogen gas continuously. we hope that this study gives a foundation to develop the electrode for hydrogen generator of alkaline electrolysis.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.15-20
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• 2007

Growth kinetics of intermetallic compound (IMC) at various interface in Cu pillar bump during aging have been studied by thermal aging at 120, 150 and $165^{\circ}C$ for 300h. In result, $Cu_6Sn_5\;and\;Cu_3Sn$ were observed in the Cu pillar/SnPb interface and IMC growth followed parabolic law with increasing aging temperatures and time. Also, growth kinetics of IMC layer was faster for higher aging temperature with time. Kirkendall void formed at interface between Cu pillar and $Cu_3Sn$ as well as within the $Cu_3Sn$ layer and propagated with increasing time. $(Cu,Ni)_6Sn_5$ formed at interface between SnPb and Ni(P) after reflow and thickness change of $(Cu,Ni)_6Sn_5$ didn't observe with aging time. The apparent activation energies for growth of total $(Cu_6Sn_5+Cu_3Sn),\;Cu_6Sn_5\;and\;Cu_3Sn$ intermetallics from measurement of the IMC thickness with thermal aging temperature and time were 1.53, 1.84 and 0.81 eV, respectively.

• Restorative Dentistry and Endodontics
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• v.29 no.5
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• pp.446-453
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• 2004

The aim of this study was to evaluate the shaping abilities of four different rotary nickel-titanium instruments with anticurvature motion to prepare root canal at danger zone by measuring the change of dentin thickness in order to have techniques of safe preparation of canals with nickel-titanium files. Mesiobuccal and mesiolingual canals of forty mesial roots of extracted human lower molars were instrumented using the crown-down technique with ProFile, $GT^{TM}$ Rotary file, Quantec file and $ProTaper^{TM}$. In each root, one canal was prepared with a straight up-and-down motion and the other canal was with an anticurvature motion. Canals were instrumented until apical foramens were up to size of 30 by one operator. The muffle system was used to evaluate the root canal preparation. After superimposing the pre- and post-instrumentation canal. change in root dentin thickness was measured at the inner and outer sides of the canal at 1. 3, and 5 mm levels from the furcation. Data were analyzed using two-way ANOVA. Root dentin thickness at danger zone was significantly thinner than that at safe zone at all levels (p < 0.05). There was no significant difference in the change of root dentin thickness between the straight up-and-down and the anticurvature motions at both danger and safe zones in all groups (p > 0.05). ProTaper removed significantly more dentin than other files especially at furcal 3 mm level of danger and safe zones (p < 0.05) Therefore, it was concluded that anticurvature motion with nickel-titanium rotary instruments does not seem to be effective in danger zone of lower molars.