• Electrical & Electronic Materials
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• v.3 no.4
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• pp.325-331
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• 1990

본 연구는 텅스텐 소결에 저온 활성제로 작용하는 Ni-P 공정합금을 미량첨가하여 제조공정의 간단화를 통한 새로운 W-Cu계 전기접점제조를 목표로 하였다. 이를 위해 1회 용침공정을 통해 제조한 W(Ni-P)-Cu 합금에 대한 전기접점특성을 조사하여 접점의 미세구조 관점에서 논의하였다. Ni-P 합금첨가한 접점은 기존의 순수 W-Cu 합금에 비해 낮은 접촉저항 및 낮은 아크소모를 나타내는 우수한 접점성능을 보여주었다. 이것은 Ni-P합금이 Cu용침이 개시되기전 짧은 승온단계에서 분말간의 강한 결합과 Cu용침에 유리한 기공통로를 갖는 W 분말 골격체의 형성을 유도하기 때문인 것으로 판단된다.

• Journal of the Korean institute of surface engineering
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• v.55 no.4
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• pp.202-214
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• 2022

Internal connections between device, package and external terminals for connecting packaging and printed circuit board are normally manufactured by electroless Ni-P plating followed by immersion Au plating (ENIG process) to ensure the connection reliability. In this study, a new non-cyanide-based immersion and electroless Au plating solutions using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated on different underlayer electroless Ni-P plating layers. As a result, it was confirmed that the deposition behavior and film properties of electroless Au plating are affected by grain size and impurity of the electroless Ni-P film, which is used as the plating underlayer. Au plating on the electroless Ni-P plating film with a dense surface structure showed the highest bonding strength. In addition, the electroless Au plating film on the Ni-P plating film has a smaller particle size exhibited higher bonding strength than that on the large particle size.

• Journal of Korean Society of Forest Science
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• v.99 no.3
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• pp.292-297
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• 2010

This study was carried out to provide preliminary data to purify contaminated sites by nickel (Ni). After rooted cuttings of Salix reichardtii had been grown in Ni solution (hydroponic culture), pH changes in the solution and the accumulated Ni amount in plant parts were measured and analyzed. When the Ni concentration was low enough for S. reichardtii cuttings to grow well, the pH value of the solution decreased considerably. As the Ni concentration got higher, the plant growth got poorer and the pH value decreased slowly. Roots accumulated the highest Ni amount. Leaves and stems followed after. When stems were older, the accumulated Ni amount was lower. more Ni was accumulated in the plant parts which had more flexible tissue and live cells. As the Ni concentration in solution got higher up to 50.0 ${\mu}mol$/L, so did the Ni accumulation in the plant parts. However, the plant individuals nearly died and the Ni accumulation tended to drop when the Ni concentration in solution was 100.0 ${\mu}mol$/L. The rooted cuttings of S. reichardtii grew poorer as the Ni concentration in solution got higher. The plants in solution with 100.0 ${\mu}mol$/L of Ni were practically dead in four weeks.

• Korean Journal of Materials Research
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• v.15 no.5
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• pp.318-322
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• 2005

Ti-capped NiSi contacts were formed on $p^+/n$ junctions to improve the leakage problem and then Cu was deposited without removing the Ti-capping layer in an attempt to utilize as a diffusion barrier. The electrical characteristics of these $p^+/n$ diodes with Cu/Ti/NiSi electrodes were measured as a function of drive-in RTA(rapid-thermal annealing) and silicidation temperature and time. When drive-in annealed at $900^{\circ}C$, 10 sec. and silicided at $500^{\circ}C$, 100 sec., the diodes showed the most excellent I-V characteristics. Especially, the leakage current was $10^{-10}A$, much lower than reported data for diodes with NiSi contacts. However, when the $p^+/n$ diodes with Cu/Ti/NiSi contacts were furnace-annealed at $400^{\circ}C$ for 40 min., the leakage current increased by 4 orders. The FESEM and AES analysis revealed that the Ti-capping layer effectively prohibited the Cu diffusion, but was ineffective against the NiSi dissociation and consequent Ni diffusion.

• Resources Recycling
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• v.12 no.3
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• pp.38-45
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• 2003

ionic equilbria of nickel chloride in hydrochloric acid solutions were analyzed by considering chemical equilibria, mass and charge balance equations. The activity coefficients of solutes were calculated by using Bromley equation. It was found that most of species containing nickel existed as $Ni^{2+}$ 와 $NiCl^{+}$. The mole fractions of nickel hydroxides were very low in the con-centration ranges considered in this study and the mole fraction of$Ni_4$ $(OH)_{4}^{4+}$ increased greatly with the pH of the solution. The pH values of $NiCl_2$ $-HCl-NaOH-H_2$O system at $25^{\circ}C$ calculated in this study agreed well with those experimentally measured up to ionic strength of 9.4m.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.12
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• pp.1140-1143
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• 2006

We report on the fabrication of P3HT-based thin-film transistors (TFTs) for liquid crystal display that consist of $NiO_x$, poly-vinyl phenol (PVP), and Ni for the source-drain (S/D) electrodes, gate dielectric layer, and gate electrode, respectively The $NiO_x$ S/D electrodes of which the work function is well matched to that of P3HT are deposited on a P3HT channel by electron-beam evaporation of NiO powder. The maximum saturation current of our P3HT-based TFT is about $15{\mu}A$ at a gate bias of -30 V showing a high field effect mobility of $0.079cm^2/Vs$ in the dark, and the on/off current ratio of our TFT is about $10^5$. It is concluded that jointly adopting $NiO_x$ for the S/D electrodes and PVP for gate dielectric realizes a high-quality P3HT-based TFT.

• Transactions of the Korean hydrogen and new energy society
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• v.25 no.4
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• pp.344-354
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• 2014

Activated charcoal supported nickel molybdenum carbide (carburized Ni-Mo/AC) catalysts were prepared by wet-impregnation followed by temperature-programmed carburization using 20% $CH_4/H_2$ gas. The effects of pH and initial Ni/Mo mole ratio during wet-impregnation step on the characteristics of the carburized Ni-Mo/AC catalysts were investigated using ICP, XRD, XPS, BET and $CO_2$-TPD techniques, and correlated with the catalytic activity of the carburized Ni-Mo/AC in methane dry reforming reaction. Comparison of the results of methane dry reforming reaction kinetics with the results of characterization of the carburized Ni-Mo/AC catalyst showed that the catalytic activity in methane dry reforming reaction was higher at higher initial Ni/Mo mole ratio or at lower pH(3~natural value). This phenomenon was related to the crystal size of metallic Ni in the carburized Ni-Mo/AC catalyst.

• Laser Solutions
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• v.4 no.2
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• pp.39-45
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• 2001

This paper introduces a cleaning process for removing submicron-sized particles from NiP hard disk substrates by the liquid-assisted laser cleaning technique. Measurements of cleaning Performance and time-resolved optical diagnostics are Performed to analyze the physical mechanism of contaminant removal. The results reveal that nanosecond laser pulses are effective for removing the contaminants regardless of the wavelength and that a thermal mechanism involving explosive vaporization of liquid dominates the cleaning process.

• Journal of the Korean Society for Heat Treatment
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• v.9 no.2
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• pp.79-90
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• 1996

Transmission electron microscopy(TEM) investigation on the phase decomposition of B2-ordered (Ni,Co)Al supersaturated with Ni and Co has revealed the precipitation of $(Ni,Co)_2Al$ which has not been expected from the reported equilibrium phase diagram. The $(Ni,Co)_2Al$ phase has a hexagonal struture and takes a rod-like shape with the long axis of the rod parallel to the <111> directions of the B2 matrix. By aging at temperatures below 873 K, a long period Superlattice Structure appears in the hexagonal $(Ni,Co)_2Al$ Phase. The orientation relationship between the $(Ni,Co)_2Al$ Precipitates and the B2-(Ni,Co)Al matrix is found to be$(0001)_p$ // $(111)_{B2}$ and $[\bar{1}2\bar{1}0]_P$ // $[\bar{1}10]_{B2}$, Where the suffix p and B2 denote the $(Ni,Co)_2Al$ precipitate and the B2-(Ni,Co)Al matrix, respectively. (Ni,Co)Al hardens appreciably by the fine precipitation of the $(Ni,Co)_2Al$ phase. Energy dispersive spectroscopy was used to analyze the compositions of each phase formed in B2-(Ni,Co)Al.

• Resources Recycling
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• v.15 no.3 s.71
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• pp.58-65
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• 2006

The applicability of the waste pulp which produced in the paper recycling process as an adsorbent for the treatment of $Ni^{2+}$ ion in wastewater has been investigated taking the initial concentration of adsorbate, temperature, the amount of adsorbent, and solution pH as the experimental variables. In addition, the effect of the concentration of coexisting solute and pre-treatment of adsorbent on the adsorbability of $Ni^{2+}$ ion were also examined. The electrokinetic potential of waste pulp was observed to be positive below pH 7.8 and negative above this pH. The adsorption reaction of $Ni^{2+}$ ion reached its equilibrium within 4 hours after the reaction was initiated and the adsorbed amount of adsorbate was found to increase with its initial concentration. The adsorbability of $Ni^{2+}$ was raised with temperature so that its adsorption reaction was considered to be exothermic, which was substantiated by thermodynamic calculation. Also, the adsorbed amount of $Ni^{2+}$ was raised with the amount of waste pulp and with pH in the range of pH $3{\sim}6$. This behavior of the adsorption of $Ni^{2+}$ according to the solution pH was well agreed with the electrokinetic characteristics of waste pulp in solution. The amount of coexisting solute was observed to reversely affect on the $Ni^{2+}$ adsorption onto waste pulp under the experimental conditions. With regard to the pre-treatment of adsorbent with NaOH, the adsorbability of $Ni^{2+}$ was increased with the concentration of NaOH to a certain extent. However, it was found to decrease contrarily when the concentration of NaOH became too high.