• 제목/요약/키워드: Ni-C alloy

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Effects of Ni and Si on the Matrix Structure and Graphite Formation in Fe-12Mn-3.5C Alloy (Fe-12Mn-3.5C 계주철(系鑄鐵)에서 기지조직(基地組織)과 흑연석출(黑鉛析出)에 미치는 Ni 및 Si 의 영향)

  • Ra, Hyong-Yong;Son, Won-Tak
    • Journal of Korea Foundry Society
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    • v.3 no.3
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    • pp.174-180
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    • 1983
  • The matrix changes and graphite formation in high manganese cast iron (Fe-12Mn-3.5C) are studied with increasing nickel and silicon content. Also, the decomposition of carbides and graphite precipitation are studied by adequate heat treatment.The results obtained in this work are as follows. 1. In high manganese cast iron, fine flakes graphite appeared by adding 5 wt% nickel and A-type flakes graphite can be obtained by adding 7 wt% nickel. 2. Nodular graphite are obtained by graphite spheroidizing treatment with same melt. 3. In high manganese cast iron containing 7 wt% nickel, full austenitic matrix with nodular graphite can be achieved by water quenching after 10 hours' solution heat treatment at $1050^{\circ}C$ in case of containing 2.0 wt% silicon, and 6 hours' at the same temperature in case of containing 2.5 wt% silicon.

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Microstructures and Textures of Electrodeposited Ni/Invar Bimetal (전주도금으로 제조된 Ni/Invar 바이메탈의 미세조직과 집합조직)

  • Kang, Ji Hoon;Seo, Jeong Ho;Park, Yong Bum
    • Korean Journal of Metals and Materials
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    • v.46 no.7
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    • pp.420-426
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    • 2008
  • By using electrodeposition, we developed a new method to produce Ni/Invar bimetal sheets, which have been used for the present study to investigate the texture evolution during annealing. The grains of electrodeposited Ni were columnar, while those of electrodeposited Fe-Ni alloy were nanocrystalline. These different parts of the bimetal underwent different evolution of textures and microstructures during annealing. In the nanocrystalline Invar, the as-deposited textures were of fiber-type characterized by strong <100>//ND and weak <111>//ND components, and the occurrence of grain growth resulted in the strong development of the <111>//ND fiber texture with the minor <100> // ND components. On the other hand, in the columnar-structured Ni part, the as-deposited <110>//ND fiber texture transformed to the <112>//ND fiber texture due to recrystallization occurring above $550^{\circ}C$. The development of microtextures which took place during annealing in the Ni/Invar interfacial regions was investigated by using the OIM analysis, and discussed in terms of the effect of atomic diffusion across the interfaces.

The Influence of W Addition on Cube Textured Ni Substrates for YBCO Coated Conductor (양축 정렬된 Ni 기판의 특성에 미치는 W 첨가의 효과)

  • Kim Kyu Tae;Lim Jun Hyung;Kim Jung Ho;Jang Seok Hern;Kim Ho-Jin;Joo Jinho;Kim Chan-Joong;Song Kyu Jung;Shin Hyung Sub
    • Progress in Superconductivity
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    • v.6 no.1
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    • pp.64-68
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    • 2004
  • We fabricated cube-textured Ni and Ni-W alloy substrates for coated conductors and characterized the effects of W addition on microstructure, mechanical strength, and magnetic properties of the substrate. Pure Ni and Ni-(2, 3, 5at.%)W alloys were prepared by plasma arc melting, heavily cold rolled and then annealed at various temperatures of $600-1300^{\circ}C$. The texture was evaluated by pole-figure and orientation distribution function (ODF) analysis. Mechanical properties were investigated by micro Vickers hardness and tension test. Ferromagnetism of the substrate was measured by physical property measurement system (PPMS). It was observed that Ni-W substrates had sharp cube texture, and the full-width at half-maximums (FWHMs) of in-plane texture was $^{\circ}$-5.57$4.42^{\circ}$, which is better than that of pure Ni substrate. In addition cube texture of Ni-W substrates was retained at higher temperature up to $1300^{\circ}C$. Microstructural observation showed that the Ni-W substrates had fine grain size and higher mechanical properties than the pure Ni substrate. These improvements are probably due to strengthening mechanisms such as solid solution hardening and/or grain size strengthening. PPMS analysis showed that addition of W effectively reduced saturation magnetization in applied magnetic field and Curie temperature.

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Thermally Stabilized Porous Nickel Support of Palladium Based Alloy Membrane for High Temperature Hydrogen Separation

  • Ryi, Shin-Kun;Park, Jong-Soo;Cho, Sung-Ho;Hwang, Kyong-Ran;Kim, Sung-Hyun
    • Corrosion Science and Technology
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    • v.6 no.3
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    • pp.133-139
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    • 2007
  • Nickel powder was coated with aluminum nitrate solution to increase the thermal stability of a porous nickel support and control the nickel content in the Pd-Cu-Ni ternary alloyed membrane. Raw nickel powder and alumina coated nickel powder were uniaxialy pressed by home made press with metal cylindrical mold. Though the used nickel powder prepared by pulsed wire evaporation (PWE) method has a good thermal stability, the porous nickel support was too much sintered and the pores of porous nickel support was plugged at high temperature (over $800^{\circ}C$) making it not suitable for the porous support of a palladium based composite membrane. In order to overcome this problem, the nickel powder was coated by alumina and alumina modified porous nickel support resists up to $1000^{\circ}C$ without pore destruction. Furthermore, the compositions of Pd-Cu-Ni ternary alloy membrane prepared by magnetron sputtering and Cu-reflow could be controlled by not only Cu-reflow temperature but also alumina coating amount. SEM analysis and mercury porosimeter analysis evidenced that the alumina coated on the surface of nickel powder interrupted nickel sintering.

The Densification Properties of Distaloy AE-TiC Cermet by Spark Plasma Sintering (방전 플라즈마 소결에 의한 Distaloy AE-TiC 써멧의 치밀화 특성)

  • Cho, Ho-Jung;Ahn, In-Shup;Lee, Young-Hee;Park, Dong-Kyu
    • Journal of Powder Materials
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    • v.14 no.4
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    • pp.230-237
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    • 2007
  • The fabrication of Fe alloy-40 wt.%TiC composite materials using spark plasma sintering process after ball-milling was studied. Raw powders to fabricate Fe alloy-TiC composite were Fe alloy, $TiH_{2}$ and activated carbon. Fe alloy powder was Distaloy AE (4%Ni-1%Cu-0.5%Mo-0.01%C-bal.%Fe) made by Hoeganes company with better toughness and lower melting point. These powders were ball-milled in horizontal attrition ball mill at a ball-to-powder weight ratio of 30 : 1. After that, these mixture powders were sintered by using spark plasma sintering apparatus for 5 min at $1200-1275^{\circ}C$ in vacuum atmosphere under $10^{-3}$ torr. DistaloyAE-40 wt.%TiC composite was directly synthesized by dehydrogenation and carburization reaction during sintering process. The phase transformation of as-milled powders and sintered materials was confirmed using X-ray diffraction (XRD) and transmission electron microscope (TEM). The density and harness materials was measured in order to confirm the densification behavior. In case of DistaloyAE-40 wt.%TiC composite retained for 5 min at $1275^{\circ}C$, it has the relative density of about 96% through the influence of rapid densification and fine TiC particle reinforced Fe-based composites materials.

The Study of Different Buffer Structure on Ni-W Tape for SmBCO Coated Conductor

  • Kim, T.H.;Kim, H.S.;Oh, S.S.;Ko, R.K.;Ha, D.W.;Song, K.J.;Lee, N.J.;Yang, J.S.;Jung, Y.H.;Youm, D.J.;Park, K.C.
    • Progress in Superconductivity and Cryogenics
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    • v.8 no.4
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    • pp.8-11
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    • 2006
  • High temperature superconducting coated conductor has various buffer structures on Ni-W alloy. We comparatively studied the growth conditions of a multi buffer layer $(CeO_2/YSZ/CeO_2)$ and a single buffer layer$(CeO_2)$ on textured Ni-W alloy tapes. XRD data showed that the qualities of in-plane and out-of-plane textures of the two type buffer structures were good. Also, we investigated the properties of SmBCO superconducting layer that was deposited on the two type buffer structure. The SmBCO superconducting properties on the single and multi buffer structure showed different critical current values and surface morphologies. FWHM of In-plane and out-of-plane textures were $7.4^{\circ},\;5.0^{\circ}$ in the top CeO2 layer of the multi-buffer layers of $CeO_2/YSZ/CeO_2$, and $7.3^{\circ},\;5.1^{\circ}$ in the $CeO_2$ single buffer layer. $1{\mu}m-thick$ SmBCO superconducting layers were deposited on two type buffer layer. $I_c$ of SmBCO deposited on single and multi buffer were 90 A/cm, 150 A/cm and corresponding $J_c$ were $0.9MA/cm^2,\;1.5MA/cm^2$ at 77K in self-field, respectively.

Corrosion Behavior of Austenitic Alloys in the Molten Salts of $LiCl-Li_2O_2$ ($LiCl-Li_2O_2$ 용융염계에서 오스테나이트계 합금의 부식거동)

  • 오승철;윤기석;임종호;조수행;박성원
    • Proceedings of the Korean Radioactive Waste Society Conference
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    • 2003.11a
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    • pp.373-378
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    • 2003
  • As a part of assessment of the structural material for the molten salt handling system, corrosion behavior of austenitic alloys, Fe-base and Ni-base in the molten salt of $LiCl-Li_2O_2$ was investigated in the range of temperature; 650~$725^{\circ}C$, time; 24- 168h, $Li_2O$; 3wt%, mixed gas; Ar-10%$O_2$. In the molten salt of $LiCl-Li_2O_2$, Ni-base alloys showed higher corrosion resistance than Fe-base alloys. Fe-base alloy with low Fe and high Ni contents exhibited better corrosion resistance. The scales of $Cr_2O_3$, $FeCr_2O_4$ on Fe-base alloys were showed, and $Cr_2O_3$, $NiFe_2O_4$ on Ni-base alloys were also showed.

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Interfacial disruption effect on multilayer-films/GaN : Comparative study of Pd/Ni and Ni/Pd films

  • 김종호;강희재;김차연;전용석;서재명
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.113-113
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    • 2000
  • 직접천이형 wide band gap(3.4eV) 반도체중의 하나인 GaN를 청색 및 자외선 laser diode, 고출력 전자장비 등으로 응용하기 위해서는 낮은 접합저항을 갖는 Ohmic contact이 선행되어야 한다. 그러나 만족할만한 p-type GaN의 Ohmic contact은 아직 실현되고 있지 못하며, 이는 GaN와 접합 금속과의 구체적인 반응의 연구를 필요로 한다. 본 연구에서 앞서 Pt, Pt, Ni등의 late transition metal을 p-GaN에 접합시킨 결과 이들은 접합 당시 비교적 평탄하나 후열 처리과정에서 비교적 낮은 온도에서 기판과 열팽창계수의 차이로 인하여 평탄성을 잃어버리면서 barrier height가 증가한다는 사실을 확인하였다. 따라서 본 연구에서는 이러한 열적 불안정성을 극복하기 위하여 Ni과 Pd를 차례로 증착하고 가열하면서 interfacial reaction, film morphology, Fermi level의 움직임을 monchromatic XPS(x-ray photoelectron spectroscopy) 와 SAM(scanning Auger microscopy) 그리고 ex-situ AFM을 이용하여 밝히고자 하였다. 특히 후열처리에 의한 계면 반응에 수반되는 구성 금속원소 간의 합금현상과 금속 층의 평탄성이 밀접한 관계가 있다는 것을 확인하였다. 이러한 합금과정에서 나타나는 금속원소들의 중심 준위의 이동을 체계적으로 규명하기 위해서 Pd1-xNix와 Pd1-xGax 합금들의 표준시료를 arc melting method로 만들어 농도에 따른 금속원소들의 중심 준위의 이동을 측정하여, Pd/Ni/p-GaN 및 Ni/Pd/p-GaN 계에서 열처리 온도에 따른 interfacial reaction을 확인하였다. 그 결과 두 계가 상온에서 nitride 및 alloy를 형성하지 않고 고르게 증착되고, 열처리 온도를 40$0^{\circ}C$에서 $650^{\circ}C$까지 증가시킴에 따라 계면반응의 부산물인 metallic Ga은 증가하고 있으마 nitride는 여전히 형성되지 않는 것을 확인하였다. 증착당시 Ni이 계면에 있는 Pd/Ni/p-GaN의 경우에는 52$0^{\circ}C$까지의 열처리에 의하여 Ni과 Pd가 골고루 섞이고 그 평탄성도 유지되고 barier height의 변화도 없었다. 더 높은 $650^{\circ}C$ 가열에 의해서는 surface free energy가 작은 Ga의 활발한 편석 현상으로 인해 표면은 Ga이 풍부한 Pd-Ga의 합금층으로 덮이고, 동시에 작은 pinhole들이 발생하며 barrier height도 0.3eV 가량 증가하게 된다. 반면에 증착당시 Pd이 계면에 있는 Ni/Pd/p-GaN의 경우에는 40$0^{\circ}C$의 가열까지는 두 금속이 그들 계면에서부터 섞이나, 52$0^{\circ}C$의 가열에 의해 이미 barrier height가 0.2eV 가량 증가하기 시작하였다. 더 높은 $650^{\circ}C$가열에 의해서는 커다란 pinhole, 0.5eV 가량의 barrier height 증가, Pd clustering이 동시에 관찰되었다. 따라서 Ni과 Pd의 일함수는 물론 thermal expansion coefficient가 거의 같으며 surface free energy도 거의 일치한다는 점을 감안하면, 이렇게 뚜렷한 열적 안정성의 차이는 GaN와 contact metal과의 반응시작 온도(disruption onset temperature)의 차이에 기인함을 알 수 있었다. 즉 계면에서의 반응에 의해 편석되는 Ga에 의해 박막의 strain이 이완되면, pinhole 등의 박막결함이 줄어 들고, 이는 계면의 N의 out-diffusion을 방지하여 p-type GaN의 barrier height 증가를 막게 된다.

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A Study on Silicon Nitride Based Ceramic Cutting Tool Materials

  • Park, Dong-Soo
    • Tribology and Lubricants
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    • v.11 no.5
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    • pp.78-86
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    • 1995
  • The silicon nitride based ceramic cutting tool materials have been fabricated by gas pressure sintering (GPS) or hot pressing (HP). Their mechanical properties were measured and the effect of the fabrication variables on the properties were examined. Also, effect of adding TiN or TiC particulates on the mechanical properties of the silicon nitride ceramics were investigated. Ceramic cutting tools (ISO 120408) were made of the sintered bodies. Cutting performance test were performed on either conventional or NC lathe. The workpieces were grey cast iron, hardened alloy steel (AISI 4140, HRc>60) and Ni-based superalloy (Inconel 718). The results showed that fabrication variables, namely, sintering temperature and time, exerted a strong influence on the microstincture and mechanical properties of the sintered body, which, however, did not make much difference in wear resistance of the tools. High hardness of the tool containing TiC particulates exhibited good cutting performance. Extensive crater wear was observed on both monolithic and TiN-containing silicon nitride tools after cutting the hardened alloy steel. Inconel 718 was extremely difficult to cut by the current cutting tools.

The electrical properties of Ni/Cr/Si thin film with sputtering process parameters (스퍼터링 조건변화에 따른 Ni/Cr/Si 박막의 전기적 특성)

  • Lee, Boong-Joo;Park, Gu-Bum;Kim, Byung-Soo;Lee, Duck-Chool
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.52 no.2
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    • pp.56-60
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    • 2003
  • In this work, we have fabricated thin film resistors using the DC/RF magnetron sputter of 51wt%Ni-41wt%Cr-8wt%Si alloy target and studied the effect of the process parameters on the electrical properties. In fabrication process, sputtering power, substrate temperature and annealing temperature have been varied as controllable parameters. TCR decreases with increasing the substrate temperature, but TCR increases over 300 [$^{\circ}C$]. The films are annealed to 400 [$^{\circ}C$] in air atmosphere, TCR increases with increasing the annealing temperature. The resistivity was 172 [${\mu}{\Omega}{\cdot}cm$] and 209 [${\mu}{\Omega}{\cdot}cm$] for the RF and DC as a sputtering power sources, respectively. Also, TCR was -52 [$ppm/^{\circ}C$] and -25 [$ppm/^{\circ}C$]. As a results of them, it is suggested that the sheet resistance and TCR of thin films can be controlled by variation of sputter process parameter and annealing of thin film.